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Polymer Property : Viscosity = 35000 cP Product List

Physical Properties

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Physical Properties Metric English Comments
Viscosity 35000 cP
35000 cP
Ritelok PS65 General Purpose Pipe Sealant
Anaerobic. Pipe sealant for coarse threads. PS65 withstands temperatures from 65°F to 300°F (55°C-150°C), dismantled using normal tools
Viscosity 35000 cP

@Temperature 25.0 °C
35000 cP

@Temperature 77.0 °F
TA Rheometer
Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant
LORD Thermosetâ„¢ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devi..
Viscosity 35000 - 50000 cP

@Shear Rate 230 1/s,
Temperature 25.0 °C
35000 - 50000 cP

@Shear Rate 230 1/s,
Temperature 77.0 °F
Haake VT 550 PK1.1°
Gwent Electronic Materials C1991025D2 Gold Ink
Gold Ink C1991025D2 is a fritted system that has been designed as a screen printing ink for uses on alumina. It is also suitable for firing onto other high temperature substrates. This product shou..
Viscosity 35000 - 45000 cP
35000 - 45000 cP
Master Bond UV10TK40 UV Curable Compound Has Gap Filling Properties
Description: Master Bond UV10TK40 is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties, chemical resistance and high gl..
Viscosity 35000 cP
35000 cP
Mixed (cp #52, 10 rpm)
Tra-Con Tra-Bond 716K02 Thixotropic Adhesive
716K02 is a more thixotropic version of FDA2T. Information provided by Tra-Con Inc.
Viscosity 35000 cP

@Temperature 25.0 °C
35000 cP

@Temperature 77.0 °F
Mixed
Trelleborg Emerson & Cuming Stycast® 4952/25 Two-Component Silicone High Service Temp Encapsulant
Features and Typical ApplicationsAbility to withstand high temperatures, thermal shock, and chemical exposure. These products are designed for heat generating electronic devices which operate in har..
Viscosity 35000 cP

@Temperature 25.0 °C
35000 cP

@Temperature 77.0 °F
Mixed
Trelleborg Emerson & Cuming Stycast® 5954 Two-Component Silicone High Service Temp Encapsulant
Features and Typical ApplicationsAbility to withstand high temperatures, thermal shock, and chemical exposure. These products are designed for heat generating electronic devices which operate in har..
Viscosity 35000 cP

@Temperature 25.0 °C
35000 cP

@Temperature 77.0 °F
After mixing
Tra-Con Tra-Bond 2125 Rigid Syntactic Repair Adhesive
TRA-BOND 2125 is a medium viscosity, low density syntactic foam epoxy formulation developed for industrial, electronic and aerospace honeycomb, fillet, edge-fill, contour repair, bonding and casting..
Viscosity 35000 cP
35000 cP
Hardener
Tra-Con Tra-Bond F120 Fast Cure Epoxy Adhesive
TRA-BOND F120 is a two-part, medium viscosity adhesive developed for high performance fiber optic and optical bonding applications. It is easily mixed and gels within minutes at room temperature for..
Viscosity 35000 cP
35000 cP
mixing, dynamic
Dow Corning SILASTIC® T-4 RTV SILICONE RUBBER BASE & CURING AGENT
Translucent, high tear strength moldmaking rubber featuring fast cure. Suited for prototype design and production tooling. Silastic T-4 is recommended for use with rigid polyurethane and can be used..
Viscosity 35000 cP
35000 cP
Thixotropic Gel
Dymax 9-20513 Conformal Coating/Wire Tacking/Masking Disk Drive Adhesive
Disk Drive AdhesivesLow Outgassing Multi-Cure® Memory Saver Disk Drive AdhesivesDescriptionDymax offers a range of advanced formula epoxy and acrylic adhesives for disk drive assembly. UV cures in ..
Viscosity 35000 cP
35000 cP
catalyzed with Moldmaster Blue
ACC QM 2128 QSI Quantum Silicones 28 Durometer Condensation Cure Moldmaking Material
QM 2128 is a two-component, room temperature condensation cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is an excellent ch..
Viscosity 35000 cP
35000 cP
catalyzed with Moldmaster Red
ACC QM 2128 QSI Quantum Silicones 28 Durometer Condensation Cure Moldmaking Material
QM 2128 is a two-component, room temperature condensation cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is an excellent ch..
Viscosity 35000 cP
35000 cP
catalyzed with Moldmaster Purple
ACC QM 2128 QSI Quantum Silicones 28 Durometer Condensation Cure Moldmaking Material
QM 2128 is a two-component, room temperature condensation cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is an excellent ch..
Viscosity 35000 cP
35000 cP
Base
ACC QM 2128 QSI Quantum Silicones 28 Durometer Condensation Cure Moldmaking Material
QM 2128 is a two-component, room temperature condensation cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is an excellent ch..
Viscosity 35000 cP
35000 cP
Base
ACC QM128 QSI Quantum Silicones 28 Durometer Condensation Cured Moldmaking Material
QM 128 is a two-component, room temperature condensation cure silicone material. The cured rubber has excellent mechanical properties and shelf-life stability. This material is an excellent choice f..
Viscosity 35000 cP
35000 cP
Mixed Viscosity
Aremco Aremco-Bond™ 570 High Performance Epoxide
Aremco-Bond 570 is a contact adhesive. Apply .015" to each part, allow solvents to flash for 20 minutes, then clamp parts together for curing.Single-Part Contact Adhesive, Excellent Flexibility
Viscosity 35000 cP
35000 cP
Base
ACC QM 2125 QSI Quantum Silicones 25 Durometer Condensation Cure Moldmaking Material
QM 2125 is a two-component, room temperature condensation cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is an excellent ch..
Viscosity 35000 cP
35000 cP
catalyzed with QM 262B
ACC QM 262 QSI Quantum Silicones 60 Durometer Addition Cure Moldmaking Material
QM262 is a two component, room temperature, addition cure silicone material. The cured rubber has excellent mechanical properties, good shelf-life stability, excellent physical properties and resin ..
Viscosity 35000 cP
35000 cP
Aremco Aremco-Bond™ 2320 High Performance Epoxide
Toughened, Unfilled, Fast-Setting, BPA Free, 2:1, High Peel & Shear Strength
Viscosity 35000 cP
35000 cP
catalyzed with QM 262F B
ACC QM 262F QSI Quantum Silicones 60 Durometer Addition Cure Moldmaking Material
QM 262F is a two component, room temperature addition cure silicone material. The cured rubber has excellent mechanical properties, good shelf-life stability, excellent physical properties and resin..
Viscosity 35000 - 85000 cP
35000 - 85000 cP
Part A
Master Bond EP21TDC-2LO Two component, highly flexibilized epoxy resin compound
Product Description: Master Bond Polymer System EP21TDC-2LO is a two component, highly flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. It is formulat..
Viscosity 35000 - 45000 cP
35000 - 45000 cP
Master Bond UV15X-6NONMED-2 Abrasion Resistant UV Curable Compound
Description: Master Bond Polymer System UV15X-6NONMED-2 is a newly developed one component clear, non-yellowing, UV curable urethane elastomer system possessing high flexibility and abrasion resista..
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