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- Polymer Property : CTE, linear = 25.0 µin/in-°F
Polymer Property : CTE, linear = 25.0 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 45.0 µm/m-°C @Temperature -40.0 - 149 °C |
25.0 µin/in-°F @Temperature -40.0 - 300 °F |
ASTM E831 |
| Quadrant EPP Fluorosint® 500 PTFE, synthetic mica-filled PTFE, compression molded (ASTM Product Data Sheet) |
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| CTE, linear | 45.0 µm/m-°C @Temperature -40.0 - 149 °C |
25.0 µin/in-°F @Temperature -40.0 - 300 °F |
ASTM E831 |
| Quadrant EPP Techtron® PSGF PPS - Compression Molded 40% Glass Reinforced Polyphenylene Sulfide (ASTM Product Data Sheet) |
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| CTE, linear | 45.0 µm/m-°C | 25.0 µin/in-°F | |
| Permabond ES569 Epoxy Resin PERMABOND® ES569 is a single-part heat cured epoxy adhesive with excellent adhesion to metal surfaces as well as composite materials. The high bond strength of this adhesive allows it to replace me.. |
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| CTE, linear | 45.0 - 90.0 µm/m-°C | 25.0 - 50.0 µin/in-°F | Average value: 63.7 µm/m-°C Grade Count:46 |
| Overview of materials for PVC, Extruded This property data is a summary of similar materials in the MatWeb database for the category "PVC, Extruded". Each property range of values reported is minimum and maximum values of appropriate MatW.. |
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| CTE, linear | 45.0 µm/m-°C | 25.0 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 50/CF/7/GS/10/TF/5/EM/BK Polycarbonate, with carbon fiber, glass flakes and PTFE, easy flowing Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi.. |
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| CTE, linear | 45.0 µm/m-°C | 25.0 µin/in-°F | Below Tg; TMA |
| Lord Adhesives Circalokâ„¢ EP-937 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ EP-937 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.All information provided by.. |
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| CTE, linear | 45.0 µm/m-°C @Temperature 20.0 °C |
25.0 µin/in-°F @Temperature 68.0 °F |
Vertical Direction; ASTM D696 |
| Mitsui Arlen™ A335 35% Glass Fiber-Reinforced Modified Nylon 6T (COND) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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| CTE, linear | 45.0 µm/m-°C | 25.0 µin/in-°F | Below Tg; TMA |
| Lord Adhesives Circalokâ„¢ EP-939 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ EP-939 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.All information provided by.. |
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| CTE, linear | 45.0 µm/m-°C @Temperature -30.0 - 100 °C |
25.0 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
| LyondellBasell Hifaxâ„¢ CJ232 Thermoplastic Olefin Resin Key Features: medium high melt flow, medium modulus, low CLTE, paintable thermoplastic elastomeric olefin resin, excellent impact and stiffness balance, good dimensional stability, paintableApplicat.. |
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| CTE, linear | 45.0 µm/m-°C @Temperature -30.0 - 100 °C |
25.0 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
| LyondellBasell Hostacomâ„¢ CB271FC Thermoplastic Polyolefin Elastomer Description: Hostacomâ„¢ CB271FC high melt flow, 2,400 MPa flexural modulus, precolored, UV-stabilized, mineral-filled thermoplastic elastomeric olefin (TEO) resin has an excellent combination of.. |
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| CTE, linear | 45.0 µm/m-°C @Temperature 20.0 °C |
25.0 µin/in-°F @Temperature 68.0 °F |
ISO 11359 |
| Teijin Multilon DN-3510F Filler Reinforced Type, Halogen-Free Flame Resistant PC/ABS Polymer Alloy Halogen-free flame retardant PC/ABS polymer alloy, and is also antimony-free. It has improved stiffness through the addition of 10 % filler. Improved stiffness and high fluidity realizes a thin wall.. |
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| CTE, linear | 45.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
25.0 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics NORYL PX4716 PPE+HIPS (Asia Pacific) PPE+PS GF15% FR V-1 |
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| CTE, linear | 45.0 µm/m-°C @Temperature 20.0 °C |
25.0 µin/in-°F @Temperature 68.0 °F |
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| Toyobo ECOVYLOPET® EMC2301E PET Bottle Recycling Grade, 15% Filler Reinforced Features: PET Bottle Recycling Grade, 15% Filler Reinforced, Modified TypeApplications: Automobile engine head coversHot platesVending machine partsUmbrella ribsInformation provided by Toyobo. |
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| CTE, linear | 45.0 µm/m-°C @Temperature -30.0 - 100 °C |
25.0 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
| A. Schulman POLYTROPE™ TPP 608 Olefinic Elastomer DescriptionPolytrope TPP 608 is an olefinic elastomer exhibiting low thermal expansion, low heat sag and high DOI on painted parts. ApplicationTPP 608 is designed specifically for automotive fascia.. |
