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Parker Chomerics CHO-BOND 592 Conductive Epoxy

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Parker Chomerics
Trade Name CHO-BOND
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics CHO-BOND 592 Conductive Epoxy.pdf
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Material Notes:
Highly conductive silver-filled epoxy adhesive which combines the best properties of metals and organics. This two-component system is unique in that it combines long pot life, good electrical conductivity, excellent adhesion, low temperature cure, easy mix ratio, low viscosity, low coefficient of thermal expansion, very low thermal impedance, and good thermal shock resistance.Typical Applications: Connects dissimilar materials electrically and thermally; Excels as a sealant for microwave modules and components; Ideal for circuit board repair and grounding applications and Useful for EMI shieldingInformation provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 2.35 - 2.85 g/cc
2.35 - 2.85 g/cc
Thickness 25.4 microns
1.00 mil
Recommended
Mechanical Properties Metric English Comments
Shear Strength >= 10.3 MPa
>= 1500 psi
Lap
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 99.0 °C
210 °F
Minimum Service Temperature, Air -62.0 °C
-79.6 °F
Electrical Properties Metric English Comments
Volume Resistivity <= 0.050 ohm-cm
<= 0.050 ohm-cm
DC
Processing Properties Metric English Comments
Cure Time 5.00 min

@Temperature 302 °C
0.0833 hour

@Temperature 576 °F
15.0 min

@Temperature 125 °C
0.250 hour

@Temperature 257 °F
30.0 min

@Temperature 100 °C
0.500 hour

@Temperature 212 °F
60.0 min

@Temperature 80.0 °C
1.00 hour

@Temperature 176 °F
10100 min

@Temperature 24.0 °C
168 hour

@Temperature 75.2 °F
produces lower electrical conductivity
Pot Life 240 - 360 min

@Temperature 25.0 °C
240 - 360 min

@Temperature 77.0 °F
2880 min

@Temperature 5.00 °C
2880 min

@Temperature 41.0 °F
Shelf Life 9.00 Month
9.00 Month
Descriptive Properties Value Comments
Binder Epoxy
Color Silver
Consistency Nearly Liquid
Coverage 170.3 cm2/g
Filler Ag
Mix Ratio 100 to 50
A:B
Working Life 4 hrs
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