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Parker Chomerics Tecknit Teckfip™ HC FIP-C Formed in Place Conductive Elastomer

Category Polymer
Manufacturer Parker Chomerics Tecknit
Trade Name Teckfip™
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics Tecknit Teckfip™ HC FIP-C Formed in Place Conductive Elastomer.pdf
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Material Notes:
Description: Heat cure compound. This compound is an all round high performance compound, and is very similar to a Consil C molded or extruded elastomer. It has been traditionally used for telecommunications base station shielding. This material has excellent adhesive strength, and the electrical conductivity remains stable even under long term mechanical load such as vibration or periodic loading and temperature fluctuations.Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 2.23 - 2.99 g/cc
2.23 - 2.99 g/cc
Mechanical Properties Metric English Comments
Hardness, Shore A 45 - 55
45 - 55
Tensile Strength >= 1.38 MPa
>= 200 psi
Elongation at Break >= 50 %
>= 50 %
Peel Strength >= 9.00 kN/m
>= 51.4 pli
Compression Set 10 - 25 %
10 - 25 %
27 %

@Temperature 70.0 °C,
Time 79200 sec
27 %

@Temperature 158 °F,
Time 22.0 hour
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 125 °C
257 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Electrical Properties Metric English Comments
Volume Resistivity <= 0.010 ohm-cm
<= 0.010 ohm-cm
Surface Resistance <= 0.010 ohm
<= 0.010 ohm
<= 0.030 ohm

@Temperature 85.0 °C,
Time 605000 sec
<= 0.030 ohm

@Temperature 185 °F,
Time 168 hour
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 125 °C
1.00 hour

@Temperature 257 °F
Shelf Life 1.00 Month
1.00 Month
Syringe
6.00 Month
6.00 Month
Cartridge
Descriptive Properties Value Comments
Color Gray
Filler Silver/Copper Heat Cure
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