Polymer Property : Volume Resistivity = 0.010 ohm-cm Product List

Electrical Properties

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Electrical Properties	Metric	English	Comments
Volume Resistivity	0.010 ohm-cm	0.010 ohm-cm
Premix Thermoplastics PRESEAL 6080 Ag-Coated Glass Highly conductive PRESEAL® thermoplastic elastomer compounds are injection-mouldable and extrudable plastics for EMI-gasket and -housing applications, among other uses. The material is an ideal cho..
Volume Resistivity	0.010 ohm-cm	0.010 ohm-cm
Premix Thermoplastics PRESEAL 6080 Ag-Coated Glass Metal replacement is one of the fastest growing areas for conductive plastics. Plastics, with their lighter weight, good processability and optimal combination of mechanical properties have challeng..
Volume Resistivity	0.010 ohm-cm	0.010 ohm-cm	ASTM D257
Premix Thermoplastics PRESEAL® TPE 6080 General Description:PRESEAL® TPE 6080 is a thermoplastic elastomer based highly conductive compound intended primarily for EMI gasket applications. It can also be used as conductors or in grounding..
Volume Resistivity	0.010 ohm-cm	0.010 ohm-cm	Mil-G-835388
Premix Thermoplastics PRESEAL® TPE 6080 General Description:PRESEAL® TPE 6080 is a thermoplastic elastomer based highly conductive compound intended primarily for EMI gasket applications. It can also be used as conductors or in grounding..
Volume Resistivity	<= 0.010 ohm-cm @Temperature 100 °C, Time 2700 sec	<= 0.010 ohm-cm @Temperature 212 °F, Time 0.750 hour
Parker Chomerics CHO-BOND 360-208 Conductive Epoxy Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting E..
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm
Parker Chomerics CHO-BOND® 1121 General Purpose Adhesive-Sealant Silver Silicone Description: Xylene-free version of CHO-BOND 1038; rec. bond line thickness: > 0.18 mm; primer promotes adhesion CHO-BOND® 1121 is an electrically conductive, one-component silicone adhesive-sealan..
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm	Initial; MIL-G-83528 Para. 4.6.11
Parker Chomerics CHO-FORM® 5518 Robotically Dispensed Gasketing Description: CHO-FORM® 5518 Two-component, thermal cure silicone system with Ag/Cu particle filler. Minimum cure temperature is only 85°C (185°F). Formulated for painted, plated or metalized plas..
Volume Resistivity	0.010 ohm-cm	0.010 ohm-cm	Post Tensile Set; MIL-DTL-83528 Para.4.6.9
Parker Chomerics CHO-SEAL 1212 Conductive Elastomer High strength, hard (80 shore A) material for waveguide, choke, cover, and flanges with grooves for EMI and pressure sealing.Molded onlyRoHS Compliant Information provided by Chomerics
Volume Resistivity	0.010 ohm-cm	0.010 ohm-cm	Post Tensile Set; MIL-DTL-83528 Para.4.6.9
Parker Chomerics CHO-SEAL 1224 Conductive Elastomer Highest shielding effectiveness and through conductivity performance; higher physical properties; excellent processing; also available in a fabric reinforced format.Molded onlyRoHS CompliantInformat..
Volume Resistivity	0.010 ohm-cm	0.010 ohm-cm	Post Tensile Set; MIL-DLT-83528 Para.4.6.9
Parker Chomerics CHO-SEAL 1350 Conductive Elastomer Standard material for high volume injection and compression molding and small extrusions; high performance in non-corrosive environments; used in grounding applications with little or no vibration.R..
Volume Resistivity	0.010 ohm-cm	0.010 ohm-cm	as supplied without pressure sensitive adhesive; MIL-DTL-83528
Parker Chomerics CHO-SEAL 1401 Conductive Elastomer High performance for non-corrosive environments; soft(45 Shore A) for low closure force where gasket geometry cannot be exploited; low tear strength; no fluid resistance. Molded and ExtrudedRoHS Com..
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm
Parker Chomerics Tecknit® 0002 Highly Conductive Adhesive-Sealant Silver Silicone Description: TECKNIT® 0002 is a pure silver filled, one component RTV silicone adhesive-sealant. It is ready to use without mixing and cures quickly at room temperature on exposure to moisture in ..
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm
Parker Chomerics Tecknit® 0035 Conductive Silicone Sealant/Adhesive Comments: Thin flexible pasteTypical Applications: Bonding elastomer gasketInformation provided by Chomerics
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm
Parker Chomerics Tecknit® 0036 Two Part Flexible Adhesive-Sealant Silver-Glass Silicone Description: TECKNIT 0036 is an electrically conductive, medium viscosity, RTV silicone adhesive-sealant. This silver-plated glass filled system is formulated with a special conductive material pro..
