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Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Lord Adhesives
Trade Name Thermoset™
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant.pdf
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Material Notes:
LORD Thermoset™ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devices. It is formulated with the necessary structural strength to handle overmolding processes.Thermoset ME-541 encapsulant is engineered to withstand 260°C peak reflow temperatures of lead-free solders.All information provided by Lord.
Physical Properties Metric English Comments
Specific Gravity 1.53 g/cc
1.53 g/cc
Water Absorption <= 0.90 %
<= 0.90 %
Viscosity 35000 cP

@Temperature 25.0 °C
35000 cP

@Temperature 77.0 °F
TA Rheometer
Mechanical Properties Metric English Comments
Modulus of Elasticity 5.50 GPa
798 ksi
Storage
Shear Strength 60.0 MPa
8700 psi
Die
Thermal Properties Metric English Comments
CTE, linear 32.0 µm/m-°C
17.8 µin/in-°F
Alpha 1
100 µm/m-°C
55.6 µin/in-°F
Alpha 2
Glass Transition Temp, Tg 145 °C
293 °F
TMA
Component Elements Properties Metric English Comments
Potassium, K <= 0.00010 %
<= 0.00010 %
Sodium, Na <= 0.00010 %
<= 0.00010 %
Electrical Properties Metric English Comments
Volume Resistivity 5.30e+15 ohm-cm

@Temperature 25.0 °C
5.30e+15 ohm-cm

@Temperature 77.0 °F
Processing Properties Metric English Comments
Cure Time 15.0 min

@Temperature 165 °C
0.250 hour

@Temperature 329 °F
90.0 min

@Temperature 150 °C
1.50 hour

@Temperature 302 °F
Pot Life 1440 min

@Temperature 25.0 °C
1440 min

@Temperature 77.0 °F
Gel Time 3.00 min

@Temperature 150 °C
3.00 min

@Temperature 302 °F
Shelf Life 6.00 Month

@Temperature -40.0 °C
6.00 Month

@Temperature -40.0 °F
Descriptive Properties Value Comments
Appearance Black
Chloride (%) < 0.0045
Consistency Liquid
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