Master Bond EP112LS Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation

Master Bond EP112LS is a low viscosity two component epoxy resin system for potting, encapsulation, sealing, coating and impregnation. The mix ratio is an easy to use 100:80 by weight. EP112LS offers an long open time of 2-3 days or longer. It does require oven curing for a number of hours. A typical cure schedule would be 1-2 hours at 200-210°F followed by 3-4 hours at 250°F and then 4-6 hours at 300°F. Post curing at 350°F will further enhance product properties. Some of the more noteworthy attributes of EP112LS are good electrical insulation properties, physical strength values as well as optical clarity. It bonds very well to a wide variety of substrates, including glass fibers and ceramics, along with metals, composites, glass and many rubbers and plastics. It features good resistance to a variety of chemicals, including water, oils, fuels, acids and bases. EP112LS is serviceable over the wide temperature range of -60°F to +450°F. It is used for potting, sealing, coating and encapsulation applications as well as for impregnating especially when non-yellowing is an important consideration. This is a common issue in electronic, aerospace and opto-electronic environments. Another feature is its ability to retain its electrical insulation profile over a wide temperature range. Even though the cure schedule is somewhat long, EP112LS is a “go to” material for epoxy applications where superior non-yellowing properties are needed.Product Advantages: Low viscosity, long working life at ambient temperatures; very low exothermGood physical strength properties. Solid dimensional stabilityGood electrical insulation characteristicsGreat adhesion to similar and dissimilar substratesThermal stability, service temperature range -60°F to +450°FIdeal for impregnation applicationsExcellent optical clarity and non-yellowing propertiesInformation provided by MasterBond®