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Parker Chomerics CHO-BOND SV712 Conductive Epoxy

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer	Parker Chomerics
Trade Name	CHO-BOND
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics CHO-BOND SV712 Conductive Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

CHO-BOND® 700 Series Adhesives for Microelectronics Packaging; these pure silver-filled epoxy pastes are designed to meet the demanding requirements of semiconductor and microelectronic packaging. They are one-component systems with a unique combination of excellent die shear strength, low coefficients of thermal expansion, ionic purity, and high thermal and electrical conductivities. Each offers and extended working life with viscosity and thixotropy suitable for both time/pressure and positive displacement dispensing methods. CHO-BOND® SV712 die attach adhesive has been optimized for high-speed, automated dispensing. It exhibits no resin bleed out on a variety of substrates and metallizations. Information provided by Chomerics

Physical Properties	Metric	English	Comments
Specific Gravity	3.00 - 3.60 g/cc	3.00 - 3.60 g/cc
Volatile Organic Compounds (VOC) Content	0.00 g/l	0.00 g/l
Solubility in Water	0.00 %	0.00 %	Insoluble
Thickness	25.4 microns	1.00 mil	Recommended

Mechanical Properties	Metric	English	Comments
Shear Strength	>= 7.58 MPa	>= 1100 psi	Lap
	>= 33.1 MPa	>= 4800 psi	Die

Thermal Properties	Metric	English
Maximum Service Temperature, Air	150 °C	302 °F
Minimum Service Temperature, Air	-45.0 °C	-49.0 °F
Flash Point	>= 93.3 °C	>= 200 °F

Component Elements Properties	Metric	English	Comments
Silver, Ag	60 - 85 %	60 - 85 %

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.00040 ohm-cm	<= 0.00040 ohm-cm	DC

Processing Properties	Metric	English
Cure Time	30.0 min @Temperature 150 °C	0.500 hour @Temperature 302 °F
	60.0 min @Temperature 125 °C	1.00 hour @Temperature 257 °F
Shelf Life	12.0 Month @Temperature -40.0 °C	12.0 Month @Temperature -40.0 °F

Descriptive Properties	Value	Comments
Amine Compound Proprietary wt. % Max	5
Binder	Epoxy
Consistency	Thixotropic Paste
Epoxy Resin, wt %	15 - 25
Filler	Ag
Mix Ratio	1-part
o-Cresyl glycidyle ether wt. % Max	10
Work Life	4 weeks

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