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Polymer Property : Cure Time = 3.00 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 120 - 180 min @Temperature 25.0 °C |
2.00 - 3.00 hour @Temperature 77.0 °F |
De-mold Time |
| Northstar Polymers MPP-A50A High Performance Polyether This high performance polyether system is one of a family of polymer systems developed by Northstar Polymers for specific demanding work environments. Urethane elastomers molded with this system ex.. |
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| Cure Time | 60.0 - 180 min @Temperature 23.0 °C |
1.00 - 3.00 hour @Temperature 73.4 °F |
M10 steel, working strength |
| Permabond HM128 Anaerobic Threadlocker Permabond® HM128 Threadlocker is a high strength adhesive for permanent assembly. It is typically used for preventing vibration loosening of bolts, studs and cap screws. Full cure to a cross-linked.. |
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| Cure Time | 60.0 - 180 min @Temperature 23.0 °C |
1.00 - 3.00 hour @Temperature 73.4 °F |
M10 steel, working strength |
| Permabond HM163 Anaerobic Retainer Permabond® HM163 is a medium viscosity, thixotropic anaerobic retaining compound that cures when confined between metal parts to form a tough bond. It has been specifically formulated to provide a .. |
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| Cure Time | 60.0 - 180 min @Temperature 25.0 °C |
1.00 - 3.00 hour @Temperature 77.0 °F |
De-mold Time |
| Northstar Polymers SAI-1 Low Viscosity Variable Ratio Polyurethane Gel SAI-1 is custom formulated polyurethane gel material to yield very soft elastomer gel material from low viscosity components at room temperature. This material is variable mixing ratio so that the .. |
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| Cure Time | 120 - 180 min @Temperature 25.0 °C |
2.00 - 3.00 hour @Temperature 77.0 °F |
Tack Free; 50% relative humidity |
| Lord Adhesives Aeroglaze® Z307 Absorptive Conductive Polyurethane Aeroglaze® Z307 black absorptive conductive polyurethane coating is primarily for application to substrates used on spacecraft. These applications include those where coatings must exhibit low ou.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP21ARHT Two component epoxy adhesive, sealant, coating and encapsulating system Product Description: Master Bond EP21ARHT is a two component epoxy resin system for high performance bonding, sealing, coating and encapsulating. It has a convenient 100 to 50 mix ratio by weight an.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP21NDFG Two component epoxy compound for high performance applications Product Description: Master Bond EP21NDFG is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, easy processing and a non-drip, paste-like consistency.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP21TDCHT-LO Room Temperature Curing, Toughened Two Component Epoxy Master Bond Polymer Adhesive EP21TDCHT-LO is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one .. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP21TDCHTND Versatile, toughened two component epoxy for bonding, sealing and coating Product Description: Master Bond EP21TDCHTND is a two component epoxy adhesive, sealant and coating featuring high performance, versatility and exceptional user friendliness. It has a very forgiving.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP30R Fiber Reinforced Two Component Epoxy Adhesive Master Bond Polymer Adhesive EP30R is a fiber reinforced, high viscosity, two component epoxy adhesive for general purpose structural bonding formulated to cure at room temperature or more rapidly a.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP41S-1HT Solvent Resistant Adhesive, Sealant and Coating Description: Master Bond EP41S-1HT is a two component epoxy resin system for high performance bonding, sealing, coating and encapsulating. It has a 100 to 30 mix ratio by weight and is formulated to.. |
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| Cure Time | 120 - 180 min @Temperature 121 - 149 °C |
2.00 - 3.00 hour @Temperature 250 - 300 °F |
|
| Master Bond EP46HT-1 Epoxy For Serviceability Up To 600°F Description: Master Bond EP46HT-1 is a two component epoxy system for high performance structural bonding and sealing suitable for applications where resistance to temperatures from -100°F to +550°.. |
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| Cure Time | 120 - 180 min @Temperature 177 - 204 °C |
2.00 - 3.00 hour @Temperature 350 - 400 °F |
Post cure (recommended for optimal properties) |
| Master Bond Ep46HT-2 Two Component, Heat Resistant Epoxy System Master Bond Polymer System EP46HT-2 is a two component epoxy system for bonding, sealing and casting applications where resistance to temperatures from -100°F to +500°F is required. It is 100% rea.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP76M Nickel Filled Electrically Conductive Epoxy System Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond Mastersil 151 Two Component Low Viscosity Silicone Compound Master Bond MasterSil 151 is a two component, low viscosity
silicone compound for high performance potting and
encapsulation. MasterSil 151 is an addition cured system and does not require exposure.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP21BAS Radiopaque Two Component Epoxy Master Bond Polymer System EP21BAS is a radiopaque epoxy compound which offers outstanding performance and superior processability. Radiopaque epoxy polymer compounds are employed for medical diagno.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP21TDC-2 Highly Flexible Cryogenic Epoxy Compound Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding, sealing, coating and encapsulation. It is formulated to cure fully at ambie.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP21TPFL-1AO Two Part, Flexible, Lower Viscosity Epoxy Polysulfide System Product Description: Master Bond EP21TPFL-1AO is a two component, low viscosity epoxy polysulfide for high performance bonding, sealing, coating and casting offering thermal conductivity, electrical.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP30LV-1 Ultra Low Viscosity, Two Part Epoxy System Description: Master Bond Polymer System EP30LV-1 is an ultra low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at .. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP30M4 Chemically Resistant Two Component Epoxy System Master Bond Polymer System EP30M4 is a two component epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weight. EP30M4 resi.. |
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| Cure Time | 120 - 180 min @Temperature 100 °C |
2.00 - 3.00 hour @Temperature 212 °F |
|
| Abatron AboCast 8103-24 High-Performance Dielectric Epoxy AboCast 8103-24 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has an exc.. |
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| Cure Time | 60.0 - 180 min @Temperature 82.222 - 98.889 °C |
1.00 - 3.00 hour @Temperature 180.00 - 210.00 °F |
|
| Abatron AboTar 8101-8 Solventless Tar-Epoxy Compound AboTar 8101-8 is a 2-part tar-epoxy variable-ratio system. It is weather- and water-proof, flexible, and acid, alkali, and fuel resistant. It can be used neat or with sand or aggregates. Uses: Resu.. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron AboWeld 8505-1 A/B Silver-Filled Electrically Conductive Epoxy Compound AboWeld 8505-1 A/B is a solventless silver-epoxy adhesive and resurfacer. It has high rigidity, chemical and heat resistance. It also has good adhesion to most rigid materials. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron 8509-2A/8509-1B Carbon-Filled Electrically Conductive Epoxy Compound 8509-2A/8509-1B is a solventless carbon-epoxy system used as an adhesive and silk-screening material with anti-static and other lower-conductivity requirements. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron 8509-4 A/B Carbon-Filled Electrically Conductive Epoxy Compound 8509-4 A/B is a solventless carbon-epoxy system used as an adhesive and silk-screening material with anti-static and other lower-conductivity requirements. |
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| Cure Time | 120 - 180 min @Temperature 100 °C |
2.00 - 3.00 hour @Temperature 212 °F |
|
| Abatron AboCast 8103-23 High-Performance Dielectric Epoxy AboCast 8103-23 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has a comb.. |
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