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Category : Epoxy Encapsulant, Unreinforced Product List

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PRODUCT NO. Manufacturer Trade Name
Resinlab® EP965LVLX Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab®
Cookson Group Plaskon® 150.401 Encapsulation Resin  (discontinued **)
Huntsman Araldite DY 3601 Reactive Diluent Huntsman, former Ciba Specialty Chemicals Araldite
Huntsman Araldite EPN 1180 Epoxy Phenol Novolac Huntsman, former Ciba Specialty Chemicals Araldite
Huntsman Araldite GT 6450 Bisphenol A Epoxy Solid Resin Huntsman, former Ciba Specialty Chemicals Araldite
Huntsman Araldite GT 9654 Bisphenol A Epoxy Solid Resin Huntsman, former Ciba Specialty Chemicals Araldite
Huntsman Araldite GY 281 Bisphenol F Epoxy Resin Huntsman, former Ciba Specialty Chemicals Araldite
Huntsman Araldite GY 282 Bisphenol F Epoxy Resin Huntsman, former Ciba Specialty Chemicals Araldite
Huntsman Araldite GY 502 Bisphenol A Epoxy Liquid Resin Huntsman, former Ciba Specialty Chemicals Araldite
Huntsman Araldite GY 507 Bisphenol A Epoxy Liquid Resin Huntsman, former Ciba Specialty Chemicals Araldite
Huntsman Araldite GY 6008 Bisphenol A Epoxy Liquid Resin Huntsman, former Ciba Specialty Chemicals Araldite
Huntsman Araldite GZ 597 KT-55 Bisphenol A Epoxy Solution Huntsman, former Ciba Specialty Chemicals Araldite
Huntsman Araldite GZ 6097 PM-55 Bisphenol A Epoxy Solution Huntsman, former Ciba Specialty Chemicals Araldite
Huntsman Araldite RD-2 Reactive Diluent Huntsman, former Ciba Specialty Chemicals Araldite
Lord Adhesives Thermosetâ„¢ ME-430 Epoxy Board Level Encapsulant Lord Adhesives Thermoset™
Huntsman PT 810 Multifunctional Resin Huntsman, former Ciba Specialty Chemicals
Sumitomo Bakelite North America E 16521A Electrical Encapsulation Grade Epoxy Sumitomo Bakelite North America
Master Bond EP112M Two Component, Medium Viscosity Heat Curing Cycloaliphatic Epoxy Resin Master Bond Inc.
Master Bond EP17HT-3 One component, snap-curing epoxy system Master Bond Inc.
Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive Master Bond Inc.
Master Bond EP21TDCHTND Versatile, toughened two component epoxy for bonding, sealing and coating Master Bond Inc.
Master Bond UV10TKMed One component UV curable, biocompatible, high viscosity compound Master Bond Inc.
Trelleborg Emerson & Cuming Stycast® 906-1 One-Component Epoxy High Service Temp Encapsulant Trelleborg Emerson & Cuming, Inc. Stycast®
Trelleborg Emerson & Cuming Stycast® G-508-1 One-Component Epoxy Flame Retardant Encapsulant Trelleborg Emerson & Cuming, Inc. Stycast®
Loctite® 3563 Epoxy Snap Cure Underfill Loctite
Master Bond EP21TPFL-1AO Two Part, Flexible, Lower Viscosity Epoxy Polysulfide System Master Bond Inc.
Master Bond EP41SMed Two Component, Low Viscosity, USP Class VI Epoxy System Master Bond Inc.
Trelleborg Emerson & Cuming Stycast® 1365-65 Two-Component Epoxy Flexible Encapsulant Trelleborg Emerson & Cuming, Inc. Stycast®
Trelleborg Emerson & Cuming Stycast® 2760 Two-Component Easy Mix Ratio Encapsulant Trelleborg Emerson & Cuming, Inc. Stycast®
Trelleborg Emerson & Cuming Stycast® E 1400 Two-Component General Purpose Encapsulant Trelleborg Emerson & Cuming, Inc. Stycast®
Cytec (Conap) FR-1046 / EA-028 Conapoxy® Resin / Conacure® Hardener Cytec
Cytec (Conap) FR-1046 / EA-117 Conapoxy® Resin / Conacure® Hardener Cytec
Cytec (Conap) FR-1047 / EA-02 Conapoxy® Resin / Conacure® Hardener Cytec
Cytec (Conap) FR-1050 Conapoxy® Resin / Conacure® Hardener Cytec
Cytec (Conap) FR-1080 Conapoxy® Resin / Conacure® Hardener Cytec
Cytec (Conap) FR-1273 Conapoxy® Resin / Conacure® Hardener Cytec
Cytec (Conap) RN-1200 / EA-02 Conapoxy® Resin / Conacure® Hardener Cytec
Cytec (Conap) RN-1210 / EA-028 Conapoxy® Resin / Conacure® Hardener Cytec
Aptek 6100-1A/B Epoxy Encapsulant Aptek Laboratories
Aptek 6103-A/B Epoxy Encapsulant Aptek Laboratories
Aptek 6550-A/B Epoxy Encapsulant Aptek Laboratories
Trelleborg Emerson & Cuming Stycast® 2651MM/11 Two-Component General Purpose Encapsulant Trelleborg Emerson & Cuming, Inc. Stycast®
Resinlab® EP1300 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab®
Resinlab® EP1300 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab®
Resinlab® EP691 Unfilled Electronic Grade Epoxy Encapsulant Resinlab®
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