Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant

Category	Polymer , Thermoset , Epoxy , Filled/Reinforced Thermoset
Manufacturer	Tra-Con, Inc.
Trade Name	Tra-Bond
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

TRA-BOND 933-1 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical protection. TRA-BOND 933-1 encapsulant exhibits a longer work life and a lower moisture sensitivity than the anhydride-cured systems. The low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests.Information provided by Tra-Con Inc.

Physical Properties	Metric	English	Comments
Specific Gravity	2.10 g/cc	2.10 g/cc	Cured
Water Absorption	0.11 %	0.11 %
Viscosity	360500 cP @Temperature 25.0 °C	360500 cP @Temperature 77.0 °F	After mixing

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	92	92
Adhesive Bond Strength	17.2 MPa	2500 psi	Lap shear, alum to alum, 2 hrs @ 150°C

Thermal Properties	Metric	English	Comments
CTE, linear	30.0 µm/m-°C	16.7 µin/in-°F	Below Tg
	100 µm/m-°C	55.6 µin/in-°F	Above Tg
Thermal Conductivity	1.00 W/m-K @Temperature 121 °C	6.94 BTU-in/hr-ft²-°F @Temperature 250 °F
Maximum Service Temperature, Air	150 °C	302 °F
Minimum Service Temperature, Air	-60.0 °C	-76.0 °F
Glass Transition Temp, Tg	124 °C	255 °F	Ultimate Tg

Electrical Properties	Metric	English
Volume Resistivity	1.00e+16 ohm-cm @Temperature 100 °C	1.00e+16 ohm-cm @Temperature 212 °F
Dielectric Constant	6.1	6.1
Dielectric Strength	39.4 kV/mm	1000 kV/in
Dissipation Factor	0.0070	0.0070

Chemical Properties	Metric	English	Comments
Ionic Impurities - Na (Sodium)	55 ppm	55 ppm
Ionic Impurities - Cl (Chloride)	300 ppm	300 ppm

Processing Properties	Metric	English	Comments
Cure Time	30.0 min @Temperature 150 °C	0.500 hour @Temperature 302 °F
	120 min @Temperature 125 °C	2.00 hour @Temperature 257 °F

Descriptive Properties	Value	Comments
Color	Black
Water Extract Conductivity umhos/cm	290
Weight Loss %	0.67	At 300°C
Working Life, months	2	At 25°C

Users viewing this material also viewed the following: