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Parker Chomerics CHO-BOND 360-208 Conductive Epoxy

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Parker Chomerics
Trade Name CHO-BOND
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics CHO-BOND 360-208 Conductive Epoxy.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting EMI/RFI shielding compound and is effective even for designs requiring the use of a fillet as opposed to a flanged bead.Applications: Typically include sealing EMI/RFI leaks around vents, windows, and machined surfaces; the bonding and shielding of conduit bulkhead passthroughs.Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 3.60 - 4.40 g/cc
3.60 - 4.40 g/cc
Volatile Organic Compounds (VOC) Content 0.00 g/l
0.00 g/l
Thickness >= 254 microns
>= 10.0 mil
Mechanical Properties Metric English Comments
Shear Strength 9.65 MPa

@Temperature 100 °C,
Time 2700 sec
1400 psi

@Temperature 212 °F,
Time 0.750 hour
Lap
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 100 °C
212 °F
Minimum Service Temperature, Air -62.0 °C
-79.6 °F
Electrical Properties Metric English Comments
Volume Resistivity <= 0.010 ohm-cm

@Temperature 100 °C,
Time 2700 sec
<= 0.010 ohm-cm

@Temperature 212 °F,
Time 0.750 hour
Processing Properties Metric English Comments
Cure Time 15.0 min

@Temperature 115 °C
0.250 hour

@Temperature 239 °F
45.0 min

@Temperature 100 °C
0.750 hour

@Temperature 212 °F
60.0 min

@Temperature 95.0 °C
1.00 hour

@Temperature 203 °F
120 min

@Temperature 66.0 °C
2.00 hour

@Temperature 151 °F
1440 min

@Temperature 24.0 °C
24.0 hour

@Temperature 75.2 °F
Pot Life 60 min
60 min
Shelf Life 9.00 Month
9.00 Month
Descriptive Properties Value Comments
Binder Epoxy
Consistency Thick Paste
Coverage 9.9 cm2 / g
Filler Ag/Cu, Ag
Mix Ratio 100:33
Working Life 1 hr
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