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Epoxyset Epoxibond EB-119M Unfilled Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Epoxyset
Trade Name Epoxibond
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxyset Epoxibond EB-119M Unfilled Epoxy Adhesive.pdf
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Material Notes:
A two-component,unfilled, low viscosity, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc.
Physical Properties Metric English Comments
Density 1.14 g/cc
0.0412 lb/in³
Viscosity 800 - 1200 cP
800 - 1200 cP
Mechanical Properties Metric English Comments
Hardness, Shore D 91
91
ASTM D2240
Adhesive Bond Strength 15.2 MPa
2200 psi
Lap Shear Strength
Thermal Properties Metric English Comments
CTE, linear >= 50.0 µm/m-°C
>= 27.8 µin/in-°F
Maximum Service Temperature, Air 230 °C
446 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Glass Transition Temp, Tg >= 130 °C
>= 266 °F
Optical Properties Metric English Comments
Refractive Index 1.57
1.57
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
60.0 min

@Temperature 100 °C
1.00 hour

@Temperature 212 °F
Pot Life >= 360 min
>= 360 min
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