Arlon Thermabond® 48991A010 0.010" (0.254 mm) Uncured Silicone Rubber with Fiberglass Substrate

Description: Generation IIa Thermabond® NP electrically insulating electronic adhesive. Bonds without primer.Design/Construction: Liner: PolyethyleneSide 1: Uncured Silicone RubberSubstrate: Style 1080 FiberglassSide 2: Uncured Silicone RubberLiner: Polyethylene Product Advatages: Bond Reliability – Bonds securely regardless of substrate type, shape, or texture.Hot Spot Elimination – Thermal conductivity up to 3 W/mK to transport heat away from hot spots.Thermal-Mechanical Stress Decoupling – Low modulus and high shear strength prevent adhesive delamination.Low Temperature Cure Cycle – Thermabond® cure parameters can be as low as 100°C at 100 kPa, so surface mount components can be mounted on the PCB prior to bonding.Uniform Bond Line Thickness – Precision calendering produces a uniform adhesive film.Proven Performance – Arlon Thermabond® adhesive products are the gold standard for critical, demanding electronic system applications.Product Use: Electrically insulating electronic adhesive. Bonds without primer.Appearance: Light blue colored, high viscosity gum on fiberglass with polyethylene release liners.This data represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Information provided by Arlon, Silicone Technologies Division