Epoxy Technology EPO-TEK® OG116-31 UV Cure Optical Epoxy

Category	Polymer , Thermoset , Epoxy
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® OG116-31 UV Cure Optical Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Product Description: EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical, and scientific/OEM industries.Advantages & Application Notes: Viscosity/rheology adapted to high volume syringe needle dispensing with no tailing.Complies with USP Class VI biocompatibility standards.Versatility in cure. Product responds to a broad range of UV light, and secondary thermal post-curing.Suggested applications:Semiconductor: COB glob top covering IC’s and wire bonds; glob top dam; encapsulating and sealing; adhesion to FR4, Kapton, silicon.Fiber Optic: making fiber optic pigtails; active alignment of optics; adhesion to many types of glass, metals, ceramics and plastics.Opto-electronic: Perimeter/main seal for LCD’s, compatible with VAN liquid crystal for LCoS devices.High Tg and low outgassing are indicative of its high temperature performance.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	1.20 g/cc	1.20 g/cc
Particle Size	<= 20 µm	<= 20 µm
Viscosity	20000 - 30000 cP @Temperature 23.0 °C	20000 - 30000 cP @Temperature 73.4 °F	10 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	83	83
Tensile Modulus	1.82 GPa	264 ksi	Storage
Shear Strength	23.4 MPa	3400 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	41.0 µm/m-°C	22.8 µin/in-°F	Below Tg
	170 µm/m-°C	94.4 µin/in-°F	Above Tg
Maximum Service Temperature, Air	200 °C	392 °F	Continuous
	300 °C	572 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 115 °C	>= 239 °F	Dynamic Post- Cure Scan 20—200°C; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature	409 °C	768 °F	Degradation Temperature

Optical Properties	Metric	English	Comments
Refractive Index	1.5662 @Wavelength 589 nm	1.5662 @Wavelength 589 nm
Transmission, Visible	>= 92 % @Wavelength 500 nm	>= 92 % @Wavelength 500 nm	Spectral
	>= 96 % @Wavelength 660 - 1640 nm	>= 96 % @Wavelength 660 - 1640 nm	Spectral

Processing Properties	Metric	English	Comments
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Cloudy White	before cure
Consistency	Viscous liquid
Number of Components	Single
Thixotropic Index	1.3
Weight Loss	0.31%	200°C
	0.68%	250°C
	1.18%	300°C

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