Polymer Property : Dielectric Strength = 14.8 kV/mm Product List

Electrical Properties

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Electrical Properties	Metric	English	Comments
Dielectric Strength	14.8 kV/mm	375 kV/in
Resinlab® EP1285HD-16 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C..
Dielectric Strength	14.8 kV/mm	375 kV/in	ASTM D149
Owens Corning Glass Fiber Reinforced Polyester (PBT), 30 wt.% glass Thermoplastic Polyesters are resistant to most organic solvents, weak acids and alkalis. They are not recommended with strong acids and alkalis or for prolonged use in hot water. Data provided by t..
Dielectric Strength	14.8 kV/mm	375 kV/in	ASTM D149
Owens Corning Glass Fiber Reinforced Polyester BMC (Injection), 22 wt.% glass Polyester thermosets are available in many formulations. They can be formulated for good to excellent resistance to acids, weak alkalis, and organic solvents. However, they are not recommended for u..
Dielectric Strength	14.8 kV/mm	375 kV/in	ASTM D149
Owens Corning Glass Fiber Reinforced Polyester SMC (Compression), 22 wt.% glass Polyester thermosets are available in many formulations. They can be formulated for good to excellent resistance to acids, weak alkalis, and organic solvents. However, they are not recommended for u..
Dielectric Strength	14.8 kV/mm	376 kV/in	ASTM D149
Quadrant EPP Semitron® MP-370 (ASTM Product Data Sheet)
Dielectric Strength	14.8 kV/mm	375 kV/in
XP Phenolic Laminate Paper based phenolic provides low cost electrical and mechanical properties. It is widely used for switchboards, panel boards, insulating washers, and intricate punched parts.Information provided b..
Dielectric Strength	14.8 kV/mm	376 kV/in	ASTM D149
Plenco 5303 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok 5303 is a two-stage, mineral and flock-filled phenolic molding compound designed for use in appliance, automotive and electrical applications. It can be molded by compression, transfer or i..
Dielectric Strength	14.8 kV/mm	375 kV/in	Short Term
Saint-Gobain RulonÂ® 125 Bearing/Seal PTFE Rulon 125 is used primarily in applications that are not severe such as dryer drum slides and piston rings in pneumatic or hydraulic controls.Information provided by distributor TriStar Plastics Cor..
Dielectric Strength	14.8 kV/mm	376 kV/in	Short Time; ASTM D149
Sumitomo Bakelite DurezÂ® 29502 Phenolic, Compression Grade Durez 29502 Brown Phenolic is a two stage, asbestos free, glass filled, special purpose molding material. It is formulated for close tolerance applications such as transmission valve bodies, and di..
Dielectric Strength	14.8 kV/mm	375 kV/in
Tra-Con Tra-Bond F211 General Purpose Fiber Optic Epoxy Adhesive TRA-BOND F211 is a general purpose fiber optic epoxy adhesive recommended for bonding and small volume potting applications where superior wetting and physical properties are needed at both high and..
Dielectric Strength	14.8 kV/mm	375 kV/in
Tra-Con Tra-Cast 3110 Low Density Epoxy Casting System TRA-CAST 3110 is a unicellular, low density, syntactic-foam epoxy resin casting system of medium viscosity that easily handles, mixes and cures at room temperature. Developed for industrial encapsul..
Dielectric Strength	14.8 kV/mm	375 kV/in
Trelleborg Emerson & Cuming Stycast® E-1030 One-Component Epoxy Low Stress Encapsulant Emerson & Cuming E-1030 Stycast® One-Component Epoxy Low Stress EncapsulantDesigned for the encapsulation of a wide range of stress sensitive electronics. They offer excellent performance at low te..
Dielectric Strength	14.8 kV/mm	375 kV/in
Tra-Con Tra-Bond 2125 Rigid Syntactic Repair Adhesive TRA-BOND 2125 is a medium viscosity, low density syntactic foam epoxy formulation developed for industrial, electronic and aerospace honeycomb, fillet, edge-fill, contour repair, bonding and casting..
Dielectric Strength	14.8 kV/mm	375 kV/in
Dow Corning FLUOROGEL® 4-8022 One-part, translucent, heat cure, UV indicator, fuel and solvent resistant.Information provided by Dow Corning
Dielectric Strength	14.8 kV/mm	375 kV/in
Cytec (Conap) FR-1046 / EA-02 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Dielectric Strength	14.8 kV/mm	375 kV/in
Cytec (Conap) FR-1046 / EA-028 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Dielectric Strength	14.8 kV/mm	375 kV/in
Cytec (Conap) FR-1046 / EA-117 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Dielectric Strength	14.8 kV/mm	375 kV/in
Cytec (Conap) FR-1046 / EA-87 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Dielectric Strength	14.8 kV/mm	375 kV/in
Cytec (Conap) RN-1210 / EA-02 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Dielectric Strength	14.8 kV/mm	375 kV/in
Cytec (Conap) RN-1210 / EA-028 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Dielectric Strength	14.8 kV/mm	375 kV/in
Cytec (Conap) RN-1210 / EA-87 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Dielectric Strength	14.8 kV/mm	375 kV/in	ASTM D149
Arlon LW5015Y##-M1 0.050" (1.27 mm) Cured Self-Fusing Silicone Tape (Triangular, Unsupported) Description: 1.5 inch wide, 50 mil thick, Yellow, Triangular cross-section, Self-Fusing Silicone Tape. Product is supplied in various roll lengths and the ## in the product number indicates roll len..
Dielectric Strength	14.8 kV/mm	375 kV/in	Short Time
Bulk Molding Compounds BMC 620X Mineral Filled, Glass Fiber Reinforced Polyester Compound BMC 620X molding compound is a mineral filled, glass fiber-reinforced polyester compound suitable for compression, transfer and stuffer injection molding. It is a high impact material produced in ex..
Dielectric Strength	14.8 kV/mm	376 kV/in	ST; ASTM D149
Sumitomo Bakelite North America FM 4017F Fiberglass and Mineral Reinforced Phenolic FM 4017F is a fiberglass and mineral reinforced phenolic molding compound, with excellent dimensional stability and good strength at elevated temperatures. Information supplied by Sumitomo Bak North..