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Epoxyset Epoxibond EB-119SP Unfilled Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Epoxyset
Trade Name Epoxibond
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxyset Epoxibond EB-119SP Unfilled Epoxy Adhesive.pdf
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Material Notes:
A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc.
Physical Properties Metric English Comments
Density 1.16 g/cc
0.0419 lb/in³
Viscosity 3000 - 5000 cP
3000 - 5000 cP
Mechanical Properties Metric English Comments
Hardness, Shore D 90
90
ASTM D2240
Adhesive Bond Strength 15.2 MPa
2200 psi
Lap Shear Strength
Thermal Properties Metric English Comments
CTE, linear >= 50.0 µm/m-°C
>= 27.8 µin/in-°F
Maximum Service Temperature, Air 180 °C
356 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Glass Transition Temp, Tg 110 °C
230 °F
Optical Properties Metric English Comments
Refractive Index 1.57
1.57
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
60.0 min

@Temperature 100 °C
1.00 hour

@Temperature 212 °F
Pot Life >= 180 min
>= 180 min
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