Physical Properties | Metric | English | Comments |
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Viscosity | 3500 - 4500 cP | 3500 - 4500 cP | Liquid State |
Palm Labs Adhesives TURBO FUSE SERIES 190-HT (4000 cp HIGH TEMPERATURE) Rapid Bonding Adhesive Palm Lab's Cyanoacrylate is a one component rapid bonding adhesive. TURBO FUSE SERIES 190-HT advanced formula is designed to polymerize instantly by absorbing surface moisture and is recommended for.. |
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Viscosity | 3500 cP @Temperature 25.0 °C |
3500 cP @Temperature 77.0 °F |
Uncured |
Permabond HM163 Anaerobic Retainer Permabond® HM163 is a medium viscosity, thixotropic anaerobic retaining compound that cures when confined between metal parts to form a tough bond. It has been specifically formulated to provide a .. |
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Viscosity | 3500 - 10000 cP | 3500 - 10000 cP | |
Huntsman Araldite GZ 9625 W-90 Bisphenol A Epoxy Solution Weight per Epoxide (EEW, g/eq) 230 to 280. Max color is 3.Comments/Applications: Bisphenol A epoxy resin cut in n-Butanol. High solids coatings for maintenance and marine applications.Data provide.. |
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Viscosity | 3500 - 4000 cP | 3500 - 4000 cP | as supplied |
Industrial Nanotech Nansulateâ„¢ GP Translucent Insulation Coating Liquid insulation and corrosion protection incorporating Hydro-NM-Oxide, a product of nanotechnology. This grade is for general purpose insulation.NANSULATEâ„¢ liquid applied insulation is a prem.. |
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Viscosity | 3500 cP | 3500 cP | Mixed Viscosity |
ITW Devcon Safety Clear Coatâ„¢ Epoxy, Water Clear Information provided by ITW Devcon |
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Viscosity | 3500 - 7000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
3500 - 7000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2040308D2 Silver/Silver Chloride Paste Silver/Silver Chloride Paste has a ratio of Silver to Silver Chloride of 40/60. The paste is in a ready to use form at a viscosity suitable for automatic or semi-automatic screen printing. The paste.. |
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Viscosity | 3500 - 7000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
3500 - 7000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2051014P10 Silver/Silver Chloride Paste Silver/Silver Chloride Paste has a ratio of Silver to Silver Chloride of 70/30. Applications in medical diagnostics, environmentalScreen Printing Equipment: semi-automatic, manualScreen Types: polye.. |
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Viscosity | 3500 - 4500 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
3500 - 4500 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2070508D4 Carbon Graphite Ink This Carbon Graphite Ink is designed to be used for screen printing working electrodes. These electrodes enable the detection of many analytes when used in conjunction with peroxidase and other oxi.. |
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Viscosity | 3500 - 7000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
3500 - 7000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2080409D2 Silver/Silver Chloride Paste Silver/Silver Chloride Paste has a ratio of Silver to Silver Chloride of 85/15. The paste is in a ready to use form at a viscosity suitable for automatic or semi-automatic screen printing. The paste.. |
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Viscosity | 3500 - 5000 cP | 3500 - 5000 cP | |
Lucite International Colacryl ® 1204 Acrylic Solution Resin Butyl Methacrylate polymers are more flexible and softer than Methyl Methacrylate types. The polymers are compatible with nitrocellulose, chlorinated rubber, some phenolics and maleics. Butyl methac.. |
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Viscosity | 3500 - 5500 cP | 3500 - 5500 cP | ASTM D803 |
SK Chemicals SKYTHANE® U1731C Magnetic Binder Description: SK Chemicals has supplied Thermoplastic Polyurethane Elastomer (TPU) under the name of SKYTHANE. Applications include:Keyboard CoversOutsoles of Soccer ShoesWire and CableAirbagsSheets .. |
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Viscosity | 3500 cP | 3500 cP | Mixed (cp #52, 100 rpm) |
Tra-Con Tra-Bond 221N01 Information provided by Tra-Con Inc. |
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Viscosity | 3500 cP @Temperature 25.0 °C |
3500 cP @Temperature 77.0 °F |
After mixing |
Tra-Con Tra-Bond 400-5 Low Temperature Cure Epoxy Adhesive TRA-BOND 400-5 adhesive is a general purpose non-conductive epoxy. It combines the properties of a moderate work life with the ability to cure rapidly at temperatures as low as 60°C. Having a relat.. |
