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Parker Chomerics CHO-BOND® 592 Conductive Adhesive

Category Polymer , Adhesive , Thermoset
Manufacturer Parker Chomerics
Trade Name CHO-BOND®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics CHO-BOND® 592 Conductive Adhesive.pdf
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  Online Service   lookpolymers   27660005
Material Notes:
Description: CHO-BOND® 500 Series Adhesive/Sealant Compounds; These pure silver-filled materials are used where tight tolerances require thin bond lines. Various cure cycles are available, and the materials are formulated for easy application by caulking gun, spatula, needle spotting, or silk screening. Their use for bonding mesh gaskets, printed circuit board repair, chip bonding, rear window defogger repair, and as low-temperature-activated flexible solders demonstrates their versatility. CHO-BOND® 592 adhesive bonds dissimilar materials effectively. It combines long pot-life and excellent adhesion with low viscosity, a low coefficient of thermal expansion, very low thermal impedance and good thermal shock resistance. The material excels as a sealant for microwave modules and components and is useful for circuit board repair and grounding applications.Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 2.35 - 2.85 g/cc
2.35 - 2.85 g/cc
Thickness 25.0 microns
0.984 mil
Recommended
Mechanical Properties Metric English Comments
Shear Strength >= 10.35 MPa
>= 1501 psi
Lap
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 99.0 °C
210 °F
Minimum Service Temperature, Air -62.0 °C
-79.6 °F
Electrical Properties Metric English Comments
Volume Resistivity <= 0.050 ohm-cm
<= 0.050 ohm-cm
DC
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 100 °C
0.500 hour

@Temperature 212 °F
10100 min

@Temperature 24.0 °C
168 hour

@Temperature 75.2 °F
Shelf Life 9.00 Month
9.00 Month
Descriptive Properties Value Comments
Binder Epoxy
Consistency Nearly liquid
Coverage 170.3 cm2/g
Filler Ag
Mix Ratio 100:50
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