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Master Bond EP21TDCHTND Versatile, toughened two component epoxy for bonding, sealing and coating

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Master Bond Inc.
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP21TDCHTND Versatile, toughened two component epoxy for bonding, sealing and coating.pdf
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Material Notes:
Product Description: Master Bond EP21TDCHTND is a two component epoxy adhesive, sealant and coating featuring high performance, versatility and exceptional user friendliness. It has a very forgiving and convenient one to one mix ratio by weight or volume. It cures at ambient temperatures that can be accelerated by adding heat, with the optimum cure schedule being overnight at room temperature, followed by 1-2 hours at 150-200°F. This non-drip viscosity system bonds well and with minimum shrinkage to a wide variety of substrates including metals, composites, glass, ceramics and many plastics and rubbers. EP21TDCHTND combines good dimensional stability with toughness. The forgiving nature of EP21TDCHT allows it to be used for bonding dissimilar substrates that might have different coefficients of thermal expansion, conferring upon it top notch resistance to rigorous thermal cycling as well as vibration and shock. Additionally, it is a superior electrical insulator and has good chemical resistance against water, fuels and oils. Its wide service temperature range is from -100°F to +350°F. Both Parts A and B are amber in color. It can be used in aerospace, electrical, electronic, medical, specialty OEM and a wide variety of other industries as well. Product Advantages: Convenient mixing: non-critical equal weight or volume ratio User friendly, easy to apply, smooth paste along with convenient curing schedules Impressive adhesion to a wide variety of substrates Superior toughness, can withstand harsh thermal cycling while retaining dimensional stability Dependable electrical insulation values Robust temperature resistance profile from -100°F to +350°FInformation provided by MasterBond®
Mechanical Properties Metric English Comments
Hardness, Shore D >= 60
>= 60
Tensile Strength at Break >= 37.9 MPa

@Temperature 23.9 °C
>= 5500 psi

@Temperature 75.0 °F
Tensile Modulus 1.38 - 1.72 GPa

@Temperature 23.9 °C
200 - 250 ksi

@Temperature 75.0 °F
Shear Strength >= 18.6 MPa
>= 2700 psi
Al/Al, Tensile lap
Peel Strength 4.38 kN/m
25.0 pli
T-peel
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 177 °C
350 °F
Minimum Service Temperature, Air -73.3 °C
-100 °F
Electrical Properties Metric English Comments
Volume Resistivity >= 1.00e+14 ohm-cm
>= 1.00e+14 ohm-cm
Dielectric Constant 3.7

@Frequency 60.0 Hz,
Temperature 25.0 °C
3.7

@Frequency 60.0 Hz,
Temperature 77.0 °F
Processing Properties Metric English Comments
Cure Time 120 - 180 min

@Temperature 93.3 °C
2.00 - 3.00 hour

@Temperature 200 °F
720 min

@Temperature 23.9 °C
12.0 hour

@Temperature 75.0 °F
Followed by 2-3 hours at 150-200°F (Optimum Cure Schedule)
2880 - 4320 min

@Temperature 23.9 °C
48.0 - 72.0 hour

@Temperature 75.0 °F
Pot Life 90 - 120 min
90 - 120 min
100 gram mass
Shelf Life 12.0 Month

@Temperature 23.9 °C
12.0 Month

@Temperature 75.0 °F
in original unopened containers
Descriptive Properties Value Comments
Mixing Ratio (A to B) 1:1
by weight or volume
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