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| CTE, linear | 45.0 - 50.0 µm/m-°C | 25.0 - 27.8 µin/in-°F | |
| Master Bond EP30ND Non-Drip, Dimensionally Stable Epoxy Adhesive Description: Master Bond Polymer System EP30ND is a high viscosity, two component epoxy adhesive/sealant with a paste consistency. It will cure at room temperature or more rapidly at elevated temper.. |
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| CTE, linear | 45.0 µm/m-°C @Temperature 20.0 °C |
25.0 µin/in-°F @Temperature 68.0 °F |
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| Cosmic Plastics D45 Mineral Filled Ortho Diallyl Phthalate Molding Compound Data provided by the manufacturer. |
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| CTE, linear | 45.0 µm/m-°C | 25.0 µin/in-°F | Below Tg |
| Tra-Con Tra-Bond 9070D Filled Epoxy Adhesive TRA-BOND 9070D filled epoxy adhesive exhibits a low coefficient of expansion. Information provided by Tra-Con Inc. |
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| CTE, linear | 45.0 µm/m-°C @Temperature 23.0 - 260 °C |
25.0 µin/in-°F @Temperature 73.4 - 500 °F |
ASTM D696 |
| Daelim H&L Plavis-G15 DF 15% Graphite Filled Aromatic Polyimide Bearing Direct Formed. Plavis-G-15: Graphite 15 wt% filled, Self lubricating grade for wear and friction applications.General Plavis information for all grades:PLAVIS polyimide has nitrogen bonded to 3 ca.. |
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| CTE, linear | 45.0 - 70.0 µm/m-°C @Temperature 23.0 - 60.0 °C |
25.0 - 38.9 µin/in-°F @Temperature 73.4 - 140 °F |
ASTM D696 |
| Daikin NEOFLON M-300P PCTFE Pellets NEOFLON PCTFE M-300 series is used for general purpose applications.Description:Pellets.Processing Methods: Extrusion.Uses: Rods, small parts.Information provided by Daikin Industries. |
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| CTE, linear | 45.0 - 70.0 µm/m-°C @Temperature 23.0 - 60.0 °C |
25.0 - 38.9 µin/in-°F @Temperature 73.4 - 140 °F |
ASTM D696 |
| Daikin NEOFLON M-400H PCTFE Granular Molding Powder NEOFLON PCTFE M-400 series is a high molecular weight type material which is suitable for applications requiring mechanical toughness and stress crack resistance.Description:Granular powders.Process.. |
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| CTE, linear | 45.0 µm/m-°C @Temperature 50.0 - 200 °C |
25.0 µin/in-°F @Temperature 122 - 392 °F |
DIN 53 752 |
| Ensinger TECASINT 4011 Polyimide, Yellow (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel.. |
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| CTE, linear | 45.0 µm/m-°C | 25.0 µin/in-°F | ASTM E831 |
| Arlon Thermabond® 99720W015 0.015" Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier Design/Construction:Liner: 0.001" FEP FilmSide 1: Uncured Silicone RubberCarrier: 0.003" PTFE coated FiberglassRecommended Primer: Dow Corning S2260This data represents typical values for the pr.. |
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| CTE, linear | 45.0 µm/m-°C @Temperature 20.0 °C |
25.0 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Asahi Kasei Thermofil N-13FG-1626 13% Glass Fiber Reinforced, Heat Stabilized Information provided by Asahi Thermofil |
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| CTE, linear | 45.0 µm/m-°C @Temperature 20.0 °C |
25.0 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Asahi Kasei Thermylene® P1-20FG-2703 20% Glass Fiber Reinforced, Impact Modified Information provided by Asahi Thermofil |
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| CTE, linear | 45.0 µm/m-°C | 25.0 µin/in-°F | ASTM E831 |
| Addiplast Addinyl C2 V20 Nylon 66/6, 20% Glass Filled Glass fiber reinforced, high strengthInformation provided by Addiplast. |
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| CTE, linear | 45.0 µm/m-°C @Temperature 20.0 °C |
25.0 µin/in-°F @Temperature 68.0 °F |
ISO 11359 |
| CENTROPLAST CENTRO HPM Polyetherimide This material has high strength and rigidity at high temperatures, with good electrical properties. Applications include electrical insulators, and load-bearing components.Information provided by C.. |
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| CTE, linear | 45.0 µm/m-°C @Temperature -30.0 - 80.0 °C |
25.0 µin/in-°F @Temperature -22.0 - 176 °F |
Borealis Method |
| Borealis Daplen™ EF209AE Polypropylene TPO Compound Daplen™ EF209AE is a 20% mineral filled elastomer modified polypropylene compound intended for injection molding. This material has excellent balanced mechanical properties, gives a good surface q.. |
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| CTE, linear | 45.0 µm/m-°C @Temperature 20.0 °C |
25.0 µin/in-°F @Temperature 68.0 °F |
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| Loctite® 3880 Heat Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona.. |
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