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Polymer Property : Cure Time = 60.0 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 60.0 min @Temperature 100 °C |
1.00 hour @Temperature 212 °F |
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| Resin Technology Group 404 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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| Cure Time | 60.0 min @Temperature 95.0 °C |
1.00 hour @Temperature 203 °F |
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| Parker Chomerics CHO-BOND 360-20 Conductive Epoxy Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting E.. |
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| Cure Time | 60.0 min @Temperature 60.0 °C |
1.00 hour @Temperature 140 °F |
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| Henkel Hysol PL 696 Film Adhesive Epoxy-based structural film adhesive designed primarily for out-of-autoclave curing process applications requiring low cure temperatures as well as low curing pressures and is also available in ligh.. |
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| Cure Time | 60.0 min @Temperature 150 °C |
1.00 hour @Temperature 302 °F |
Post Cure |
| Shin-Etsu Silicones LIMSâ„¢ KE1950-60A/B Elastomer KE-1950-60 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy .. |
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| Cure Time | 60.0 min @Temperature 150 °C |
1.00 hour @Temperature 302 °F |
Post Cure |
| Shin-Etsu Silicones LIMSâ„¢ KEG2000-75A/B Elastomer KEG2000-75 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. Its viscosity is low enough to allow easy pum.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 - 98.9 °C |
1.00 - 2.00 hour @Temperature 200 - 210 °F |
first |
| Master Bond EP112LS Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation Master Bond EP112LS is a low viscosity two component epoxy resin system for potting, encapsulation, sealing, coating and impregnation. The mix ratio is an easy to use 100:80 by weight. EP112LS offer.. |
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| Cure Time | 60.0 - 75.0 min @Temperature 121 °C |
1.00 - 1.25 hour @Temperature 250 °F |
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| Master Bond Supreme 10HTCL Epoxy for Cryogenic Applications Description: Master Bond Supreme 10HTCL features a blend of performance properties including both high shear and peel strengths along with convenient handling. This one component system is formulate.. |
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| Cure Time | 60.0 min @Temperature 93.0 °C |
1.00 hour @Temperature 199 °F |
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| Tra-Con Tra-Bond 724-14C Polyurethane Adhesive TRA-BOND 724-14C premixed and frozen, polyurethane adhesive is designed for good adhesion, providing strong, resilient bonds to a wide variety of substrates, including aluminum, solder, nylon, mylar.. |
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| Cure Time | 60.0 min @Temperature 95.0 °C |
1.00 hour @Temperature 203 °F |
|
| Tra-Con Tra-Bond 724-20 Polyurethane Adhesive TRA-BOND 724-20 polyurethane adhesive is designed for good adhesion, providing strong, resilient bonds to a wide variety of substrates including aluminum, solder, nylon, mylar and steel. TRA-BOND 72.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
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| Tra-Con Tra-Duct 2916 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2916 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good ele.. |
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| Cure Time | 60.0 min @Temperature 65.0 °C |
1.00 hour @Temperature 149 °F |
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| Trelleborg Emerson & Cuming Eccobond® 56C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming 56C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveSilver filled, high electrical conductivity, epoxy adhesive. Excellent thermal conductivity. Require.. |
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| Cure Time | 60.0 min @Temperature 120 °C |
1.00 hour @Temperature 248 °F |
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| Trelleborg Emerson & Cuming Eccobond® TP 50 Two-Component Low Temperature Performance Silicone Adhesive Emerson & Cuming TP 50 Eccobond® Two-Component Low Temperature Performance Silicone AdhesiveFilled, RTV silicone rubber, paste adhesive. Room temperature cure. Very flexible. Color coded for ease o.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
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| Master Bond Supreme 11HT-LO Adhesive and Sealant Serviceable to +400°F Description: Master Bond Polymer System Supreme 11HT-LO is an easy to use two part epoxy adhesive/sealant combining both high shear and high peel strengths along with a relatively fast cure at room .. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 2105 Clear Rigid, Medium Viscosity Epoxy Adhesive TRA-BOND 2105 is a clear, medium viscosity epoxy adhesive which contains no solvents or other additives which can be harmful to the environment or to its users. It has excellent adhesion to glass, c.. |
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| Cure Time | 60.0 min @Temperature 65.0 °C |
1.00 hour @Temperature 149 °F |
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| Tra-Con Tra-Bond 2106T Fast Cure Thixotropic Epoxy Adhesive TRA-BOND 2106T is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required. This versatile two-part epoxy system contai.. |
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| Cure Time | 60.0 - 120 min @Temperature 65.0 °C |
1.00 - 2.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 2115 Clear High Strength Epoxy Adhesive TRA-BOND 2115 is a clear, low viscosity epoxy formulation used in the fabrication of lasers. It is capable of withstanding 30 seconds of 60 watt direct laser energy. The low cure shrinkage (using a .. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 813J01 Silicone Encapsulant TRA-BOND 813J01 is a silicone adhesive system formulated to provide excellent thermal conductivity. This unique product bonds well to difficult substrates. Typical applications include encapsulation.. |
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| Cure Time | 60.0 min @Temperature 65.0 °C |
1.00 hour @Temperature 149 °F |
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| Tra-Con Tra-Bond F109CLR Fiber Optic Epoxy Adhesive TRA-BOND F109CLR is a clear, low viscosity epoxy specially designed for terminating plastic fibers. This blush free epoxy is an excellent choice for high humidity environments where absolute clarity.. |
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| Cure Time | 60.0 min @Temperature 32.0 °C |
1.00 hour @Temperature 89.6 °F |
Tack Free |
| Chesterton MRS S2 Metal Rebuilding System An advanced ceramic composite for the resurfacing and protection of all metal surfaces. It is normally applied at a thickness of 250 microns (10 mils) per coat. Non-shrinking, 100% solids. MRS S2 is.. |
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| Cure Time | 60.0 min @Temperature 60.0 °C |
1.00 hour @Temperature 140 °F |
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| Cytec CE-1170 (Conap) Acrylic Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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| Cure Time | 60.0 min @Temperature 180 °C |
1.00 hour @Temperature 356 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec.. |
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| Cure Time | 60.0 min @Temperature 25.0 °C |
1.00 hour @Temperature 77.0 °F |
Full Load |
| Chesterton ARC MX5 Rapid Curing Fine Particle Wear Compound Description: An advanced ceramic reinforced composite for the emergency repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a th.. |
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| Cure Time | 60.0 min @Temperature 100 °C |
1.00 hour @Temperature 212 °F |
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| ACC QGel 310 QSI Quantum Silicones High Strength Gel QGel 310 is a clear, very soft, tough moderately cross-linked silicone polymer. Silicone gels are used to provide protection from vibration and thermal or mechanical shock. Silicone gels also provid.. |
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| Cure Time | 60.0 - 240 min @Temperature 120 - 160 °C |
1.00 - 4.00 hour @Temperature 248 - 320 °F |
optional |
| Abatron AboCast 8103-22 High-Performance Dielectric Epoxy AboCast 8103-22 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system is used in.. |
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