Lord Adhesives Circalokâ„¢ EP-939 Epoxy Board Level Encapsulant

Category	Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer	Lord Adhesives
Trade Name	Circalok™
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Lord Adhesives Circalokâ„¢ EP-939 Epoxy Board Level Encapsulant.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

LORD Thermosetâ„¢ EP-939 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.All information provided by Lord.

Physical Properties	Metric	English	Comments
Specific Gravity	1.49 g/cc	1.49 g/cc
Brookfield Viscosity	30000 - 44400 cP @Temperature 25.0 Â°C	30000 - 44400 cP @Temperature 77.0 Â°F	Spindle 6 @ 10rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	87 - 95	87 - 95
Modulus of Elasticity	1.00 GPa	145 ksi	DMA

Thermal Properties	Metric	English	Comments
CTE, linear	45.0 Âµm/m-Â°C	25.0 Âµin/in-Â°F	Below Tg; TMA
Glass Transition Temp, Tg	125 Â°C	257 Â°F	TMA

Electrical Properties	Metric	English
Volume Resistivity	1.00e+15 ohm-cm @Temperature 25.0 Â°C	1.00e+15 ohm-cm @Temperature 77.0 Â°F
Dielectric Constant	4.0 @Frequency 1.00e+6 Hz	4.0 @Frequency 1.00e+6 Hz
Dissipation Factor	0.010 @Frequency 1.00e+6 Hz	0.010 @Frequency 1.00e+6 Hz

Processing Properties	Metric	English
Cure Time	20.0 min @Temperature 150 Â°C	0.333 hour @Temperature 302 Â°F
Pot Life	40320 min @Temperature 25.0 Â°C	40320 min @Temperature 77.0 Â°F
Gel Time	4.00 min @Temperature 150 Â°C	4.00 min @Temperature 302 Â°F
Shelf Life	6.00 Month @Temperature 0.000 - 5.00 Â°C	6.00 Month @Temperature 32.0 - 41.0 Â°F

Descriptive Properties	Value	Comments
Appearance	Black
Consistency	Paste

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