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Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging. Low viscosity version of EPO-TEK® H31.Advantages & Application Notes: Exhibits a smooth, flowing consistency that is adaptable to conventional processing methods such as dispensing and screen printing. See Technical Paper #43 from our website link for hints and best practices for high speed auger screw dispensingPerforms exceptionally well as a die attach for small chips such as GaAs, LEDs and diodes.Capable of resisting 260°C green reflow process, low outgassing in hermetic lid-seal processes near 300°C, and organic burn-in up to 150°C/1000 hours storage.Certified to MIL-STD 883/Test Method 5011 –yields low levels of water extractable monovalent ions such as Chlorides.Passes NASA low outgassing standard ASTM E595 with proper cureCapable of JEDEC Level II die-attach packaging on die-paddles and lead-frames.Widely used epoxy; popular choice for silver-filled epoxies; opto-packaging, hybrids, and many types of substrates including kovar, ceramic and BT.Available in many different viscosity ranges Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 3.07 g/cc
3.07 g/cc
Particle Size <= 20 µm
<= 20 µm
Viscosity 22000 - 28000 cP

@Temperature 23.0 °C
22000 - 28000 cP

@Temperature 73.4 °F
10 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 83
83
Tensile Modulus 7.632 GPa
1107 ksi
Storage
Shear Strength >= 13.8 MPa
>= 2000 psi
Lap
>= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 31.0 µm/m-°C
17.2 µin/in-°F
Below Tg
97.0 µm/m-°C
53.9 µin/in-°F
Above Tg
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 372 °C
702 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) <= 50 ppm
<= 50 ppm
Ionic Impurities - K (Potassium) <= 50 ppm
<= 50 ppm
Ionic Impurities - Cl (Chloride) <= 200 ppm
<= 200 ppm
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 180 °C
1.00 hour

@Temperature 356 °F
Minimum Bond Line
90.0 min

@Temperature 165 °C
1.50 hour

@Temperature 329 °F
Minimum Bond Line
Pot Life 40320 min
40320 min
Shelf Life 12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
Descriptive Properties Value Comments
Color Bright silver
Consistency Smooth thixotropic paste
Ionic Impurities NH4 39 ppm
Number of Components Single
Thixotropic Index 4
Weight Loss 0.13%
200°C
0.14%
250°C
0.28%
300°C
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