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Polymer Property : Viscosity = 11000 cP Product List
Physical PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Viscosity | 11000 cP @Shear Rate 11200 1/s, Temperature 200 °C |
11000 cP @Shear Rate 11200 1/s, Temperature 392 °F |
ASTM D3835 |
| PolyOne Dynaflex™ G2701-1000-02 Thermoplastic Elastomer (TPE) Dynaflex™ G2701-1000-02 is an easy processing TPE designed for injection molding and extrusion applications that require FDA compliance. - Adhesion to Polypropylene - Excellent Colorability - Good .. |
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| Viscosity | 11000 cP | 11000 cP | Mixed; TM R050-12 |
| Resinlab® EP965 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting .. |
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| Viscosity | 11000 - 15000 cP @Temperature 25.0 °C |
11000 - 15000 cP @Temperature 77.0 °F |
Of resin |
| Resin Technology Group TIGA 101-EX Five-Minute Epoxy Adhesive 1 part resin to 1 part hardener.TIGA 101-EX is an exceptional epoxy formulation, recommended for lower temperature or wet industrial bonding applications where fast curing is required. This clear, t.. |
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| Viscosity | 11000 cP @Temperature 175 °C |
11000 cP @Temperature 347 °F |
Automatic orifice Viscosity |
| Cookson Group Plaskon® PPF-165A Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A conventional molding compound specifically formulated for semiconductor devices which are molded with preplated leadframes. Lo.. |
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| Viscosity | 11000 - 14000 cP | 11000 - 14000 cP | |
| Huntsman Araldite GY 6010 Bisphenol A Epoxy Liquid Resin Weight per Epoxide (EEW, g/eq) 182 to 192. Max color is 1.Comments/Applications: Unmodified basic liquid epoxy resin based on bis A and epichlorohydrin. General purpose, highly versatile resin for.. |
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| Viscosity | 11000 - 13000 cP | 11000 - 13000 cP | |
| Huntsman MY 9512 Multifunctional Resin Weight per Epoxide (EEW, g/eq) 117 to 134. Color: BrownComments/Applications: Narrow viscosity MY 720. Used for high performance composites, adhesives, laminates and high energy radiation resistant.. |
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| Viscosity | 11000 - 14000 cP | 11000 - 14000 cP | |
| Huntsman Quatrex 1010 Bisphenol A Epoxy Resin Weight per Epoxide (EEW, g/eq) 182 to 190.Comments/Applications: High purity bisphenol-A based epoxy resin.Data provided by Ciba Specialty Chemicals.Ciba Specialty Chemicals has been acquired by Hun.. |
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| Viscosity | 11000 - 18000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
11000 - 18000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
| Gwent Electronic Materials C2060217P3 Lead-free Silver Topcoat Ink This product is a Lead free version of C70709D21. Silver Ink C2060217D3 is designed as a top coat for Silver Zinc Ink C2061103D7 printed on PTC ceramics. Screen Printing Equipment: semi-automatic, m.. |
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| Viscosity | 11000 - 16000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
11000 - 16000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
| Gwent Electronic Materials C2061103D7 Lead free Silver Zinc Basecoat Paste This product is a lead-free version of C70709D22. The ink is designed as a screen printing ink for coating Barium Titanate PTC ceramics as the base layer of a two part system. The dried film should.. |
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| Viscosity | 11000 cP @Temperature 25.0 °C |
11000 cP @Temperature 77.0 °F |
|
| Momentive Performance Materials RTV11 White General Purpose Potting/Encapsulating Compound Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate.. |
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| Viscosity | 11000 - 18000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
11000 - 18000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
| Gwent Electronic Materials C2100217D1 Aluminium for PTC paste Aluminium Ink designed to give good ohmic contact on to barium titanate PTC components. This product is particularly good where large volumes of PTC components are being processed in belt furnaces .. |
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| Viscosity | 11000 cP @Shear Rate 10994 1/s, Temperature 210 °C |
11000 cP @Shear Rate 10994 1/s, Temperature 410 °F |
