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Polymer Property : Glass Transition Temp, Tg = 257 °F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Glass Transition Temp, Tg 125 °C
257 °F
DMA (SYSS)
RedEye On Demand PC/ABS for FDM Rapid Prototyping
This thermoplastic polymer blend combines PC (Polycarbonate) and ABS (Acrylonitrile Butadiene Styrene) to produce an industrial material with a lot to offer. It combines the strength of PC with the ..
Glass Transition Temp, Tg 125 °C
257 °F
Permabond ES558 Epoxy Resin
PERMABOND ES558 is a single-part epoxy paste which flows like solder when heated during curing. The adhesive is toughened for maximum impact resistance, along with excellent peel and shear strength...
Glass Transition Temp, Tg 125 °C
257 °F
ISO 11357-2
Menzolit Menzolit® BMC 0900 Unsaturated Polyester UP
BMC 0900 is a special BMC used in a chemically aggressive environment. The glass content is set to a level that combines good mould ability with good strength and stiffness properties. Typical appli..
Glass Transition Temp, Tg 125 °C
257 °F
ISO 11357-2
Menzolit Menzolit® SMC 0800 Unsaturated Polyester UP
SMC 0800 is a special SMC for applications within househould and kitchenware. The glass level has been selected to combine good mouldability with good strength and stiffness properties. The product ..
Glass Transition Temp, Tg 125 °C
257 °F
ISO 11357-2
Menzolit Menzolit® SMC 0900 Unsaturated Polyester UP
SMC 0900 is a special SMC for use within a chemical aggressive environment. The glass level is selected to combine good mouldability with good strength and stiffness properties. The product is espec..
Glass Transition Temp, Tg 125 °C
257 °F
GrafTech GRAFCELL® FFP-100 SERIES Flow Field Plate Graphite
Manufactured from expanded natural graphite, GRAFCELL® Flow Field Plate (FFP) components retain a continuous graphitic phase. This phase continuity, combined with a low contact resistance, provid..
Glass Transition Temp, Tg 125 °C
257 °F
GrafTech GRAFCELL® FFP-300 SERIES Flow Field Plate Graphite
Manufactured from expanded natural graphite, GRAFCELL® Flow Field Plate (FFP) components retain a continuous graphitic phase. This phase continuity, combined with a low contact resistance, provid..
Glass Transition Temp, Tg 125 °C
257 °F
TMA
Lord Adhesives Circalokâ„¢ EP-937 Epoxy Board Level Encapsulant
LORD Thermosetâ„¢ EP-937 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.All information provided by..
Glass Transition Temp, Tg 125 °C
257 °F
Kuraray Genestarâ„¢ G1300H Nylon, 30% Glass Filled
Standard HB grade. Halogen free, following the standards that Br is less than 900ppm, Cl is less than 900ppm, and total of halogen amount (Br and Cl) is less than 1500ppm. It is suitable for use in ..
Glass Transition Temp, Tg 125 °C
257 °F
10°C/min; ISO 11357-1/-2
Kuraray Genestarâ„¢ G1350A-M42 Nylon, 35% Glass Filled
35% Glass reinforced injection grade. This grade was developed specifically for improved performance in a 50/50 ethylene glycol and water environment.Main Features:Hydrolysis resistanceHeat resista..
Glass Transition Temp, Tg 125 °C
257 °F
10°C/min; ISO 11357-1/-2
Kuraray Genestarâ„¢ G1352A-M41 Nylon, 35% Glass Filled
Low friction reinforced injection grade.Main Features:Low friction coefficientAbrasion resistanceExamples of applications:Friction and wear applicationGear and wheel
Glass Transition Temp, Tg 125 °C
257 °F
Kuraray Genestarâ„¢ GN2330 Nylon, 33% Glass Filled
Standard V-0 Grade. Features a balance of mechanical strength, mold-ability, and dimensional stability. Well suited for a wide range of electrical and electronic components.
Glass Transition Temp, Tg 125 °C
257 °F
Kuraray Genestarâ„¢ GP2450NH-2 Nylon, 45% Glass Filled
Standard V-0 Grade. Halogen free, following the standards that Br is less than 900ppm, Cl is less than 900ppm, and total of halogen amount (Br and Cl) is less than 1500ppm.This grade meets UL94, V-0..
Glass Transition Temp, Tg 125 °C
257 °F
Kuraray Genestarâ„¢ GT2330 Nylon, 33% Glass Filled
Toughness V-0 Grade. It is well suited for components requiring a high strength in pin fitting process, due to high ductility properties.
