Physical Properties | Metric | English | Comments |
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Viscosity | 35000 cP | 35000 cP | |
Ritelok PS65 General Purpose Pipe Sealant Anaerobic. Pipe sealant for coarse threads. PS65 withstands temperatures from 65°F to 300°F (55°C-150°C), dismantled using normal tools |
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Viscosity | 35000 cP | 35000 cP | Thixotropic |
ND Industries 533 Retaining Compound High strength sealing applications for non migration material |
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Viscosity | 35000 cP @Temperature 25.0 °C |
35000 cP @Temperature 77.0 °F |
TA Rheometer |
Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant LORD Thermosetâ„¢ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devi.. |
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Viscosity | 35000 - 50000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
35000 - 50000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C1991025D2 Gold Ink Gold Ink C1991025D2 is a fritted system that has been designed as a screen printing ink for uses on alumina. It is also suitable for firing onto other high temperature substrates. This product shou.. |
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Viscosity | 35000 - 45000 cP | 35000 - 45000 cP | |
Master Bond UV10TKMed One component UV curable, biocompatible, high viscosity compound Product Description: Master Bond UV10TKMed is a higher viscosity, one part UV system for bonding, sealing and coating that passes USP Class VI testing along with ISO 10993-5 for cytotoxicity. It has.. |
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Viscosity | 35000 cP | 35000 cP | Mixed (cp #52, 10 rpm) |
Tra-Con Tra-Bond 716K02 Thixotropic Adhesive 716K02 is a more thixotropic version of FDA2T. Information provided by Tra-Con Inc. |
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Viscosity | 35000 cP @Temperature 25.0 °C |
35000 cP @Temperature 77.0 °F |
Mixed |
Trelleborg Emerson & Cuming Stycast® 5954 Two-Component Silicone High Service Temp Encapsulant Features and Typical ApplicationsAbility to withstand high temperatures, thermal shock, and chemical exposure. These products are designed for heat generating electronic devices which operate in har.. |
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Viscosity | 35000 - 45000 cP @Temperature 23.0 °C |
35000 - 45000 cP @Temperature 73.4 °F |
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Master Bond EP30HT High Temperature Resistant Two Component Epoxy System Master Bond Polymer Adhesive EP30HT is a medium viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, w.. |
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Viscosity | 35000 cP @Temperature 25.0 °C |
35000 cP @Temperature 77.0 °F |
After mixing |
Tra-Con Tra-Bond 2125 Rigid Syntactic Repair Adhesive TRA-BOND 2125 is a medium viscosity, low density syntactic foam epoxy formulation developed for industrial, electronic and aerospace honeycomb, fillet, edge-fill, contour repair, bonding and casting.. |
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Viscosity | 35000 cP | 35000 cP | Hardener |
Tra-Con Tra-Bond F120 Fast Cure Epoxy Adhesive TRA-BOND F120 is a two-part, medium viscosity adhesive developed for high performance fiber optic and optical bonding applications. It is easily mixed and gels within minutes at room temperature for.. |
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Viscosity | 35000 cP @Temperature 25.0 °C |
35000 cP @Temperature 77.0 °F |
After mixing |
Tra-Con Tra-Cast 9182A Semi-Rigid Flame Retardant Epoxy Encapsulant TRA-CAST 9182A is a medium viscosity, flame retardant epoxy encapsulant. It adheres well to most electronic and aerospace-industry materials like metals, glass, ceramic, industrial laminates and rig.. |
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Viscosity | 35000 cP | 35000 cP | |
Loctite® 5140 RTV Potting PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies. For .. |
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Viscosity | 35000 cP | 35000 cP | mixing, dynamic |
Dow Corning SILASTIC® T-4 RTV SILICONE RUBBER BASE & CURING AGENT Translucent, high tear strength moldmaking rubber featuring fast cure. Suited for prototype design and production tooling. Silastic T-4 is recommended for use with rigid polyurethane and can be used.. |
