Tra-Con Tra-Bond 933-2 Moisture Resistant Chip Encapsulant

Category	Polymer , Thermoset , Epoxy , Filled/Reinforced Thermoset
Manufacturer	Tra-Con, Inc.
Trade Name	Tra-Bond
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Tra-Con Tra-Bond 933-2 Moisture Resistant Chip Encapsulant.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

TRA-BOND 933-2 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical protection. TRA-BOND 933-2 encapsulant exhibits a longer work life and a lower moisture sensitivity than the anhydride-cured systems. The low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests. Information provided by Tra-Con Inc.

Physical Properties	Metric	English	Comments
Specific Gravity	2.20 g/cc	2.20 g/cc	Cured
Viscosity	50000 cP @Temperature 25.0 °C	50000 cP @Temperature 77.0 °F	Mixed (cp #51, 5 rpm)

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	92	92
Adhesive Bond Strength	17.2 MPa	2500 psi	Lap shear, alum to alum, 2 hrs @ 150°C

Thermal Properties	Metric	English	Comments
CTE, linear	30.0 µm/m-°C	16.7 µin/in-°F	Below Tg
	120 µm/m-°C	66.7 µin/in-°F	Above Tg
Maximum Service Temperature, Air	150 °C	302 °F
Minimum Service Temperature, Air	-60.0 °C	-76.0 °F
Glass Transition Temp, Tg	120 °C	248 °F	Ultimate Tg

Processing Properties	Metric	English
Cure Time	15.0 min @Temperature 170 °C	0.250 hour @Temperature 338 °F
	30.0 min @Temperature 150 °C	0.500 hour @Temperature 302 °F
	60.0 - 120 min @Temperature 125 °C	1.00 - 2.00 hour @Temperature 257 °F

Descriptive Properties	Value	Comments
Color	Black
Working Life, months	2	At 25°C

Users viewing this material also viewed the following: