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Tra-Con Tra-Bond 2125 Rigid Syntactic Repair Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Filled/Reinforced Thermoset
Manufacturer Tra-Con, Inc.
Trade Name Tra-Bond
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Bond 2125 Rigid Syntactic Repair Adhesive.pdf
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Material Notes:
TRA-BOND 2125 is a medium viscosity, low density syntactic foam epoxy formulation developed for industrial, electronic and aerospace honeycomb, fillet, edge-fill, contour repair, bonding and casting applications where a light-weight, low shrinkage and low expansion material is required. This adhesive is color-coded for smooth, easy mixing and handling at room temperature, and it develops strong, highly reliable bonds to most surfaces including metals, building construction products, glass and glass fabrics and many plastics. TRA- BOND 2125 is a completely unicellular material composed of micron-sized glass spheres in a high performance epoxy binder, has a very uniform point-to-point structure and exhibits low shrinkage during cure, good dimensional stability, low density, high strength-to-weight ratio, high dielectric strength, and a low dielectric constant. The fully cured adhesive is a strong, light weight and durable electrical insulator which can be cut, drilled, sawed and shaped as needed with ordinary shop tools. In addition, TRA-BOND 2125 is resistant to water, weather, gases and vapors, salt and salt solutions, mild acids and alkalis, alcohol, jet fuels, gasoline and other petroleum products, and many other organic and inorganic compounds. Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Specific Gravity 0.800 g/cc
0.800 g/cc
Mixed
Viscosity 35000 cP

@Temperature 25.0 °C
35000 cP

@Temperature 77.0 °F
After mixing
Mechanical Properties Metric English Comments
Hardness, Shore D 75
75
Compressive Strength 89.6 MPa
13000 psi
Izod Impact, Notched 0.107 J/cm
0.200 ft-lb/in
Thermal Properties Metric English Comments
CTE, linear 22.0 µm/m-°C

@Temperature 20.0 °C
12.2 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 0.130 W/m-K
0.902 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 150 °C
302 °F
Minimum Service Temperature, Air -50.0 °C
-58.0 °F
Electrical Properties Metric English Comments
Volume Resistivity 2.40e+15 ohm-cm
2.40e+15 ohm-cm
Dielectric Constant 2.9

@Frequency 1000 Hz
2.9

@Frequency 1000 Hz
Dielectric Strength 14.8 kV/mm
375 kV/in
Dissipation Factor 0.010

@Frequency 1000 Hz
0.010

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 480 min
8.00 hour
4 hrs @ 25°C + 4 hrs @ 65°C
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Pot Life 45 min
45 min
Descriptive Properties Value Comments
Color Light Gray
Mix Ratio, parts by weight 100/9
Resin/Hardener
Outgassing, NASA Passes
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