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Viscosity | 35000 cP | 35000 cP | mixing, dynamic |
Dow Corning SILASTIC® T-4 RTV SILICONE RUBBER BASE & T-4 O CURING AGENT Translucent, oil bleeding high strength silicone mold making rubber that features high tear with fast cure. Suited for prototype design and production tooling. Silastic T-4 O is recommended for use .. |
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Viscosity | 35000 - 55000 cP | 35000 - 55000 cP | |
Epoxyset Epoxiohm EO-98HT Electrically Conductive Epoxy Adhesive EO-98HT is a one component, electrically and thermally conductive, snap cure, die attach epoxy. It was designed for IC plastic packaging of semiconductors, hybrid micro-electronics, and photonic dev.. |
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Viscosity | 35000 cP | 35000 cP | Thixotropic Gel |
Dymax 9-20513 Conformal Coating/Wire Tacking/Masking Disk Drive Adhesive Disk Drive AdhesivesLow Outgassing Multi-Cure® Memory Saver Disk Drive AdhesivesDescriptionDymax offers a range of advanced formula epoxy and acrylic adhesives for disk drive assembly. UV cures in .. |
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Viscosity | 35000 cP | 35000 cP | catalyzed with Moldmaster Blue |
ACC QM 2128 QSI Quantum Silicones 28 Durometer Condensation Cure Moldmaking Material QM 2128 is a two-component, room temperature condensation cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is an excellent ch.. |
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Viscosity | 35000 cP | 35000 cP | catalyzed with Moldmaster Red |
ACC QM 2128 QSI Quantum Silicones 28 Durometer Condensation Cure Moldmaking Material QM 2128 is a two-component, room temperature condensation cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is an excellent ch.. |
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Viscosity | 35000 cP | 35000 cP | catalyzed with Moldmaster Purple |
ACC QM 2128 QSI Quantum Silicones 28 Durometer Condensation Cure Moldmaking Material QM 2128 is a two-component, room temperature condensation cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is an excellent ch.. |
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Viscosity | 35000 cP | 35000 cP | Base |
ACC QM 2128 QSI Quantum Silicones 28 Durometer Condensation Cure Moldmaking Material QM 2128 is a two-component, room temperature condensation cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is an excellent ch.. |
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Viscosity | 35000 cP | 35000 cP | Mixed Viscosity |
Aremco Aremco-Bond™ 570 High Performance Epoxide Aremco-Bond 570 is a contact adhesive. Apply .015" to each part, allow solvents to flash for 20 minutes, then clamp parts together for curing.Single-Part Contact Adhesive, Excellent Flexibility |
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Viscosity | 35000 cP | 35000 cP | Base |
ACC QM 2125 QSI Quantum Silicones 25 Durometer Condensation Cure Moldmaking Material QM 2125 is a two-component, room temperature condensation cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is an excellent ch.. |
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Viscosity | 35000 cP | 35000 cP | catalyzed with QM 262B |
ACC QM 262 QSI Quantum Silicones 60 Durometer Addition Cure Moldmaking Material QM262 is a two component, room temperature, addition cure silicone material. The cured rubber has excellent mechanical properties, good shelf-life stability, excellent physical properties and resin .. |
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Viscosity | 35000 cP | 35000 cP | |
Aremco Aremco-Bond™ 2320 High Performance Epoxide Toughened, Unfilled, Fast-Setting, BPA Free, 2:1, High Peel & Shear Strength |
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Viscosity | 35000 - 55000 cP | 35000 - 55000 cP | |
Aremco Ceramabond™ 890 High Temperature Ceramic Adhesive/Paste, Silicon Carbide Filled Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and.. |
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Viscosity | 35000 - 45000 cP | 35000 - 45000 cP | |
Master Bond UV15X-6NONMED-2 Abrasion Resistant UV Curable Compound Description: Master Bond Polymer System UV15X-6NONMED-2 is a newly developed one component clear, non-yellowing, UV curable urethane elastomer system possessing high flexibility and abrasion resista.. |