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Trelleborg Emerson & Cuming Stycast® E-1030 One-Component Epoxy Low Stress Encapsulant

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced , Epoxy, Thermally Conductive
Manufacturer Trelleborg Emerson & Cuming, Inc.
Trade Name Stycast®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Trelleborg Emerson & Cuming Stycast® E-1030 One-Component Epoxy Low Stress Encapsulant.pdf
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Material Notes:
Emerson & Cuming E-1030 Stycast® One-Component Epoxy Low Stress EncapsulantDesigned for the encapsulation of a wide range of stress sensitive electronics. They offer excellent performance at low temperatures and provide protection from mechanical shock and vibration. Thermally conductive, good chemical resistance. Mix Ratio (by weight) = 100:14 Cure Type: Heat Bonding Type: Epoxy
Physical Properties Metric English Comments
Density 1.93 g/cc
0.0697 lb/in³
Viscosity 12000 cP

@Temperature 25.0 °C
12000 cP

@Temperature 77.0 °F
Mixed
Mechanical Properties Metric English Comments
Hardness, Shore A 79
79
Thermal Properties Metric English Comments
CTE, linear 159 µm/m-°C

@Temperature 20.0 °C
88.3 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 0.580 W/m-K
4.03 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 105 °C
221 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Electrical Properties Metric English Comments
Dielectric Constant 5.8

@Frequency 1e+6 Hz
5.8

@Frequency 1e+6 Hz
Dielectric Strength 14.8 kV/mm
375 kV/in
Processing Properties Metric English Comments
Cure Time >= 180 min
>= 3.00 hour
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