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Atom Adhesives AA-BOND FDA15 Epoxy Adhesive

Category Polymer , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Atom Adhesives
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Atom Adhesives AA-BOND FDA15 Epoxy Adhesive.pdf
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Material Notes:
AA-BOND FDA15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administration Chapter 1, Sub Part B, Sections 175.105 and 175.300. AA-BOND FDA15 is two-part adhesive is used for bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment, and by manufacturers of catheters, hearing aids, dental products and other biomedical instruments and devices. AA-BOND FDA15 is an effective electrical insulator, and it provides low permeability to gases and vapors and good resistance to water, weather, galvanic action, to petroleum solvents, lubricants and fuels, to mild acids and alkalis, and to many other organic and inorganic compounds.Appearance: Clear Cure Type: Heat cure or Room TemperatureBenefits:Low viscosityEffective electrical insulatorLow permeabilityGood resistance Mix Ratio by weight: 100:20/Resin:Hardener Substrates: Most metals, ceramic, glass and plasticsTypical Application: Developed for bonding and coating applications.Information provided by Atom Adhesives
Physical Properties Metric English Comments
Specific Gravity 1.16 g/cc
1.16 g/cc
uncured
Solids Content 100 %
100 %
reactive, uncured
Volatile Organic Compounds (VOC) Content 3.0 g/l
3.0 g/l
uncured
Viscosity 4500 cP
4500 cP
uncured
Mechanical Properties Metric English Comments
Hardness, Shore D 88
88
Elongation at Yield 4.0 %
4.0 %
Shear Strength 13.8 MPa
2000 psi
Lap, Alum to Alum
Thermal Properties Metric English Comments
CTE, linear 55.1 µm/m-°C
30.6 µin/in-°F
Maximum Service Temperature, Air 140 °C
284 °F
Minimum Service Temperature, Air -70.0 °C
-94.0 °F
Glass Transition Temp, Tg 100 °C
212 °F
Electrical Properties Metric English Comments
Volume Resistivity 2.00e+14 ohm-cm
2.00e+14 ohm-cm
Dielectric Constant 4.3

@Frequency 1000 Hz
4.3

@Frequency 1000 Hz
Dielectric Strength 16.5 kV/mm
420 kV/in
Dissipation Factor 0.020

@Frequency 1000 Hz
0.020

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 60.0 - 240 min

@Temperature 65.0 °C
1.00 - 4.00 hour

@Temperature 149 °F
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Pot Life 25.0 min
25.0 min
uncured
Descriptive Properties Value Comments
Thixotropic Index 1
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