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Epoxy Technology EPO-TEK® OG116-31 UV Cure Optical Epoxy

Category Polymer , Thermoset , Epoxy
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® OG116-31 UV Cure Optical Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical, and scientific/OEM industries.Advantages & Application Notes: Viscosity/rheology adapted to high volume syringe needle dispensing with no tailing.Complies with USP Class VI biocompatibility standards.Versatility in cure. Product responds to a broad range of UV light, and secondary thermal post-curing.Suggested applications:Semiconductor: COB glob top covering IC’s and wire bonds; glob top dam; encapsulating and sealing; adhesion to FR4, Kapton, silicon.Fiber Optic: making fiber optic pigtails; active alignment of optics; adhesion to many types of glass, metals, ceramics and plastics.Opto-electronic: Perimeter/main seal for LCD’s, compatible with VAN liquid crystal for LCoS devices.High Tg and low outgassing are indicative of its high temperature performance.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.20 g/cc
1.20 g/cc
Particle Size <= 20 µm
<= 20 µm
Viscosity 20000 - 30000 cP

@Temperature 23.0 °C
20000 - 30000 cP

@Temperature 73.4 °F
10 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 83
83
Tensile Modulus 1.82 GPa
264 ksi
Storage
Shear Strength 23.4 MPa
3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 41.0 µm/m-°C
22.8 µin/in-°F
Below Tg
170 µm/m-°C
94.4 µin/in-°F
Above Tg
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 115 °C
>= 239 °F
Dynamic Post- Cure Scan 20—200°C; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 409 °C
768 °F
Degradation Temperature
Optical Properties Metric English Comments
Refractive Index 1.5662

@Wavelength 589 nm
1.5662

@Wavelength 589 nm
Transmission, Visible >= 92 %

@Wavelength 500 nm
>= 92 %

@Wavelength 500 nm
Spectral
>= 96 %

@Wavelength 660 - 1640 nm
>= 96 %

@Wavelength 660 - 1640 nm
Spectral
Processing Properties Metric English Comments
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Cloudy White
before cure
Consistency Viscous liquid
Number of Components Single
Thixotropic Index 1.3
Weight Loss 0.31%
200°C
0.68%
250°C
1.18%
300°C
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