Glass Transition Temp, Tg 125 °C
257 °F
Kuraray Genestarâ„¢ GW1458HF Nylon, 45% Glass Filled
Low Warpage, High Flow HB grade. Halogen free, following the standards that Br is less than 900ppm, Cl is less than 900ppm, and total of halogen amount (Br and Cl) is less than 1500ppm.
Glass Transition Temp, Tg 125 °C
257 °F
10°C/min; ISO 11357-1/-2
Kuraray Genestarâ„¢ N1000A-M41 Nylon
Standard unreinforced injection grade. Main features:Low water absorptionChemical ResistanceExamples of application are:Friction and wear applicationGear and Wheel
Glass Transition Temp, Tg 125 °C
257 °F
Mitsui Arlenâ„¢ A315 15% Glass Fiber-Reinforced Modified Nylon 6T (COND)
ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss..
Glass Transition Temp, Tg 125 °C
257 °F
Mitsui Arlenâ„¢ A335 35% Glass Fiber-Reinforced Modified Nylon 6T (COND)
ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss..
Glass Transition Temp, Tg 125 °C
257 °F
Mitsui Arlenâ„¢ A350 50% Glass Fiber-Reinforced Modified Nylon 6T (DAM)
ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss..
Glass Transition Temp, Tg 125 °C
257 °F
Mitsui Arlenâ„¢ AE4200 Modified Nylon 6T, for Tribolic Applications (COND)
ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss..
Glass Transition Temp, Tg 125 °C
257 °F
ASTM E1356
Solvay Specialty Polymers Hyflon® AD 60 Perfluoropolymer
Hyflon® AD 60 is an amorphous perfluoro-polymer available in powder form.Hyflon® AD polymers resemble semicrystalline perfluoropolymers in their performance properties as they exhibit high tem..
Glass Transition Temp, Tg 125 °C
257 °F
DSC (SSYS)
Stratasys® PC-ABS
PC-ABS (polycarbonate-ABS) is one of the most widely used industrial thermoplastics. PC-ABS offers the most desirable properties of both materials - the superior mechanical properties and heat resis..
Glass Transition Temp, Tg 125 °C
257 °F
Loctite® 3564 Fast flow epoxy, moderate CTE and Tg Fast Flow Underfill
COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp..
Glass Transition Temp, Tg >= 125 °C
>= 257 °F
with post cure
Master Bond UV15DC80 One Component, UV and Heat Curable Epoxy System
Master Bond UV15DC80 is a special dual cure epoxy based system which offers a primary cure utilizing UV light along with a secondary heat curing mechanism. This system addresses the problem of curin..
Glass Transition Temp, Tg 125 °C
257 °F
Ultimate Tg
Tra-Con Tra-Bond 526M03 Fast Cure Epoxy Adhesive
TRA-BOND 526M03 is a fast cure, high viscosity, two-component epoxy formulation. It develops strong, tough, mechanically stable bonds to a wide variety of fiber optic and optical materials that incl..
Glass Transition Temp, Tg 125 °C
257 °F
ISO 3146
DuPont™ Selar® PA 3426R Nylon Barrier Resin
PA 3426R is an amorphous nylon (polyamide) resin which exhibits superior transparency, good barrier properties to gases, water, solvents and essential oils and high temperature structural properties..
Glass Transition Temp, Tg >= 125 °C
>= 257 °F
Cured property; Perkin Elmer TMS-2
Aptek 6100-1A/B Epoxy Encapsulant
Optoelectronic grade, water clear encapsulant for IR and visible LED discreet devices. Lower Tg versions available for display devices.Part A is dark blue. Part B is clear to pale yellow.Information..
Glass Transition Temp, Tg 125 °C
257 °F
DAM (SSYS)
Proto3000 PC-ABS Fused Deposition Modeling Polymer
Description: PC-ABS (polycarbonate-ABS) is one of the most widely used industrial thermoplastics. PC-ABS offers the most desirable properties of both materials - the superior strength and heat resis..
Glass Transition Temp, Tg 125 °C
257 °F
Epoxyset Epoxibond EB-177 Unfilled Epoxy Adhesive
A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc...
Glass Transition Temp, Tg 125 °C
257 °F
Mitsui Arlen™ AE4200 Modified Nylon 6T, for Tribolic Applications (DAM)
ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it possesses ..
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