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Polymer Property : Cure Time = 30.0 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 140 °C |
0.500 hour @Temperature 284 °F |
Tack Free Time |
| Parker Chomerics CHOFORM® 5513 Conductive Form-in-Place Gasket Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
Tack Free Time |
| Parker Chomerics CHOFORM® 5550 Conductive Form-in-Place Gasket Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |
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| Cure Time | 30.0 min @Temperature 93.3 °C |
0.500 hour @Temperature 200 °F |
De-mold Time |
| Northstar Polymers MSS-A85C Ester Base Polyurethane This high performance polyester system is one of a family of polymer systems developed by Northstar Polymers for demanding work environments. Urethane elastomers molded with this system exhibit hig.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond HM129 Anaerobic Threadlocker Permabond® HM129 is a high strength medium viscosity anaerobic threadlocker and sealant. This material cures in the absence of air between tight fitting metal parts. Cure is fast and reliable on st.. |
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| Cure Time | 30.0 - 60.0 min @Temperature 125 °C |
0.500 - 1.00 hour @Temperature 257 °F |
|
| Resin Technology Group TIGA 901 Room Temperature Curing Silver Conductive Epoxy 100 parts resin to 6 parts hardener. Cure 24 hours at 25°C, 1-4 hours at 65°C, 30-60 minutes at 125°C, or 30 minutes at 150°C.TIGA 901 is an electrically conductive, silver filled epoxy adhesiv.. |
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| Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
|
| Gwent Electronic Materials C2030812D3 Silver/Silver Chloride Paste Silver/Silver Chloride Paste has a ratio of Silver to Silver Chloride of 60/40. Applications in medical diagnostics, environmentalScreen Printing Equipment: semi-automatic, manualScreen Types: polye.. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
|
| Gwent Electronic Materials D2070423D5 Polymer Dielectric Grey colored screen printable polymer dielectric, suitable for defining electrode areas and forms a protective layer over the electrode tracking during immersion of the electrode. The formulation i.. |
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| Cure Time | 30.0 min @Temperature 79.4 °C |
0.500 hour @Temperature 175 °F |
|
| Master Bond Supreme 3HT-80 One Component, Toughened, Heat Curing Epoxy Master Bond Polymer System Supreme 3HT-80 is a one component, heat curing epoxy adhesive/sealant featuring excellent physical and chemical resistance properties and a minimal curing temperature of 1.. |
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| Cure Time | 30.0 min @Temperature 120 °C |
0.500 hour @Temperature 248 °F |
|
| Trelleborg Emerson & Cuming Eccobond® G 909 One-Component Fast Cure Epoxy Adhesive Emerson & Cuming G 909 Eccobond® One-Component Fast Cure Epoxy AdhesiveHigh strength, thixotropic, flexible, epoxy adhesive. High peel strength (30 pli). Recommended for bonding copper, aluminum an.. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 353ND-T High Temperature Thixotropic Epoxy Product Description: EPO TEK® 353ND-T is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. Advantages & Application Notes: Suitable for fiber op.. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 353ND-T1 High Temperature Thixotropic Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed for fiber optic, electronics and medical applications. It is a more viscous alternative to EPO-TEK® 353ND-T.I.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
minimum |
| Epoxy Technology EPO-TEK® H61 Unfilled Epoxy Adhesive Material Description: A single component, high Tg, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a liquid version of E.. |
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| Cure Time | 30.0 min @Temperature 100 °C |
0.500 hour @Temperature 212 °F |
minimum |
| Epoxy Technology EPO-TEK® OD2002 High Temperature Epoxy Material Description: High Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement for EPO-TEK® 364. Complies with USP Class VI biocompatibility standards.Information Provid.. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
minimum |
| Epoxy Technology EPO-TEK® OE101 Two Component Epoxy Material Description: A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.Inf.. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
minimum |
| Epoxy Technology EPO-TEK® OE138 Two Component Epoxy Material Description: A two component epoxy with intermediate viscosity range between EPO-TEK® 353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Epoxyset Epoxibond EB-119M Unfilled Epoxy Adhesive A two-component,unfilled, low viscosity, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Epoxyset Epoxibond EB-119SP Unfilled Epoxy Adhesive A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc... |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Epoxyset Epoxibond EB-348 Low Expansion Epoxy Adhesive EB-348 is a highly filled, extremely low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional .. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| ACC QGel 310 QSI Quantum Silicones High Strength Gel QGel 310 is a clear, very soft, tough moderately cross-linked silicone polymer. Silicone gels are used to provide protection from vibration and thermal or mechanical shock. Silicone gels also provid.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| ACC QLE 1100 QSI Quantum Silicones 43 Durometer Clear, Addition Cure, 1-part Elastomer for Coating QLE 1100 is a 100% silicone solids elastomer designed for use as a conformal coating, but can also be used for cloth coating applications. Key Features: 100% solids Transparent, ideal for pigmentat.. |
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| Cure Time | 30.0 min @Temperature 100 °C |
0.500 hour @Temperature 212 °F |
|
| ACC QLE 1101 QSI Quantum Silicones Specialty Silicone Coating QLE 1101 is a low viscosity, two-component, addition cure, silicone elastomer.Key Features: Fast cure at elevated temperaturesLow linear shrinkageTransparent, ideal for pigmentationLow viscosity Par.. |
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| Cure Time | 30.0 min @Temperature 93.3 °C |
0.500 hour @Temperature 200 °F |
Step 1, preceeded by >30 min. air set |
| Aremco Aremco-Seal™ 617 High Temperature Glass Coating Glass-filled adhesive/sealer for use with porous ceramics and refractories to 1500 ºF (816 ºC). |
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| Cure Time | 30.0 min @Temperature 177 °C |
0.500 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 30850S125 0.125" Uncured, Unsupported Silicone Rubber on a Kodacel Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should.. |
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| Cure Time | 30.0 min @Temperature 177 °C |
0.500 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon R31551R030 0.030" (0.762 mm) Uncured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured Silicone Rubber Side 2: Uncured Silicone Rubber This data Represents typical values for the production material. The data should not be used to write, or in place.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
Tack Free Time |
| Parker Chomerics CHOFORM® 5560 Conductive Form-in-Place Gasket Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |
|||
| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
M10 steel, working strength |
| Permabond A1046 Anaerobic Retainer Permabond® A1046 is a rapid curing adhesive designed to provide permanent locking and sealing of metal parts such as bearings, gears, pulleys and threaded components. It exhibits high strength and .. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond A134 Anaerobic Retainer Permabond® A134 is a high-strength anaerobic product designed for the permanent locking and sealing of metal parts. Its 'non-drip' formulation makes it suitable for use on larger fittings, coarse t.. |
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