Polymer Property : Glass Transition Temp, Tg = 130 °C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Glass Transition Temp, Tg	130 °C	266 °F	Cured
Resin Technology Group EN 239-2 Cationic UV Cure Epoxy Adhesive EN 239-2 is an epoxy-based, medium viscosity, cationic- curable adhesive/sealant. This product is activated by exposure to medium intensity UV radiation resulting in a high strength, chemical resist..
Glass Transition Temp, Tg	130 °C	266 °F	TMA; IPC-TM-650.2.4.24c
Park Electrochemical Nelco® N4000-2 Multifunctional Epoxy Laminate and Prepreg The Nelco® N4000-2 is the most established material of Nelco’s product line. This multifunctional epoxy laminate and prepreg system has a long history of use and one of the broadest operating and ..
Glass Transition Temp, Tg	130 Â°C	266 Â°F	Tg
Industrial Laminates/Norplex NP130HF Glass Fabric Description: High flexural, impact and tensile strength glass fabric epoxy laminate, especially in the machine direction. Engineered to provide better physical properties than NEMA FR-4. More dimens..
Glass Transition Temp, Tg	130 Â°C	266 Â°F	Tg
Industrial Laminates/Norplex NP510A Glass Fabric Description: Woven glass fabric epoxy laminate. Engineered to provide NEMA grade FR-4 properties. This material contains bromine on the epoxy resin backbone. Certifiable to MIL-I-24768/27, Type GEE-..
Glass Transition Temp, Tg	130 - 135 °C	266 - 275 °F
Master Bond EP65HT Fast Setting Epoxy Resists High Temperatures Description: Master Bond EP65HT represents a highly innovative advance in epoxy technology in that it features the unusual combination of very fast cures and high temperature resistance. While typic..
Glass Transition Temp, Tg	130 °C	266 °F	Ultimate Tg; TMA
Tra-Con Tra-Bond 526W01 Microelectronics Grade Encapsulant TRA-BOND 526W01 is a one component micro-electronics grade controlled flow encapsulant designed to protect wire bonds and bare die. TRA-BOND 526W01 has a low coefficient of thermal expansion and low..
Glass Transition Temp, Tg	130 °C	266 °F
Hexcel® HexPly® EH04 Epoxy Resin System HexPly® EH04 is a modified epoxy resin system specifically designed for bladder molding or sheet wrap tube applications. Unique chemistry provides full cured parts in only 3 minutes at 138°C.Appli..
Glass Transition Temp, Tg	130 °C	266 °F	Ultimate Tg
Tra-Con Tra-Bond F202 Spectrally Transparent High Temperature Epoxy Adhesive TRA-BOND F202 is a clear, low viscosity epoxy adhesive recommended for photonic applications requiring exposure to high temperatures or chemical and environmental resistance. This 100% solids system..
Glass Transition Temp, Tg	130 °C	266 °F
Loctite® 3563 Epoxy Snap Cure Underfill COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp..
Glass Transition Temp, Tg	>= 130 °C	>= 266 °F	Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—300°C @ 20°C/Min
Epoxy Technology EPO-TEK® EE149-6 Epoxy Material Description: A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.Information Provi..
Glass Transition Temp, Tg	>= 130 °C	>= 266 °F
Epoxyset Epoxibond EB-115 Unfilled Epoxy Adhesive A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc...
Glass Transition Temp, Tg	>= 130 °C	>= 266 °F
Epoxyset Epoxibond EB-119M Unfilled Epoxy Adhesive A two-component,unfilled, low viscosity, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by..
Glass Transition Temp, Tg	130 °C	266 °F
Armstrong A-706 Epoxy Adhesive A one-component, gray, aluminum-filled, thixotropic, non-sag epoxy adhesive. A-706 has an in-service temperature range to 400°F, but requires 350°F minimum cure temperature. Features excellent m..
Glass Transition Temp, Tg	130 °C	266 °F	Cured property; Perkin Elmer TMS-2
Aptek 6103-A/B Epoxy Encapsulant Optoelectronic grade, reddish black encapsulant for IR LED discreets. Transparent to IR light while blocking out visible light.Part A is deep red. Part B is clear to pale yellow.Information provided..
Glass Transition Temp, Tg	130 °C	266 °F	10°C/min
Arkema Group Cristamid® MS 1300 Semi-Aromatic Nylon (PASA) (Dry) Designation ISO 1874-PA12/xx,MR,12-020Semi-aromatic polyamide (PASA) grade for injection molding and tubes extrusion.Transparency even thick. High resistance to environmental stress cracking. Good t..
Glass Transition Temp, Tg	130 °C	266 °F	TMA; IPC TM-650 2.4.24
Arlon GenClad™ 280 Low Loss Thermoset Bond-Ply Low loss Ceramic-Filled Thermoset/Thermoplastic Hybrid SystemRivals PTFE laminate electrical performance in a Halogen-Free systemLight weight material relative to standard laminate materialsOptimal ..
Glass Transition Temp, Tg	130 °C	266 °F	DSC; IPC TM-650 2.4.25
Arlon 47N Quick Cure Epoxy Low-Flow Prepreg 47N is a low-flow epoxy prepreg engineered for binding multilayer epoxy rigid-flex or attaching heat sinks to multilayer PCBs. An optional low lamination temperature protects components already mou..