Parker Chomerics CHOFORM® 5513 Conductive Form-in-Place Gasket

Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material cost versus performance and can provide low cost alternatives for less demanding applications. Chomerics corrosion resistant materials inherently provide protection against galvanic activity. They may eliminate the need for nickel or tin plating and or secondary environmental gaskets. Chomerics general purpose materials exhibit excellent electrical and mechanical properties on metallic and shield plastic housing. Chomerics silver filled materials provide high shielding and conductivity critical for inter-compartmental shields. CHOFORM delivers a greater deflection range, lower deflection forces & improved reliability.Features: Lower deflection forces and a broad deflection range, Corrosion resistant materials can eliminate plating or secondary environmental gasket, Good adhesion to many substrates, Supply chain management providing ongoing logistics, Low cost and rapid prototyping and Excellent electrical properties and adhesion.Information provided by Chomerics