Polymer Property : Shear Strength = 23.4 MPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 301-2FL Low Stress, Optical Epoxy Product Description: EPO-TEK® 301-2FL is a two component optical, medical, and semiconductor grade epoxy resin. It is a more flexible version of EPO-TEK® 301-2.Advantages & Application Notes: Sug..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 302-3M Optically Transparent Epoxy Product Description: EPO-TEK® 302-3M is a two component epoxy used for optical, medical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 305 Spectrally Transparent Epoxy Product Description: EPO-TEK® 305 is a two component, semi-rigid, optical grade epoxy for semiconductor packaging of fiber optics, optoelectronics and medical devices. It is an electrically and th..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 320NC-2 Optically Opaque Epoxy Material Description: A two component, black colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 337H Graphite-Filled, High Temperature Epoxy Product Description: EPO-TEK® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic ind..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 354 High Temperature Epoxy Product Description: EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally i..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 730 General Purpose Epoxy Product Description: EPO-TEK® 730 is a two component, thixotropic, room temperature-curing epoxy adhesive. Advantages & Application Notes: Excellent all purpose adhesive. Many uses in job shop and ..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 730 Unfilled Black General and Structural Grade Epoxy Material Description: A two component, room temperature curing, general and structural grade epoxy. It can be used for adhesive, sealing, and encapsulating applications in medical, xray device, fil..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die Initial
Epoxy Technology EPO-TEK® EK1000-MP Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding ..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® H44 Gold-Filled, Electrically Conductive Epoxy Product Description: EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.Advantages & Application Notes: High visco..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® M10-D Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® MA-5 Optical Grade Epoxy Material Description: A single component, B-stageable, optical grade epoxy for fiber optic assembly. It may be used for B-stage sealing of fiber cables into ferrules, or fiber optic feed through in..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® OD2002 High Temperature Epoxy Material Description: High Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement for EPO-TEK® 364. Complies with USP Class VI biocompatibility standards.Information Provid..
Shear Strength	23.4 MPa	3400 psi	Die
Epoxy Technology EPO-TEK® OG116-31 UV Cure Optical Epoxy Product Description: EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® OG178 UV Cure Optical Epoxy Material Description: A single component, UV/visible shifted light curable epoxy, designed for adhesive, sealing, coating and encapsulating applications found in semiconductor, electro-optics, fiber..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.Advantages & Application N..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / J..
Shear Strength	23.4 MPa	3400 psi	Overlap, Stainless Steel, Cohesive Failure
3M Scotch-Weld™ DP810NS Structural Adhesive 3M™ Scotch-Weld™ Low-Odor Acrylic Adhesives are two-part, 1:1 mix ratio, toughened structural adhesives with less odor than most acrylic adhesives. The adhesives have excellent shear and peel stre..
Shear Strength	23.4 MPa	3400 psi	Overlap, FRP (Green) (IPA/abrade/IPA), Adhesive Failure/Cohesive Failure; ASTM D1002
3M Scotch-Weld™ DP920 Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP920 is a two-part, 2:1 mix ratio, toughened epoxy structural adhesive with a 20 minute work life. It exhibits excellent shear and peel strengths along with good i..
Shear Strength	23.4 MPa	3400 psi	Overlap, Stainless Steel, Cohesive Failure
3M Scotch-Weld™ DP810 Tan Structural Adhesive 3M™ Scotch-Weld™ Low-Odor Acrylic Adhesives are two-part, 1:1 mix ratio, toughened structural adhesives with less odor than most acrylic adhesives. The adhesives have excellent shear and peel stre..
Shear Strength	23.4 MPa @Temperature -55.0 °C	3400 psi @Temperature -67.0 °F	Aluminum, etched, Overlap, Cohesive Failure
3M Scotch-Weld™ LSB60 Toughened Epoxy Adhesives 3M™ Scotch-Weld™ Toughened Epoxy Adhesive LBS60 is a high performance, two-part, toughened epoxy adhesives offering outstanding shear adhesion and very high levels of durability with a choice of f..
Shear Strength	23.4 MPa	3400 psi	Overlap, Galvanized Steel-MEK/Abrade/MEK, Cohesive/Adhesive Failure
3M Scotch-Weld™ LSB60NS Toughened Epoxy Adhesives 3M™ Scotch-Weld™ Toughened Epoxy Adhesive LBS60NS is a high performance, two-part, toughened epoxy adhesives offering outstanding shear adhesion and very high levels of durability with a choice of..
Shear Strength	23.4 MPa	3400 psi	Overlap, Etched Al, 100% RH at 49°C for 14 days
3M Scotch-Weld™ 2216 B/A Tan NS Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 2216 B/A is a flexible, two-part, room temperature curing epoxy with high peel and shear strength. Scotch-Weld epoxy adhesive 2216 B/A is identical to 3M Scotch-Wel..