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Parker Chomerics CHO-BOND 592 Conductive Epoxy

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer	Parker Chomerics
Trade Name	CHO-BOND
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics CHO-BOND 592 Conductive Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Highly conductive silver-filled epoxy adhesive which combines the best properties of metals and organics. This two-component system is unique in that it combines long pot life, good electrical conductivity, excellent adhesion, low temperature cure, easy mix ratio, low viscosity, low coefficient of thermal expansion, very low thermal impedance, and good thermal shock resistance.Typical Applications: Connects dissimilar materials electrically and thermally; Excels as a sealant for microwave modules and components; Ideal for circuit board repair and grounding applications and Useful for EMI shieldingInformation provided by Chomerics

Physical Properties	Metric	English	Comments
Specific Gravity	2.35 - 2.85 g/cc	2.35 - 2.85 g/cc
Thickness	25.4 microns	1.00 mil	Recommended

Mechanical Properties	Metric	English	Comments
Shear Strength	>= 10.3 MPa	>= 1500 psi	Lap

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	99.0 °C	210 °F
Minimum Service Temperature, Air	-62.0 °C	-79.6 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.050 ohm-cm	<= 0.050 ohm-cm	DC

Processing Properties	Metric	English	Comments
Cure Time	5.00 min @Temperature 302 °C	0.0833 hour @Temperature 576 °F
	15.0 min @Temperature 125 °C	0.250 hour @Temperature 257 °F
	30.0 min @Temperature 100 °C	0.500 hour @Temperature 212 °F
	60.0 min @Temperature 80.0 °C	1.00 hour @Temperature 176 °F
	10100 min @Temperature 24.0 °C	168 hour @Temperature 75.2 °F	produces lower electrical conductivity
Pot Life	240 - 360 min @Temperature 25.0 °C	240 - 360 min @Temperature 77.0 °F
	2880 min @Temperature 5.00 °C	2880 min @Temperature 41.0 °F
Shelf Life	9.00 Month	9.00 Month

Descriptive Properties	Value	Comments
Binder	Epoxy
Color	Silver
Consistency	Nearly Liquid
Coverage	170.3 cm²/g
Filler	Ag
Mix Ratio	100 to 50	A:B
Working Life	4 hrs

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