Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Hexion Bakelite™ PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures  (disconti

Category Polymer , Thermoset , Filled/Reinforced Thermoset , Phenolic
Manufacturer
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexion Bakelite™ PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures  (disconti.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Phenolic molding compound, inorganically filled, glass fiber reinforced, high heat resistance, low heat expansion coefficient, highest resistance to pressure, high dimensional stability.Application areas: Motor vehicle engine attachments, insulating flanges, brake pistons, sensors, grinding disc centers, bearing parts, impellers, pulleys and pump parts.Information provided by Bakelite AGBakelite AG became a part of Hexion in 2005.
Physical Properties Metric English Comments
Density 2.00 g/cc
0.0723 lb/in³
ISO 1183
Apparent Bulk Density 0.970 g/cc
0.0350 lb/in³
ISO 60
Linear Mold Shrinkage, Flow 0.00 cm/cm
0.00 in/in
Compression molding; ISO 2577
0.0016 cm/cm
0.0016 in/in
Injection molding; ISO 2577
Mechanical Properties Metric English Comments
Ball Indentation Hardness 450 MPa
65300 psi
H 961/30; ISO 2039/P1
Flexural Strength 100 MPa
14500 psi
2 mm/min; ISO 178
Flexural Modulus 17.0 GPa
2470 ksi
ISO 178
Charpy Impact Unnotched 0.600 J/cm²

@Temperature 23.0 °C
2.86 ft-lb/in²

@Temperature 73.4 °F
ISO 179-1/2 eU
Charpy Impact, Notched 0.200 J/cm²

@Temperature 23.0 °C
0.952 ft-lb/in²

@Temperature 73.4 °F
ISO 179-1/2 eA
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 160 °C
320 °F
<20000 hours; IEC 60216-P1
280 °C
536 °F
< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa 170 °C
338 °F
ISO 75-2
Shrinkage 0.0300 %

@Temperature 110 °C
0.0300 %

@Temperature 230 °F
Compression molding; ISO 2577
0.0800 %

@Temperature 110 °C,
Time 605000 sec
0.0800 %

@Temperature 230 °F,
Time 168 hour
Injection molding; ISO 2577
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+12 ohm-cm
1.00e+12 ohm-cm
IEC 60093
Surface Resistance 1.00e+11 ohm
1.00e+11 ohm
IEC 60093
Dielectric Constant 6.0

@Frequency 100 Hz
6.0

@Frequency 100 Hz
IEC 60250
Dielectric Strength 30.0 kV/mm

@Thickness 1.00 mm
762 kV/in

@Thickness 0.0394 in
IEC 60243-P1
Dissipation Factor 0.050

@Frequency 100 Hz
0.050

@Frequency 100 Hz
IEC 60250
Processing Properties Metric English Comments
Feed Temperature 60.0 - 75.0 °C
140 - 167 °F
Injection molding
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Melt Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Mold Temperature 160 - 190 °C
320 - 374 °F
Injection molding
160 - 190 °C
320 - 374 °F
Compression molding
Injection Pressure >= 15.0 MPa
>= 2180 psi
Compression and injection cavity mold pressure
Back Pressure 0.500 - 2.00 MPa
72.5 - 290 psi
Injection molding
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Descriptive Properties Value Comments
Chromatic Spectrum All Colors
Creep Rupture Strength Very Good
Holding Pressure Approximately 40-60% of injection pressure
Media Resistance Very Good
Moisture Absorption 5 mg
ISO 62, 24 hours at 23°C
Reserves by Peak Temperature Very High
Thermal Expansion Very Slight
Copyright © lookpolymers.com All Rights Reserved