ASTM D3835 |
| STAR Thermoplastic Alloys & Rubbers StarMediflex P 7070-1000 TPE Product Description: StarMediflex P 7070-1000 is an easy processing TPE designed for injection molding. This particular class of TPE material for medical products and tubing applications. Features:S.. |
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| Viscosity | 11000 - 15000 cP | 11000 - 15000 cP | Part B |
| Master Bond EP21LV-LO Two Component, Lower Viscosity, Room Temperature Curing Epoxy System Product Description: Master Bond EP21LV-LO is a two component, lower viscosity, room temperature curing epoxy system for high performance bonding, sealing, coating and encapsulation. This user frien.. |
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| Viscosity | 11000 - 15000 cP | 11000 - 15000 cP | Part B |
| Master Bond EP21LVMed Two Component, Low Viscosity USP Class VI Epoxy Master Bond EP21LVMed is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room tempera.. |
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| Viscosity | 11000 cP @Temperature 25.0 °C |
11000 cP @Temperature 77.0 °F |
Mixed |
| Trelleborg Emerson & Cuming Eccobond® 927-10 E Needle Bonding Epoxy Adhesive Emerson & Cuming 927-10 E Eccobond® Needle Bonding Epoxy AdhesiveOne component, fast curing, epoxy adhesive for needle bonding with polypropylene hubs. Also recommended for bonding sealing or insul.. |
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| Viscosity | 11000 - 15000 cP | 11000 - 15000 cP | Part B |
| Master Bond EP21CLV Two Component Epoxy System Product Description: Master Bond EP21CLV is a two component, lower viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It features easy handling a.. |
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| Viscosity | 11000 cP | 11000 cP | |
| Loctite® PRISM® 4212 Instant Adhesive Gel Cyanoacrylate Bonding AdhesivesLoctite® technology has made the productivity promises of cyanoacrylate adhesives a reality with the industry's widest selection of high-performance, application-.. |
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| Viscosity | 11000 - 17000 cP @Temperature 23.0 °C |
11000 - 17000 cP @Temperature 73.4 °F |
20 rpm |
| Epoxy Technology EPO-TEK® 353ND-T4 Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T4 is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. This is a higher viscosity version of EPO-TEK® 353.. |
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| Viscosity | 11000 - 14000 cP @Temperature 23.0 °C |
11000 - 14000 cP @Temperature 73.4 °F |
20 rpm |
| Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f.. |
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| Viscosity | 11000 - 14000 cP @Temperature 23.0 °C |
11000 - 14000 cP @Temperature 73.4 °F |
20 rpm |
| Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
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| Viscosity | 11000 cP | 11000 cP | mixed |
| Aremco Ceramacast™ 575-N High Temperature Potting & Casting Material Alumina Fine grain castable for potting and producing small tools. |
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| Viscosity | 11000 cP @Temperature 177 °C |
11000 cP @Temperature 350 °F |
Typical |
| Bostik 6327 Color Blending, Low Viscosity, Flexible EVA Glue Stick Bostik 6327 Color Blending, Low Viscosity, Flexible EVA Glue StickAdhesive color blends with substrate. Flexible, no cracking. Low viscosity. Easy to gun. |
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| Viscosity | 11000 - 13000 cP | 11000 - 13000 cP | Uncured, after Mixing |
| Atom Adhesives AA-BOND 2156 Epoxy Adhesive AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compone.. |
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| Viscosity | 11000 - 14000 cP | 11000 - 14000 cP | Dynamic |
| Dow Corning 3-0135 Cosmetic Fluid Polydimethylsiloxane polymer with terminated, curable silanol functionality.Information provided by Dow Corning |
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| Viscosity | 11000 cP | 11000 cP | Mixed; TM R050-12 |
| Resinlab® EP1026R Rubber Modified Epoxy Adhesive Resinlab™ EP1026R is a two part unfilled rubber modified epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free .. |
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| Viscosity | 11000 cP | 11000 cP | Mixed; TM R050-12 |
| Resinlab® EP965 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting .. |
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