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Epoxy Technology EPO-TEK® 337H Graphite-Filled, High Temperature Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, High Temperature
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® 337H Graphite-Filled, High Temperature Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM/ fiber optics. It is an electrically conductive version of EPO-TEK®377.Advantages & Application Notes:Low viscosity - ideal for commercial and micro-dispensing applications.Suggested applications:Opto-electronics: Adhering IR filter windows to cap of TO-can; opaque epoxy resin in IR and VIS range; near hermetic sealing of windows and packages.Hybrid Microelectronics: adhesion to kovar, stainless steel, ceramics, glasses, lids or substrates in Rf/Microwave devices.Convenient 1:1 mix ratio allows for static mixing, or specialty packaging in double-barrel syringes.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.29 g/cc
1.29 g/cc
Part A
1.33 g/cc
1.33 g/cc
Part B
Particle Size <= 40 µm
<= 40 µm
Viscosity 500 - 1000 cP

@Temperature 23.0 °C
500 - 1000 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
Tensile Modulus 2.8741 GPa
416.85 ksi
Storage
Shear Strength >= 13.8 MPa
>= 2000 psi
Lap
>= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 56.0 µm/m-°C
31.1 µin/in-°F
Below Tg
200 µm/m-°C
111 µin/in-°F
Above Tg
Thermal Conductivity 0.440 W/m-K
3.05 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 175 °C
347 °F
Continuous
275 °C
527 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 95.0 °C
>= 203 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 345 °C
653 °F
Degradation Temperature; TGA
Optical Properties Metric English Comments
Transmission, Visible <= 0.10 %

@Wavelength 400 - 1500 nm
<= 0.10 %

@Wavelength 400 - 1500 nm
Electrical Properties Metric English Comments
Volume Resistivity >= 400 ohm-cm
>= 400 ohm-cm
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 150 °C
1.00 hour

@Temperature 302 °F
Pot Life 1440 min
1440 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Black
Part A
Black
Part B
Consistency Pourable liquid
Mix Ratio By Weight 1:1
Number of Components Two
Weight Loss 0.09%
200°C
0.66%
250°C
0.78%
300°C
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