Polymer Property : CTE, linear = 32.8 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	59.0 - 108 µm/m-°C	32.8 - 60.0 µin/in-°F	Average value: 94.6 µm/m-°C Grade Count:9
Overview of materials for Thermoplastic Olefinic Elastomer (TPO), Extrusion Grade This property data is a summary of similar materials in the MatWeb database for the category "Thermoplastic Olefinic Elastomer (TPO), Extrusion Grade". Each property range of values reported is mini..
CTE, linear	59.0 µm/m-°C @Temperature 20.0 °C	32.8 µin/in-°F @Temperature 68.0 °F	ASTM D228
Dow INSPIRE™ D7000 Thermoplastic Polyolefin (discontinued **) Information provided by DowThe Inspire brand was spun off from Dow Chemical to Styron in 2010, although this grade had previously been removed from Dow's standard product line.
CTE, linear	59.0 µm/m-°C @Temperature 20.0 °C	32.8 µin/in-°F @Temperature 68.0 °F	DIN 53752
Polycasa COPOL PETG QUINN COPOL has good optical properties, brilliant surface, easy to vacuum form without pre-drying, low water absorption, very good chemical resistance, and high impact properties.Bus shelters (UV-v..
CTE, linear	59.0 µm/m-°C @Temperature 20.0 °C	32.8 µin/in-°F @Temperature 68.0 °F	ASTM data
BASF Capron® 8230G HS 6% Glass-Filled Nylon 6 (Dry) (discontinued **) Capron 8230G HS is a heat stabilized, 6% nylon 6 molding compound offering improved stiffness and dimensional stability in thin sections. It exhibits a combination of strength, stiffness and perfor..
CTE, linear	59.0 µm/m-°C @Temperature 40.0 - 130 °C	32.8 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 2000 Phenolic, Granular, Compression Molded PLENCO 02000 is a versatile general purpose, organic filled phenolic molding compound, offering optimum cure characteristics and an excellent balance of molding properties. UL recognized under compo..
CTE, linear	59.0 µm/m-°C @Temperature 40.0 - 130 °C	32.8 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 2308 Phenolic, Granular, Injection Molded PLENCO 02308 is a general purpose organic filled phenolic molding compound, offering improved heat resistance and optimized cure properties. UL recognized under component file E40654. 02308 is avai..
CTE, linear	59.1 µm/m-°C	32.8 µin/in-°F
Hexcel® HexPly® M42 180°C (350°F) Curing Epoxy Matrix HexPly® M42 is a high performance, self extinguishing, self adhesive, tough epoxy matrix for use in primary aerospace sandwich structures. It exhibits very high impact resistance and damage toleran..
CTE, linear	59.0 µm/m-°C	32.8 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® T7109-19 Electrically Insulating Epoxy Paste Material Description: A flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is an alternative to EPO-TEK® T7109-17, de..
CTE, linear	59.0 µm/m-°C	32.8 µin/in-°F	Below Tg
3M Scotch-Weld™ DP460 Off-White Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP460 Off-White and DP460 NS are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion and very high levels of durability.Informat..
CTE, linear	59.0 µm/m-°C @Temperature 20.0 °C	32.8 µin/in-°F @Temperature 68.0 °F
Aremco Aremco-Bond™ 807 High Performance Epoxide 10 Minute Set, Non-Sagging, 1:1, Excellent Electrical & Mechanical Properties
CTE, linear	59.0 µm/m-°C	32.8 µin/in-°F	ASTM E831-93
Saint-Gobain Meldin® 2030 Bearing General Notes on Meldin 2000 Series Bearing Products:For High-Temperature, Close-Tolerance Applications. Able to withstand temperatures of 600°F with excursions to 900°F, the Medlin 2000 Series ca..