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Master Bond EP17HT One component epoxy system for bonding, sealing, coating and casting

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Master Bond Inc.
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP17HT One component epoxy system for bonding, sealing, coating and casting.pdf
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Material Notes:
Product Description: Master Bond EP17HT is an one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation profile and chemical resistance even with heat exposure to 650°F. Its glass transition temperature (Tg) is 220-225°C. This system is also distinctive in that it has very low exotherm upon curing and can be used in castings and encapsulations well beyond ½ inch in thickness. The minimum curing temperature for EP17HT is 300°F with faster cures attainable at higher temperatures. EP17HT is 100% reactive and contains no solvents or diluents. EP17HT bonds well to similar as well as dissimilar substrates such as metal, ceramics, plastics and composites. It has a striking resistance to many chemicals such as acids, bases, salts, fuels, oils and many solvents. Shrinkage upon cure is minimal. It is serviceable from -80°F to +650°F. This system is tan in color. EP17HT retains its exceptional electrical insulation properties, even at higher temperatures. It should be noted, in order to obtain the optimum properties, a post cure of 2-12 hours at 350°F is recommended. It is widely used in a variety of applications in the aerospace, oil and chemical processing and specialty OEM industries. A paste version, EP17HTND-2, in black is also available. Product Advantages: Single component system; no mixing prior to use Easy application; only positive contact pressure required during heat cure High tensile, lap shear and compressive strength properties 100% reactive. Contains no solvents, diluents or volatiles High temperature resistance. Staggering Tg Tip-top electrical insulation properties, even at higher temperaturesInformation provided by MasterBond®
Physical Properties Metric English Comments
Solids Content 100 %
100 %
Viscosity 15000 - 25000 cP
15000 - 25000 cP
Mechanical Properties Metric English Comments
Hardness, Shore D >= 80
>= 80
Tensile Strength at Break 68.9 MPa
10000 psi
Tensile Modulus 2.76 - 3.10 GPa
400 - 450 ksi
Compressive Strength >= 138 MPa
>= 20000 psi
Shear Strength 15.9 MPa

@Temperature 204 °C
2300 psi

@Temperature 400 °F
22.1 MPa

@Temperature 23.9 °C
3200 psi

@Temperature 75.0 °F
tensile lap, aluminum to aluminum
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 343 °C
650 °F
Minimum Service Temperature, Air -62.2 °C
-80.0 °F
Glass Transition Temp, Tg 220 - 225 °C
428 - 437 °F
Electrical Properties Metric English Comments
Volume Resistivity >= 1.00e+12 ohm-cm

@Temperature 400 °C
>= 1.00e+12 ohm-cm

@Temperature 752 °F
>= 1.00e+15 ohm-cm

@Temperature 75.0 °C
>= 1.00e+15 ohm-cm

@Temperature 167 °F
Dielectric Constant 4.4

@Frequency 60.0 Hz,
Temperature 25.0 °C
4.4

@Frequency 60.0 Hz,
Temperature 77.0 °F
4.7

@Frequency 60.0 Hz,
Temperature 204 °C
4.7

@Frequency 60.0 Hz,
Temperature 399 °F
Dissipation Factor 0.0080

@Frequency 60.0 Hz,
Temperature 25.0 °C
0.0080

@Frequency 60.0 Hz,
Temperature 77.0 °F
0.018

@Frequency 60.0 Hz,
Temperature 204 °C
0.018

@Frequency 60.0 Hz,
Temperature 399 °F
Processing Properties Metric English Comments
Cure Time 60.0 - 90.0 min

@Temperature 177 °C
1.00 - 1.50 hour

@Temperature 350 °F
90.0 - 120 min

@Temperature 149 °C
1.50 - 2.00 hour

@Temperature 300 °F
120 min

@Temperature 149 °C
2.00 hour

@Temperature 300 °F
plus 2-12 hrs at 350°F
Shelf Life 3.00 - 6.00 Month

@Temperature 4.44 - 7.22 °C
3.00 - 6.00 Month

@Temperature 40.0 - 45.0 °F
in original, unopened containers
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