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Polymer Property : Viscosity = 11000 cP Product List
Physical PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Viscosity | 11000 - 15000 cP @Temperature 25.0 °C |
11000 - 15000 cP @Temperature 77.0 °F |
Of resin |
| Resin Technology Group TIGA 101-EX Five-Minute Epoxy Adhesive 1 part resin to 1 part hardener.TIGA 101-EX is an exceptional epoxy formulation, recommended for lower temperature or wet industrial bonding applications where fast curing is required. This clear, t.. |
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| Viscosity | 11000 cP @Temperature 175 °C |
11000 cP @Temperature 347 °F |
Automatic orifice Viscosity |
| Cookson Group Plaskon® PPF-165A Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A conventional molding compound specifically formulated for semiconductor devices which are molded with preplated leadframes. Lo.. |
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| Viscosity | 11000 - 14000 cP | 11000 - 14000 cP | |
| Huntsman Araldite GY 6010 Bisphenol A Epoxy Liquid Resin Weight per Epoxide (EEW, g/eq) 182 to 192. Max color is 1.Comments/Applications: Unmodified basic liquid epoxy resin based on bis A and epichlorohydrin. General purpose, highly versatile resin for.. |
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| Viscosity | 11000 - 13000 cP | 11000 - 13000 cP | |
| Huntsman MY 9512 Multifunctional Resin Weight per Epoxide (EEW, g/eq) 117 to 134. Color: BrownComments/Applications: Narrow viscosity MY 720. Used for high performance composites, adhesives, laminates and high energy radiation resistant.. |
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| Viscosity | 11000 - 19000 cP @Shear Rate 100 1/s, Temperature 25.0 °C |
11000 - 19000 cP @Shear Rate 100 1/s, Temperature 77.0 °F |
Haake VT550 cone and plate viscometer (PK1.1°) |
| Gwent Electronic Materials C2000107P3 Silver Ink Silver Ink C2000107P3 is designed as a termination for single layer PZT ceramics. After firing the film has good adhesion and solderability.The ink is in a ready to use form at a viscosity suitable.. |
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| Viscosity | 11000 - 18000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
11000 - 18000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
| Gwent Electronic Materials C2060217P3 Lead-free Silver Topcoat Ink This product is a Lead free version of C70709D21. Silver Ink C2060217D3 is designed as a top coat for Silver Zinc Ink C2061103D7 printed on PTC ceramics. Screen Printing Equipment: semi-automatic, m.. |
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| Viscosity | 11000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
11000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
| Gwent Electronic Materials G2020520D1 Gold Metallo-Organic Ink This is a screen printing ink designed to act as a working electrode when fired onto alumina substrates. This unique MO formulation gives a fired thickness in the order of 0.2 to 0.3 microns. This.. |
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| Viscosity | 11000 cP @Temperature 25.0 °C |
11000 cP @Temperature 77.0 °F |
|
| Momentive Performance Materials RTV11 White General Purpose Potting/Encapsulating Compound Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate.. |
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| Viscosity | 11000 cP | 11000 cP | |
| Momentive Performance Materials RTV8112 Silicone Rubber Compounds for Potting, Encapsulating and Sealing RTV8111, RTV8112 and RTV8262 silicone rubber compounds are two-part silicone elastomers supplied in ready-to-use matched kits containing a base compound and curing agent.Mechanical and electrical pr.. |
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| Viscosity | 11000 cP @Temperature 25.0 °C |
11000 cP @Temperature 77.0 °F |
|
| Momentive Performance Materials RTV8112 White General Purpose Potting/Encapsulating Compound Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate.. |
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| Viscosity | 11000 - 18000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
11000 - 18000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
| Gwent Electronic Materials C2100217D1 Aluminium for PTC paste Aluminium Ink designed to give good ohmic contact on to barium titanate PTC components. This product is particularly good where large volumes of PTC components are being processed in belt furnaces .. |
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| Viscosity | 11000 cP @Shear Rate 10994 1/s, Temperature 210 °C |
11000 cP @Shear Rate 10994 1/s, Temperature 410 °F |
ASTM D3835 |
| STAR Thermoplastic Alloys & Rubbers StarMediflex P 7070-1000 TPE Product Description: StarMediflex P 7070-1000 is an easy processing TPE designed for injection molding. This particular class of TPE material for medical products and tubing applications. Features:S.. |
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| Viscosity | 11000 - 15000 cP | 11000 - 15000 cP | Part B |
| Master Bond EP21LV-LO Two Component, Lower Viscosity, Room Temperature Curing Epoxy System Product Description: Master Bond EP21LV-LO is a two component, lower viscosity, room temperature curing epoxy system for high performance bonding, sealing, coating and encapsulation. This user frien.. |
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| Viscosity | 11000 - 15000 cP | 11000 - 15000 cP | Part B |
| Master Bond EP21LVMed Two Component, Low Viscosity USP Class VI Epoxy Master Bond EP21LVMed is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room tempera.. |
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| Viscosity | 11000 - 15000 cP | 11000 - 15000 cP | Part A |
| Master Bond EP38CL Adhesive Features Toughness and Durability Description: Master Bond EP38CL is a lower viscosity, optically clear two component epoxy system for high performance bonding, coating, sealing and small encapsulations, featuring toughness and dura.. |
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| Viscosity | 11000 cP | 11000 cP | |
| Loctite® PRISM® 4212 Instant Adhesive Gel Cyanoacrylate Bonding AdhesivesLoctite® technology has made the productivity promises of cyanoacrylate adhesives a reality with the industry's widest selection of high-performance, application-.. |
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| Viscosity | 11000 cP @Temperature 25.0 °C |
11000 cP @Temperature 77.0 °F |
|
| Cytec (Conap) FR-1610 / EA-039 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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| Viscosity | 11000 - 18500 cP @Temperature 23.0 °C |
11000 - 18500 cP @Temperature 73.4 °F |
20 rpm |
| Epoxy Technology EPO-TEK® B912-8 Epoxy Product Description: A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a pot.. |
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| Viscosity | 11000 - 14000 cP @Temperature 23.0 °C |
11000 - 14000 cP @Temperature 73.4 °F |
20 rpm |
| Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
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| Viscosity | 11000 - 14000 cP | 11000 - 14000 cP | 50-3 |
| Abatron AboCast 50-3/AboCure 50-12 Epoxy Data provided by the manufacturer, Abatron, Inc. Light motor oil viscosity, almost colorless. Shelf life is 12+ months. |
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| Viscosity | 11000 cP @Temperature 177 °C |
11000 cP @Temperature 350 °F |
Typical |
| Bostik 6327 Color Blending, Low Viscosity, Flexible EVA Glue Stick Bostik 6327 Color Blending, Low Viscosity, Flexible EVA Glue StickAdhesive color blends with substrate. Flexible, no cracking. Low viscosity. Easy to gun. |
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| Viscosity | 11000 - 13000 cP | 11000 - 13000 cP | Uncured, after Mixing |
| Atom Adhesives AA-BOND 2156 Epoxy Adhesive AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compone.. |
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| Viscosity | 11000 cP | 11000 cP | Mixed; TM R050-12 |
| Resinlab® EP1026R Rubber Modified Epoxy Adhesive Resinlab™ EP1026R is a two part unfilled rubber modified epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free .. |
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| Viscosity | 11000 cP | 11000 cP | Mixed; TM R050-12 |
| Resinlab® EP965 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting .. |
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