Master Bond EP21NDFG Two component epoxy compound for high performance applications

Product Description: Master Bond EP21NDFG is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, easy processing and a non-drip, paste-like consistency. This system has a non-critical one to one mix ratio by weight or volume. EP21NDFG has the unusual characteristic of being able to adjust the properties of the cured system by altering the mix ratio. Adding more of Part A (e.g. 2:1 mix ratio) will give a more rigid cure, while adding more of Part B (e.g. 1:2 mix ratio) gives a more forgiving cure. EP21NDFG produces high strength, durable bonds which hold up well to thermal cycling and resist many chemicals including water, oils, fuels, acids, bases and salts. It bonds well to a variety of substrates including metals, composites, glass, ceramics and many types of rubbers and plastics. Once cured, EP21NDFG is an excellent electrical insulator. It is serviceable over the wide temperature range of -60°F to +250°F. The color of both Parts A and Part B is amber, although, a wide variety of additional color choices are also available. EP21NDFG is primarily used in food equipment applications where there is an indirect exposure to food and related products. Product Advantages: Convenient mixing: non-critical one to one mix ratio by weight or volume Variable mix ratio feature allows adjusting the type of cure (mentioned above) Easily applied; adhesive spreads smoothly; non-drip application feature Ambient temperature cures or fast elevated temperature cures as required High bonding strength to a wide variety of substrates. Lower shrinkage upon cure Excellent dimensional stability with good electrical insulation properties Meets FDA Section 175.105 for indirect food applicationsInformation provided by MasterBond®