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- Parker Chomerics CHO-BOND 360-20 Conductive Epoxy
Parker Chomerics CHO-BOND 360-20 Conductive Epoxy
| Category | Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive |
| Manufacturer | Parker Chomerics |
| Trade Name | CHO-BOND |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Parker Chomerics CHO-BOND 360-20 Conductive Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting EMI/RFI shielding compound and is effective even for designs requiring the use of a fillet as opposed to a flanged bead.Applications: Typically include sealing EMI/RFI leaks around vents, windows, and machined surfaces; the bonding and shielding of conduit bulkhead passthroughs.Information provided by Chomerics
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 4.70 - 5.30 g/cc | 4.70 - 5.30 g/cc | |
| Volatile Organic Compounds (VOC) Content | 0.00 g/l | 0.00 g/l | |
| Thickness | >= 254 microns | >= 10.0 mil |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Shear Strength | 11.0 MPa @Temperature 65.6 °C, Time 7200 sec |
1600 psi @Temperature 150 °F, Time 2.00 hour |
Lap |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Maximum Service Temperature, Air | 100 °C | 212 °F | |
| Minimum Service Temperature, Air | -62.0 °C | -79.6 °F |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | <= 0.0050 ohm-cm @Temperature 65.6 °C, Time 7200 sec |
<= 0.0050 ohm-cm @Temperature 150 °F, Time 2.00 hour |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 15.0 min @Temperature 115 °C |
0.250 hour @Temperature 239 °F |
|
| 45.0 min @Temperature 100 °C |
0.750 hour @Temperature 212 °F |
||
| 60.0 min @Temperature 95.0 °C |
1.00 hour @Temperature 203 °F |
||
| 120 min @Temperature 66.0 °C |
2.00 hour @Temperature 151 °F |
||
| 1440 min @Temperature 24.0 °C |
24.0 hour @Temperature 75.2 °F |
||
| Pot Life | 60 min | 60 min | |
| Shelf Life | 9.00 Month | 9.00 Month |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Binder | Epoxy | |
| Consistency | Medium Paste | |
| Coverage | 7.1 cm2 / g | |
| Filler | Ag/Cu | |
| Mix Ratio | 1:1 | |
| Working Life | 1 hr |
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