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Arlon 47N Quick Cure Epoxy Low-Flow Prepreg

Category	Polymer , Thermoset , Epoxy , Epoxy, Thermally Conductive
Manufacturer	Arlon
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Arlon 47N Quick Cure Epoxy Low-Flow Prepreg.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

47N is a low-flow epoxy prepreg engineered for binding multilayer epoxy rigid-flex or attaching heat sinks to multilayer PCBs. An optional low lamination temperature protects components already mounted on the PCB.Tetrafunctional modified epoxy resin system with a Tg of 130°C.Optimized bond to aluminum and copper heat sinks - typical lap shear 1000 psiCure temperature as low as 150°CEngineered with discrete flow ranges and fiberglass styles for optimal process flexibilityElectrical and mechanical properties meeting the requirements of IPC-4101/21, modified to be "Low-Flow"RoHS/WEEE compliantCost competitive for high volume commercial applicationsTypical Applications:Bonding multilayer epoxy rigid-flexAttaching heat sinks to multilayer PCBsDielectric insulators|This data represents typical values for the production material and should not be used as material specifications.Information provided by ARLON Silicone Technologies Division.

Physical Properties	Metric	English	Comments
Density	1.75 g/cc	0.0632 lb/in³	ASTM D792 Method A
Water Absorption	0.10 %	0.10 %	IPC TM-650 2.6.2.1

Mechanical Properties	Metric	English	Comments
Modulus of Elasticity	17.9 GPa	2600 ksi	IPC TM-650 2.4.18.3
Poissons Ratio	0.17	0.17	ASTM D3039
Peel Strength	1.58 kN/m	9.00 pli	After Thermal Stress; IPC TM-650 2.4.8

Thermal Properties	Metric	English	Comments
CTE, linear	15.0 - 17.0 µm/m-°C	8.33 - 9.44 µin/in-°F	IPC TM-650 2.4.41
CTE, linear, Transverse to Flow	85.0 µm/m-°C @Temperature <=130 °C	47.2 µin/in-°F @Temperature <=266 °F	z direction; IPC TM-650 2.4.24
Thermal Conductivity	0.250 W/m-K	1.74 BTU-in/hr-ft²-°F	ASTM E1461
Glass Transition Temp, Tg	130 °C	266 °F	DSC; IPC TM-650 2.4.25
Decomposition Temperature	295 °C	563 °F	Onset; IPC TM-650 2.3.41
	315 °C	599 °F	5 percent; IPC TM-650 2.3.41
Flammability, UL94	V-0	V-0

Electrical Properties	Metric	English	Comments
Volume Resistivity	5.10e+13 ohm-cm	5.10e+13 ohm-cm	C96/35/90; IPC TM-650 2.5.17.1
	7.40e+13 ohm-cm	7.40e+13 ohm-cm	E24/125; IPC TM-650 2.5.17.1
Surface Resistance	1.50e+12 ohm	1.50e+12 ohm	E24/125; IPC TM-650 2.5.17.1
	8.80e+12 ohm	8.80e+12 ohm	C96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant	4.3 @Frequency 1.00e+6 Hz	4.3 @Frequency 1.00e+6 Hz	IPC TM-650 2.5.5.3
Dielectric Strength	39.4 kV/mm	1000 kV/in	IPC TM-650 2.5.6.2
Dissipation Factor	0.022 @Frequency 1.00e+6 Hz	0.022 @Frequency 1.00e+6 Hz	IPC TM-650 2.5.5.3

Descriptive Properties	Value	Comments
IPC Delamination - T260 (minutes)	18	IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes)	0
IPC Delamination - T300 (minutes)	0

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