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Polymer Property : Cure Time = 0.500 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
Full Cure |
| Parker Chomerics CHOFORM® 5550 Conductive Form-in-Place Gasket Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |
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| Cure Time | 30.0 min @Temperature 65.0 °C |
0.500 hour @Temperature 149 °F |
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| Resin Technology Group 109-DP Oxy-Bond™ Two-Component Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
M10 steel, working strength |
| Permabond HH120 Anaerobic Threadlocker Permabond® HH120 Threadlocker is an excellent general purpose threadlocker and sealant. It is used for locking bolts, nuts and screws that require permanent assembly. Its high viscosity allows for .. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Stainless steel, handling strength |
| Permabond HM162 Anaerobic Retainer Permabond® HM162 is a medium viscosity retaining compound that cures when confined between metal parts to form an extremely tough bond. It is best suited for cylindrical parts and where high temper.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Zinc, handling strength |
| Permabond LH197 Anaerobic Gasketmaker Permabond® LH197 is an anaerobic material designed for making “formed in situ” gaskets between metal surfaces. It is highly flexible, making it ideal for dissimilar surfaces where differential th.. |
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| Cure Time | 30.0 min @Temperature 93.3 °C |
0.500 hour @Temperature 200 °F |
De-mold Time |
| Northstar Polymers MGP-D50A High Performance Polyurethane Cast Elastomer System 50D This is a PTMEG/MDI base high-performance polyurethane casting system. This system is recommended to applications in which the part requires some load-bearing, slide abrasion, constant water contac.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond HH040 Anaerobic Retainer Permabond® HH040 is a single component liquid that cures only when in contact with metal parts and oxygen is excluded. The liquid adhesive fills the “air space” between parts and upon cure unitiz.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond MM115 Anaerobic Threadlocker Permabond® MM115 Threadlocker is an excellent general purpose threadlocker and sealant. It is used for locking metal bolts, nuts and screws that may require disassembly for service and maintenance... |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Gwent Electronic Materials C2011009D1 Curable Silver Range This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive adhesive that combines good adhesion with excellent electrical properties.. |
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| Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
|
| Gwent Electronic Materials C2050106D7 Carbon Graphite Ink This Carbon Graphite Ink is designed to be used for screen printing working electrodes. This is an ink which has been optimized to give superior electrochemical performance. It gives excellent elec.. |
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| Cure Time | 30.0 min @Temperature 130 °C |
0.500 hour @Temperature 266 °F |
box oven |
| Gwent Electronic Materials C2110817D5 Conductive Silver Polymer Paste This product is a thermoplastic screen printing ink, developed for use in membrane touch switch applications as well as counter electrode in electro-chemical sensors and conductive tracks. It may b.. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
|
| Gwent Electronic Materials D2081009D6 Polymer Dielectric Transparent green colored screen printable polymer dielectric, suitable for defining electrode areas and forms a protective layer over the electrode tracking during immersion of the electrode. The .. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Tra-Con Tra-Bond 293-14 Electrically Conductive Silver-Filled Epoxy Adhesive TRA-BOND 293-14 silver-filled, electrically conductive epoxy adhesive is designed to provide strong bonds to difficult-to-bond metals, such as nickel, copper, gold and solder. The stress-absorbing c.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Tra-Con Tra-Bond 933-2 Moisture Resistant Chip Encapsulant TRA-BOND 933-2 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical.. |
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| Cure Time | 30.0 min @Temperature 100 °C |
0.500 hour @Temperature 212 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 83C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming 83C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveTwo component, silver filled, electrically conductive, epoxy adhesive. Smooth, creamy consistency. G.. |
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| Cure Time | 30.0 min @Temperature 43.0 °C |
0.500 hour @Temperature 109 °F |
Tack Free |
| Chesterton ARC BX1 Sliding Wear Compound Description: An advanced contractor grade ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Epoxyset Epoxibond EB-115 Unfilled Epoxy Adhesive A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc... |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron AboCoat 8709-3 A/B Carbon-Filled Electrically Conductive Epoxy Compound AboCoat 8709-3 A/B is a high-solid carbon-epoxy coating with various conductivity ranges widely used in silk-screening. |
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| Cure Time | 30.0 min @Temperature 75.0 °C |
0.500 hour @Temperature 167 °F |
Dry to handle, at 50% humidity and 75°C |
| Blue River Coatings Undercoat Primer BLUE RIVER COATINGS UNDERCOAT PRIMER is a high quality, single component primer, not requiring any catalyzing agent. Performance obtained is equal or superior to that of two-component, catalyzed epo.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
Tack Free Time |
| Parker Chomerics CHO-FORM 5541 Conductive Form-In-Place Gaskets Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Zinc, handling strength |
| Permabond A1042 Anaerobic Threadlocker Permabond® A1042 is a rapid curing adhesive designed to lock and seal metal parts that subsequently may need to be dismantled for maintenance. The high vibration resistance makes Permabond A1042 pa.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond MH052 Anaerobic Threadsealant Permabond® MH052 is ideal for the sealing of threaded joints. It is approved for use with natural gas and LPG for working pressure up to 20 bar (290 psi) and also for gaseous oxygen up to 10 bar (1.. |
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| Cure Time | 30.0 min @Temperature 177 °C |
0.500 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 30850S085 0.085" Uncured, Unsupported Silicone Rubber on Release Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should.. |
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| Cure Time | 30.0 min @Temperature 177 °C |
0.500 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 32400N030 0.030" (0.762 mm) Uncured Silicone Rubber on PET Carrier Design/Construction: Interleave: PolyethyleneSide 1: Uncured Silicone RubberCarrier: PET Appearance: Translucent silicone rubber on polymer linerThis data represents typical values for the productio.. |
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