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Epoxyset Epoxibond EB-177 Unfilled Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Epoxyset
Trade Name Epoxibond
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxyset Epoxibond EB-177 Unfilled Epoxy Adhesive.pdf
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Material Notes:
A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc.
Physical Properties Metric English Comments
Density 1.14 g/cc
0.0412 lb/in³
Viscosity 200 - 500 cP
200 - 500 cP
Mechanical Properties Metric English Comments
Hardness, Shore D 92
92
ASTM D2240
Adhesive Bond Strength 13.8 MPa
2000 psi
Lap Shear Strength
Thermal Properties Metric English Comments
CTE, linear >= 50.0 µm/m-°C
>= 27.8 µin/in-°F
Maximum Service Temperature, Air 200 °C
392 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Glass Transition Temp, Tg 125 °C
257 °F
Optical Properties Metric English Comments
Refractive Index 1.53
1.53
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
60.0 min

@Temperature 125 °C
1.00 hour

@Temperature 257 °F
Pot Life >= 300 min
>= 300 min
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