Polymer Property : Dielectric Strength = 14.8 kV/mm Product List

Electrical Properties

Tips: 30 items are displayed at most.

Electrical Properties	Metric	English	Comments
Dielectric Strength	14.8 kV/mm	375 kV/in
Resinlab® EP1285HD-16 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C..
Dielectric Strength	14.8 kV/mm	375 kV/in	ASTM D149
Owens Corning Glass Fiber Reinforced Polyester (PBT), 30 wt.% glass Thermoplastic Polyesters are resistant to most organic solvents, weak acids and alkalis. They are not recommended with strong acids and alkalis or for prolonged use in hot water. Data provided by t..
Dielectric Strength	14.8 kV/mm	376 kV/in	Short Time; ASTM D149
Plenco 50125 PET, Pellet, Injection Molded, White  (discontinued **) PLENCO 50125 is an engineering grade glass reinforced UL flame rated polyethylene terephthalate resin designed for excellent dimensional stability. It is UL listed and available in white only.Inform..
Dielectric Strength	14.8 kV/mm	376 kV/in	ASTM D149
Plenco 5303 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound  (discontinued **) Plaslok 5303 is a two-stage, mineral and flock-filled phenolic molding compound designed for use in appliance, automotive and electrical applications. It can be molded by compression, transfer or i..
Dielectric Strength	14.8 kV/mm	375 kV/in	Short Term
Saint-Gobain RulonÂ® 125 Bearing/Seal PTFE Rulon 125 is used primarily in applications that are not severe such as dryer drum slides and piston rings in pneumatic or hydraulic controls.Information provided by distributor TriStar Plastics Cor..
Dielectric Strength	14.8 kV/mm	376 kV/in	Short Time; ASTM D149
Sumitomo Bakelite DurezÂ® 29502 Phenolic, Compression Grade Durez 29502 Brown Phenolic is a two stage, asbestos free, glass filled, special purpose molding material. It is formulated for close tolerance applications such as transmission valve bodies, and di..
Dielectric Strength	14.8 kV/mm	375 kV/in
Tra-Con Tra-Bond 2248 High Temperature Epoxy Staking Adhesive TRA-BOND 2248 is a thixotropic, high temperature cure, 100% solids epoxy resin system that provides strong, tough bonds between a wide range of materials (includes metals, glass, ceramics, and many ..
Dielectric Strength	14.8 kV/mm	375 kV/in
Tra-Con Tra-Cast 3110 Low Density Epoxy Casting System TRA-CAST 3110 is a unicellular, low density, syntactic-foam epoxy resin casting system of medium viscosity that easily handles, mixes and cures at room temperature. Developed for industrial encapsul..
Dielectric Strength	14.8 kV/mm	375 kV/in
Tra-Con Tra-Bond 2125 Rigid Syntactic Repair Adhesive TRA-BOND 2125 is a medium viscosity, low density syntactic foam epoxy formulation developed for industrial, electronic and aerospace honeycomb, fillet, edge-fill, contour repair, bonding and casting..
Dielectric Strength	14.8 kV/mm	375 kV/in
Cytec (Conap) FR-1046 / EA-02 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Dielectric Strength	14.8 kV/mm	375 kV/in
Cytec (Conap) FR-1046 / EA-028 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Dielectric Strength	14.8 kV/mm	375 kV/in
Cytec (Conap) FR-1046 / EA-87 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Dielectric Strength	14.8 kV/mm	375 kV/in
Cytec (Conap) FR-1273 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Dielectric Strength	14.8 kV/mm	375 kV/in
Cytec (Conap) RN-1210 / EA-028 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Dielectric Strength	14.8 kV/mm	375 kV/in
Cytec (Conap) RN-1210 / EA-87 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Dielectric Strength	14.8 kV/mm	375 kV/in	ASTM D149
Arlon LW5015Y##-M1 0.050" (1.27 mm) Cured Self-Fusing Silicone Tape (Triangular, Unsupported) Description: 1.5 inch wide, 50 mil thick, Yellow, Triangular cross-section, Self-Fusing Silicone Tape. Product is supplied in various roll lengths and the ## in the product number indicates roll len..
Dielectric Strength	14.8 kV/mm	375 kV/in	Short Time
Bulk Molding Compounds BMC 2270 Mineral Filled, Glass Reinforced Polyester BMC 2270 molding compound is a mineral filled, glass-fiber-reinforced polyester compound suitable for compression and transfer molding. It is a general purpose material with medium impact strength a..
Dielectric Strength	14.8 - 16.7 kV/mm	375 - 425 kV/in	short time
Bulk Molding Compounds BMC A50-XHS High Strength Grade Molding Compound BMC A50-XHS is a high strength bulk molding compound. Due to the excellent flow and controlled reactivity, BMC A50-XHS is well suited for injection, transfer or compression molding. Typical applic..
Dielectric Strength	14.8 - 37.0 kV/mm	375 - 940 kV/in	Average value: 18.0 kV/mm Grade Count:15
Overview of materials for Polyethersulfone (PES), 20% Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Polyethersulfone (PES), 20% Glass Fiber Filled". Each property range of values reported is minimum and m..
Dielectric Strength	14.8 kV/mm	376 kV/in	ASTM D149
Plaslok 5303 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound  (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5303 is a two-stage, mineral and floc..
Dielectric Strength	14.8 kV/mm	376 kV/in	ST; ASTM D149
Sumitomo Bakelite North America FM 4017F Fiberglass and Mineral Reinforced Phenolic FM 4017F is a fiberglass and mineral reinforced phenolic molding compound, with excellent dimensional stability and good strength at elevated temperatures. Information supplied by Sumitomo Bak North..
Dielectric Strength	14.8 kV/mm	376 kV/in	60Hz, Step-by-Step, wet; ASTM D149
Sumitomo Bakelite North America FS-10-VO-200-P Short-Glass Reinforced Diallyl Phthalate Short glass fiber reinforced, flame retardant, diallyl meta-phthalate molding compound with excellent heat resistance.Meets the requirements of ASTM D5948 Type SIG-F.Information provided by Vyncolit..
Dielectric Strength	14.8 kV/mm	376 kV/in	60Hz, Step-by-Step, wet; ASTM D149
Sumitomo Bakelite North America FS-5 Short-Glass Reinforced Diallyl Phthalate Short glass fiber reinforced, non-flame retardant, diallyl meta-phthalate molding compound which meets the requirements of ASTM D5948 TYPE SIG.Information provided by Vyncolit, a Sumitomo Bak Group