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Tra-Con Tra-Bond 2248 High Temperature Epoxy Staking Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy
Manufacturer Tra-Con, Inc.
Trade Name Tra-Bond
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Bond 2248 High Temperature Epoxy Staking Adhesive.pdf
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Material Notes:
TRA-BOND 2248 is a thixotropic, high temperature cure, 100% solids epoxy resin system that provides strong, tough bonds between a wide range of materials (includes metals, glass, ceramics, and many plastics). This adhesive is recommended for bonding applications up to 190°C where good high and low temperature mechanical and electrical properties are required. It is an all liquid system that is easily mixed and handled and applied at room temperature although a final high-temperature cure is REQUIRED for satisfactory bonds. Fully cured TRA- BOND 2248 has excellent impact and thermal shock resistance, low permeability to gases and vapors, and outstanding resistance to water, weather, oxygen and ozone, most petroleum solvents and fuels, mild acids and alkalis, and many other organic and inorganic compounds. This system complies with specification ASTM E-595-90 for NASA outgassing acceptability. An additional post-cure of 2 hours at 125°C is recommended when application temperatures higher than 125°C are anticipated.Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Specific Gravity 1.20 g/cc
1.20 g/cc
Mixed
Water Absorption 0.0010 %
0.0010 %
After 24 hours
Viscosity 10000 cP

@Temperature 25.0 °C
10000 cP

@Temperature 77.0 °F
Mixed (sp #4, 12 rpm)
Mechanical Properties Metric English Comments
Hardness, Shore D 87
87
Tensile Strength, Yield 72.4 MPa
10500 psi
Elongation at Yield 2.0 %
2.0 %
Adhesive Bond Strength 17.9 MPa
2600 psi
Lap shear, alum to alum
Izod Impact, Notched 0.278 J/cm
0.520 ft-lb/in
Thermal Properties Metric English Comments
CTE, linear 50.0 µm/m-°C

@Temperature 20.0 °C
27.8 µin/in-°F

@Temperature 68.0 °F
Maximum Service Temperature, Air 190 °C
374 °F
Minimum Service Temperature, Air -60.0 °C
-76.0 °F
Glass Transition Temp, Tg 109 °C
228 °F
Ultimate Tg
Electrical Properties Metric English Comments
Volume Resistivity 2.50e+15 ohm-cm
2.50e+15 ohm-cm
Dielectric Constant 4.35

@Frequency 1000 Hz
4.35

@Frequency 1000 Hz
Dielectric Strength 14.8 kV/mm
375 kV/in
Dissipation Factor 0.020

@Frequency 1000 Hz
0.020

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 100 °C
1.00 hour

@Temperature 212 °F
Pot Life 120 min
120 min
Descriptive Properties Value Comments
Color Tan
Heat Distortion Temperature °C 148
Mix Ratio, parts by weight 100/19.4
Resin/Hardener
Outgassing, NASA Passes
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