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- CP-Polymer-Technik Wellamid® 6600 GS 30 HWCP 30% Glass Sphere Filled Nylon 66, Heat Stabilized, Conditioned
CP-Polymer-Technik Wellamid® 6600 GS 30 HWCP 30% Glass Sphere Filled Nylon 66, Heat Stabilized, Conditioned
| Category | Polymer , Thermoplastic , Nylon , Nylon 66 , Nylon 66, Glass Bead Filled |
| Manufacturer | CP-Polymer-Technik GmbH & Co. |
| Trade Name | Wellamid® |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | CP-Polymer-Technik Wellamid® 6600 GS 30 HWCP 30% Glass Sphere Filled Nylon 66, Heat Stabilized, Conditioned.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Information provided by CP-Polymer-Technik GmbH & Co. KG
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.35 g/cc | 0.0488 lb/in³ | ISO 1183 |
| Moisture Absorption at Equilibrium | 1.8 - 2.3 % | 1.8 - 2.3 % | 23°C/50%RH, Starting when dry; DIN 53495 |
| Linear Mold Shrinkage | 0.0090 - 0.011 cm/cm @Thickness 4.00 mm |
0.0090 - 0.011 in/in @Thickness 0.157 in |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Tensile Strength at Break | 58.0 MPa | 8410 psi | 5 mm/min; ISO 527 |
| Elongation at Break | 18 % | 18 % | 5 mm/min; ISO 527 |
| Tensile Modulus | 2.20 GPa | 319 ksi | ISO 527 |
| Charpy Impact Unnotched | 5.50 J/cm² @Temperature 23.0 °C |
26.2 ft-lb/in² @Temperature 73.4 °F |
ISO 179 |
| Charpy Impact, Notched | 1.60 J/cm² @Temperature 23.0 °C |
7.61 ft-lb/in² @Temperature 73.4 °F |
ISO 179 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Melting Point | 255 °C | 491 °F | Kofler |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 1.00e+12 ohm-cm | 1.00e+12 ohm-cm | IEC 93 |
| Surface Resistance | 1.00e+10 ohm | 1.00e+10 ohm | ISO 3915 |
| Dielectric Constant | 6.0 @Frequency 1e+6 Hz |
6.0 @Frequency 1e+6 Hz |
IEC 250 |
| Dielectric Strength | 35.0 kV/mm | 889 kV/in | IEC 243-1 |
| Dielectric Loss Index | 0.15 | 0.15 | At 1 MHz; IEC 250 |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Melt Temperature | 265 - 290 °C | 509 - 554 °F | |
| Mold Temperature | 70.0 - 100 °C | 158 - 212 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Back Pressure | Low | |
| Holding Pressure | High | |
| Injection Speed | Medium to High | |
| Screw Speed | Medium |
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