Polymer Property : CTE, linear = 51.0 µm/m-°C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	51.0 µm/m-°C @Thickness 1.00 mm, Temperature 125 - 175 °C	28.3 µin/in-°F @Thickness 0.0394 in, Temperature 257 - 347 °F	ASTM E831-06
NeXolve LaRC™-CP1 Polyimide Transparent polyimide with low moisture uptake and low dielectric constant. Transparent polyimide with low moisture uptake and low dielectric constant. LaRC™ CP1 exhibits the lowest moisture uptak..
CTE, linear	51.0 µm/m-°C @Temperature 20.0 °C	28.3 µin/in-°F @Temperature 68.0 °F	NOVA Chemicals Laboratory Procedure
NOVA Chemicals DYLARK® 480P16 Glass Reinforced Engineering Resin Features:Very high modulus High heat resistance Excellent flow characteristics Excellent adhesion to urethaneApplications:Instrument panel substrates Consoles Cluster housings Interior trimInformati..
CTE, linear	51.0 µm/m-°C @Temperature -30.0 - 40.0 °C	28.3 µin/in-°F @Temperature -22.0 - 104 °F	ASTM D696
Eastman EASTALLOY Polymer DA003-8999K, Clear Alloy (discontinued **) Properties below based on a film thickness of 250 microns. CO2 Permeability is 49 cm3·mm/m2·24h·atm per ASTM D 1434.Product Description: EASTALLOY DA003-8999K Polymer is a clear copolyester/pol..
CTE, linear	51.0 µm/m-°C	28.3 µin/in-°F
Master Bond EP36CLV One Component Heat Resistant Liquid Flexible Epoxy Master Bond Polymer System EP36CLV is a one component, high temperature resistant, B staged epoxy that cures with excellent toughness and is far less rigid than typical high temperature resistant ep..
CTE, linear	51.0 µm/m-°C @Temperature 40.0 - 130 °C	28.3 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 2000 Phenolic, Granular, Injection Molded PLENCO 02000 is a versatile general purpose, organic filled phenolic molding compound, offering optimum cure characteristics and an excellent balance of molding properties. UL recognized under compo..
CTE, linear	51.0 µm/m-°C @Temperature 40.0 - 130 °C	28.3 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 4304 Phenolic, Nodular, Transfer Molded PLENCO 04304 is a heat resistant, mineral filled phenolic molding compound offering improved mechanical strength properties along with excellent dimensional stability. UL recognized under component ..
CTE, linear	51.0 µm/m-°C @Temperature 40.0 - 130 °C	28.3 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 7100 Phenolic, Nodular, Injection Molded PLENCO 07100 is an organic fiber reinforced phenolic molding compound, with improved mechanical strength properties and an industrial finish. 07100 is densified for easy handling and good pourabilit..
CTE, linear	51.0 µm/m-°C @Temperature 40.0 - 130 °C	28.3 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 4568 Phenolic, Granular, Compression Molded PLENCO 04568 is a heat resistant, mineral and flock filled, phenolic molding compound, formulated to provide thermal oxidation stability along with excellent dimensional stability. 04568 is availabl..
CTE, linear	51.0 µm/m-°C @Temperature 20.0 °C	28.3 µin/in-°F @Temperature 68.0 °F	ASTM D696
Eastman Drystar 0601 Copolyester, Injection Molded This product-line is designed to meet the needs of converters seeking value-added solutions to their drying requirements of copolyesters. Eastman’s copolyesters are highly valued for their excellen..
CTE, linear	51.0 µm/m-°C	28.3 µin/in-°F	ASTM D696
Eastman Eastman 1223 Copolyester Applications:Blown filmCredit cardsDebit cardsDeodorant packagingElectronic packagingFabricated boxesFlexible packagingFood packagingFurniture/Furniture trimGaming cardsGift cardsIdentification card..
CTE, linear	51.0 µm/m-°C	28.3 µin/in-°F	ASTM D696
Eastman GSP01 Copolyester for Film and Sheet Extrusion Applications:Consumer e-packaging trayElectronic packagingElectrostatic dissipative trayProduct Description: GSP01 is a clear, amorphous material. Because of its clarity, toughness and good melt s..
CTE, linear	51.0 µm/m-°C @Temperature 50.0 - 200 °C	28.3 µin/in-°F @Temperature 122 - 392 °F	DIN 53 752
Ensinger TECASINT 1061 Polyimide, 15% Graphite, 10% PTFE Filled (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel..
CTE, linear	51.0 µm/m-°C	28.3 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® 360ST High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a slightly th..
CTE, linear	51.0 µm/m-°C @Temperature 20.0 °C	28.3 µin/in-°F @Temperature 68.0 °F	ASTM D696
Gharda Chemicals Gafone™ B2300 Polysupersulfone (PSS) (discontinued **) Characteristics: Excellent Dimensional properties Transparent Improved Impact Strength and Toughness as compared to PES Excellent Hydorlytic Stability High Stress Cracking Resistance Good Chemical..