Thermal Properties | Metric | English | Comments |
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Glass Transition Temp, Tg | 130 °C | 266 °F | Cured |
Resin Technology Group EN 239-2 Cationic UV Cure Epoxy Adhesive EN 239-2 is an epoxy-based, medium viscosity, cationic- curable adhesive/sealant. This product is activated by exposure to medium intensity UV radiation resulting in a high strength, chemical resist.. |
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Glass Transition Temp, Tg | 130 °C | 266 °F | TMA; IPC-TM-650.2.4.24c |
Park Electrochemical Nelco® N4000-2 Multifunctional Epoxy Laminate and Prepreg The Nelco® N4000-2 is the most established material of Nelco’s product line. This multifunctional epoxy laminate and prepreg system has a long history of use and one of the broadest operating and .. |
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Glass Transition Temp, Tg | 130 °C | 266 °F | Tg |
Industrial Laminates/Norplex NP130HF Glass Fabric Description: High flexural, impact and tensile strength glass fabric epoxy laminate, especially in the machine direction. Engineered to provide better physical properties than NEMA FR-4. More dimens.. |
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Glass Transition Temp, Tg | 130 °C | 266 °F | Tg |
Industrial Laminates/Norplex NP510A Glass Fabric Description: Woven glass fabric epoxy laminate. Engineered to provide NEMA grade FR-4 properties. This material contains bromine on the epoxy resin backbone. Certifiable to MIL-I-24768/27, Type GEE-.. |
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Glass Transition Temp, Tg | 130 - 135 °C | 266 - 275 °F | |
Master Bond EP65HT Fast Setting Epoxy Resists High Temperatures Description: Master Bond EP65HT represents a highly innovative advance in epoxy technology in that it features the unusual combination of very fast cures and high temperature resistance. While typic.. |
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Glass Transition Temp, Tg | 130 °C | 266 °F | Ultimate Tg; TMA |
Tra-Con Tra-Bond 526W01 Microelectronics Grade Encapsulant TRA-BOND 526W01 is a one component micro-electronics grade controlled flow encapsulant designed to protect wire bonds and bare die. TRA-BOND 526W01 has a low coefficient of thermal expansion and low.. |
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Glass Transition Temp, Tg | 130 °C | 266 °F | |
Hexcel® HexPly® EH04 Epoxy Resin System HexPly® EH04 is a modified epoxy resin system specifically designed for bladder molding or sheet wrap tube applications. Unique chemistry provides full cured parts in only 3 minutes at 138°C.Appli.. |
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Glass Transition Temp, Tg | 130 °C | 266 °F | Ultimate Tg |
Tra-Con Tra-Bond F202 Spectrally Transparent High Temperature Epoxy Adhesive TRA-BOND F202 is a clear, low viscosity epoxy adhesive recommended for photonic applications requiring exposure to high temperatures or chemical and environmental resistance. This 100% solids system.. |
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Glass Transition Temp, Tg | 130 °C | 266 °F | |
Loctite® 3563 Epoxy Snap Cure Underfill COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
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Glass Transition Temp, Tg | >= 130 °C | >= 266 °F | Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—300°C @ 20°C/Min |
Epoxy Technology EPO-TEK® EE149-6 Epoxy Material Description: A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.Information Provi.. |
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Glass Transition Temp, Tg | >= 130 °C | >= 266 °F | |
Epoxyset Epoxibond EB-115 Unfilled Epoxy Adhesive A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc... |
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Glass Transition Temp, Tg | >= 130 °C | >= 266 °F | |
Epoxyset Epoxibond EB-119M Unfilled Epoxy Adhesive A two-component,unfilled, low viscosity, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by.. |
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Glass Transition Temp, Tg | 130 °C | 266 °F | |
Armstrong A-706 Epoxy Adhesive A one-component, gray, aluminum-filled, thixotropic, non-sag epoxy adhesive. A-706 has an in-service temperature range to 400°F, but requires 350°F minimum cure temperature. Features excellent m.. |
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Glass Transition Temp, Tg | 130 °C | 266 °F | Cured property; Perkin Elmer TMS-2 |
Aptek 6103-A/B Epoxy Encapsulant Optoelectronic grade, reddish black encapsulant for IR LED discreets. Transparent to IR light while blocking out visible light.Part A is deep red. Part B is clear to pale yellow.Information provided.. |
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Glass Transition Temp, Tg | 130 °C | 266 °F | 10°C/min |
Arkema Group Cristamid® MS 1300 Semi-Aromatic Nylon (PASA) (Dry) Designation ISO 1874-PA12/xx,MR,12-020Semi-aromatic polyamide (PASA) grade for injection molding and tubes extrusion.Transparency even thick. High resistance to environmental stress cracking. Good t.. |
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Glass Transition Temp, Tg | 130 °C | 266 °F | TMA; IPC TM-650 2.4.24 |
Arlon GenClad™ 280 Low Loss Thermoset Bond-Ply Low loss Ceramic-Filled Thermoset/Thermoplastic Hybrid SystemRivals PTFE laminate electrical performance in a Halogen-Free systemLight weight material relative to standard laminate materialsOptimal .. |
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Glass Transition Temp, Tg | 130 °C | 266 °F | DSC; IPC TM-650 2.4.25 |
Arlon 47N Quick Cure Epoxy Low-Flow Prepreg 47N is a low-flow epoxy prepreg engineered for binding multilayer epoxy rigid-flex or attaching heat sinks to multilayer PCBs. An optional low lamination temperature protects components already mou.. |