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm
Parker Chomerics Tecknit® 0236 Conductive Silicone Sealant/Adhesive Comments: Thick flexible pasteTypical Applications: Bonding Ag/Al elastomerInformation provided by Chomerics
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm	Cured; QAP-1017
Parker Chomerics Tecknit® 72-00014 Silver-Filled Flexible Resin Caulking System Description: TECKNIT standard electrically conductive caulks consist of four one-component resin systems filled with silver plated glass or copper particles. These systems are formulated to provide ..
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm	Cured; QA-1038
Parker Chomerics Tecknit® 72-00152 Silver-Filled Flexible Resin Caulking System Description: TECKNIT standard electrically conductive caulks consist of four one-component resin systems filled with silver plated glass or copper particles. These systems are formulated to provide ..
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm
Parker Chomerics Tecknit Consil®-C 875 Silver-Copper Filled Silicone Elastomer Description: CONSIL-C is a silicone or fluorosilicone elastomer filled with silver-plated copper particles designed to achieve maximum electrical conductivity. CONSIL-C provides one of the highest s..
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm
Parker Chomerics Tecknit Consil®-II 841 Molded Silver-Filled Silicone Elastomer Description: CONSIL-II is a molded silicone elastomer filled with silver-coated inert particles. It provides high electrical conductivity, broadband shielding and moisture sealing. CONSIL-II is desi..
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm
Parker Chomerics Tecknit Consil®-II 842 Molded Silver-Filled Silicone Elastomer Description: CONSIL-II is a molded silicone elastomer filled with silver-coated inert particles. It provides high electrical conductivity, broadband shielding and moisture sealing. CONSIL-II is desi..
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm	Cured; QAP-1017
Parker Chomerics Tecknit TeckBond™-A Silver-Plated Aluminum-Filled Adhesive Description: TECKBOND-A conductive system is a silicone based, two-component RTV, filled with silver-plated aluminum particles. After cure, the resultant bond or seal is flexible, resilient, and con..
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm
Parker Chomerics Tecknit Teckfip™ FIP-A Formed in Place Conductive Elastomer Description: This compound is ideally suited to corrosion-concerned applications where the gasket is applied to an aluminum casting. The corrosion resistance is enhanced due to the galvanic compatib..
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm
Parker Chomerics Tecknit Teckfip™ HC FIP-C Formed in Place Conductive Elastomer Description: Heat cure compound. This compound is an all round high performance compound, and is very similar to a Consil C molded or extruded elastomer. It has been traditionally used for telecommu..
Volume Resistivity	0.010 - 1.0 ohm-cm	0.010 - 1.0 ohm-cm	IEC 60093
Teijin PanliteÂ® B-8130R Carbon Fiber Reinforced Polycarbonate Resin CF 30% reinforced grade, meeting UL 94 V-2. It has excellent strength, stiffness, heat resistance and electric conductivity. Other features are low molding shrinkage and dimensional accuracy.Applica..
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm
Master Bond EP79 Two Component, Silver Coated, Nickel Filled Conductive Epoxy Master Bond Polymer System EP79 is a two component, silver coated, nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or ..
Volume Resistivity	0.010 ohm-cm	0.010 ohm-cm	cured 24 hrs @ 25°C
Tra-Con Tra-Duct 916H03 Room Temperature Cure High Conductivity Silver Epoxy Adhesive TRA-DUCT 916H03 is recommended for electronic bonding and sealing applications that require the combination of high conductivity coupled with good mechanical properties. This two part smooth paste s..
Volume Resistivity	0.010 ohm-cm	0.010 ohm-cm	in plane
Bulk Molding Compounds BMC 940 Vinyl Ester Bipolar Plate Material Bulk Molding Compounds, Inc. is the largest manufacturer of thermoset bulk molding compounds in North America, serving the automotive, appliance, and electrical markets. BMC thermosets are the most ..
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm
Parker Chomerics CHO-BOND 1038 Conductive Silicone RTV Adhesive Electrically conductive, one component silicone adhesive/sealant that may be used for bonding EMI gaskets or for providing EMI and environmental protection as a caulk. This material cures on exposur..
Volume Resistivity	0.010 ohm-cm	0.010 ohm-cm	DC
Parker Chomerics CHO-BOND 1075 Silicone RTV Adhesive/Sealant Electrically conductive, one component silicone adhesive/sealant that may be used for bonding EMI gaskets or for providing EMI and environmental protection as a caulk. This material cures on exposur..