Category | Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced |
Manufacturer | Lord Adhesives |
Trade Name | Thermoset™ |
Port | Shanghai port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Lord Adhesives Thermosetâ„¢ ME-430 Epoxy Board Level Encapsulant.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Specific Gravity | 1.80 g/cc | 1.80 g/cc | |
Brookfield Viscosity | 255000 - 380000 cP @Temperature 25.0 °C |
255000 - 380000 cP @Temperature 77.0 °F |
Spindle 14 @ 1rpm |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Hardness, Shore D | 91 - 98 | 91 - 98 | |
Modulus of Elasticity | 6.00 GPa | 870 ksi | DMA |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | Below Tg; TMA |
Glass Transition Temp, Tg | 135 °C | 275 °F | TMA |
Component Elements Properties | Metric | English | Comments |
---|---|---|---|
Potassium, K | 0.00010 % | 0.00010 % | |
Sodium, Na | 0.00050 % | 0.00050 % |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Volume Resistivity | 1.00e+15 ohm-cm @Temperature 25.0 °C |
1.00e+15 ohm-cm @Temperature 77.0 °F |
|
Dielectric Constant | 3.7 @Frequency 1.00e+6 Hz |
3.7 @Frequency 1.00e+6 Hz |
|
Dissipation Factor | 0.0060 @Frequency 1.00e+6 Hz |
0.0060 @Frequency 1.00e+6 Hz |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
Pot Life | 1440 min @Temperature 25.0 °C |
1440 min @Temperature 77.0 °F |
|
Gel Time | 3.50 - 5.80 min @Temperature 150 °C |
3.50 - 5.80 min @Temperature 302 °F |
|
Shelf Life | 6.00 Month @Temperature -40.0 °C |
6.00 Month @Temperature -40.0 °F |
Descriptive Properties | Value | Comments |
---|---|---|
Appearance | Black | |
Chloride (%) | 0.0005 | |
Consistency | Paste |