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Viscosity | 3500 cP | 3500 cP | Part A at 20 RPM |
Loctite® 3292 Acrylic Bonding Adhesive Acrylic Bonding AdhesivesLoctite® Acrylic Adhesives were developed for bonding applications that require tensile, shear and peel strength combined with maximum impact, stress and shock resistance. .. |
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Viscosity | 3500 cP | 3500 cP | Part B at 20 RPM |
Loctite® 3292 Acrylic Bonding Adhesive Acrylic Bonding AdhesivesLoctite® Acrylic Adhesives were developed for bonding applications that require tensile, shear and peel strength combined with maximum impact, stress and shock resistance. .. |
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Viscosity | 3500 - 6000 cP @Temperature 23.0 °C |
3500 - 6000 cP @Temperature 73.4 °F |
50 rpm |
Epoxy Technology EPO-TEK® 383ND High Temperature Epoxy Material Description: A slightly longer pot life version of EPO-TEK®353ND designed for high temperature, optical and structural applications inside the semiconductor, hybrid, electronic, fiber opti.. |
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Viscosity | 3500 - 6000 cP @Temperature 23.0 °C |
3500 - 6000 cP @Temperature 73.4 °F |
50 rpm |
Epoxy Technology EPO-TEK® H20-HC Electrically Conductive Epoxy Product Description: EPO-TEK® H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al.. |
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Viscosity | 3500 cP @Temperature 25.0 °C |
3500 cP @Temperature 77.0 °F |
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Esstech X-726-0000 PEG 400 Extended Urethane Dimethacrylate, C54H98N4O21 Our extended UDMA is commonly used in light cure systems. Its PEG 400 portion creates a more flexible polymer upon curing. Adding this product has been shown to increase the fracture toughness of ur.. |
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Viscosity | 3500 cP | 3500 cP | dynamic |
Dow Corning 1410 ANTIFOAM Stable at high and low pH's. 10 percent active silicone emulsion designed to control foam in aqueous systemsInformation provided by Dow Corning |
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Viscosity | 3500 cP | 3500 cP | Dynamic |
Dow Corning XIAMETER® PMCPOFX-8630 Fluid Is chemically equivalent to DOW CORNING® 2-8630 POLYMER. 100% active, amino-functional silicone polymer.Information provided by Dow Corning |
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Viscosity | 3500 cP | 3500 cP | |
Dymax 928 Coil Terminating, Tamper proofing and Structural Electronic Bonder High Performance Light-Curing Adhesives and Coatings for Electronic AssemblyDymax 928 Coil Terminating, Tamper proofing and Structural Electronic BonderHigh strength, excellent bridge bonding capabi.. |
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Viscosity | 3500 - 4200 cP @Temperature 35.0 °C |
3500 - 4200 cP @Temperature 95.0 °F |
Dynamic viscosity |
C.O.I.M. PLAXTER® P 60 Polymeric Plasticizer Description: Formulated with PVC, it is used for the production of fuel pipes, solvents or other oil products.Information provided by P.A.T. Products, Inc. |
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Viscosity | >= 3500 cP | >= 3500 cP | Base |
3M Scotch-Weld™ DP807 Acrylic Adhesives 3M™ Scotch-Weld™ Acrylic Adhesive DP807 is a two-part, 1:1 mix ratio, toughened acrylic structural adhesives. They exhibit excellent shear and peel strengths along with good impact, durability and.. |
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Viscosity | >= 3500 cP | >= 3500 cP | Base |
3M Scotch-Weld™ DP812 Acrylic Adhesives 3M™ Scotch-Weld™ Acrylic Adhesive DP812 is a two-part, 1:1 mix ratio, toughened acrylic structural adhesives. They exhibit excellent shear and peel strengths along with good impact, durability and.. |
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Viscosity | >= 3500 cP | >= 3500 cP | Base |
3M Scotch-Weld™ DP825 Acrylic Adhesives 3M™ Scotch-Weld™ Acrylic Adhesive DP825 is a two-part, 1:1 mix ratio, toughened acrylic structural adhesives. They exhibit excellent shear and peel strengths along with good impact, durability and.. |
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Viscosity | 3500 cP | 3500 cP | |
Resinlab® TL5062 Anaerobic Threadlocking Compound The TL5000 Series anaerobic threadlocking compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. They form a .. |
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Viscosity | 3500 cP | 3500 cP | Part A, RVT, #3, 20 rpm; TM R050-12 |
Resinlab® EP1310 Medium Reactivity Epoxy Encapsulant Resinlab™ EP1310 is a two part medium reactivity epoxy encapsulant capable of being quickly gelled prior to full cure by exposing to a UV light source. Usually 5- 10 seconds is sufficient to gel th.. |