Polymer Property : Cure Time = 2880 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	1440 - 2880 min @Temperature 25.0 °C	24.0 - 48.0 hour @Temperature 77.0 °F
Resinlab® EP1295 Black Medium Viscosity, Halogen Free, Flame Retardant Epoxy Casting Resin Resinlab™ EP1295 Black is a medium viscosity, halogen free, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (..
Cure Time	1440 - 2880 min @Temperature 25.0 °C	24.0 - 48.0 hour @Temperature 77.0 °F
Resinlab® EP1340 Medium Viscosity, Flame Retardant Epoxy Casting Resin System Resinlab™ EP1340 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for U..
Cure Time	1440 - 2880 min @Temperature 25.0 °C	24.0 - 48.0 hour @Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers MAP-R06C Semi Rigid Structural Foam Formulation MPP-R06C is a polyurethane foam formulation. It is closed-cell foam with a good structural integrity and an enhanced skin quality. Unlike polyurethane rigid foams, the physical properties of a cured..
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F
Master Bond EP21 Room Temperature Curing Epoxy System Room temperature curing epoxy adhesive Master Bond EP21 has outstanding physical properties and durability. Its variable mix ratio feature allows you to adjust the type of cure to get either a more ..
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F
Master Bond EP21FRSPLV Flame Resistant Two Component Epoxy Master Bond Polymer System EP21FRSPLV is a two component, room temperature curable, flame resistant compound for potting, encapsulating and casting. EP21FRSPLV has a one to one mix ratio, by weight...
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP21LV35Med Two Component, Flexible USP Class VI Epoxy System Master Bond Polymer System EP21LV3/5Med is a two part, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readil..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP21LVMed Two Component, Low Viscosity USP Class VI Epoxy Master Bond EP21LVMed is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room tempera..
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F
Master Bond EP21ND Non Drip Room Temperature Curing Epoxy System Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties. EP21ND can be mixed by weight or volume and is available in a ..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP21TDCSFL Flexible Two Component Silver Conductive Epoxy Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP30ANHT Two Part, Electrically Isolating Epoxy Adhesive Description: Master Bond Polymer System EP30ANHT is a two part epoxy system with terrific thermal conductivity, while maintaining electrical insulation. One noteworthy property is its wide service t..
Cure Time	2160 - 2880 min @Temperature 23.0 °C	36.0 - 48.0 hour @Temperature 73.4 °F
Master Bond EP30D-7 Flexibilized, Abrasion Resistant Epoxy System Master Bond Polymer System EP30D-7 is a versatile two component flexibilized, urethane-modified epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sea..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP41S-1HTND Non-Drip, High Performance Epoxy Adhesive Description: Master Bond EP41S-1HTND is a two component epoxy resin system for high performance bonding, sealing and coating. It has a 100 to 30 mix ratio by weight and its viscosity is a smooth pas..
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F
Master Bond EP75-1 Graphite Filled Electrically Conductive Epoxy System Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more ..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP79 Two Component, Silver Coated, Nickel Filled Conductive Epoxy Master Bond Polymer System EP79 is a two component, silver coated, nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or ..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond MB600G Aqueous Based Electrically Conductive Sodium Silicate Coating Master Bond MB600G is an aqueous based, sodium silicate system with graphite filler. It is intended for use in applications where moderate shielding effectiveness is required and cost is a more sign..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond MB600S Aqueous Based Sodium Silicate System for EMI/RFI Shielding Description: Master Bond MB600S is a silver containing aqueous based sodium silicate system used as a coating in situations where EMI shielding effectiveness is paramount. Electromagnetic interferen..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond Supreme 11ANHT Fast Curing Epoxy Paste System Description: Master Bond Polymer System SUPREME 11ANHT is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevat..
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F
Master Bond EP21FL Flexibilized and Toughened Low Viscosity Epoxy Master Bond Polymer System EP21FL is a lower viscosity, two component, flexibilized epoxy resin system for high performance bonding, coating, sealing and encapsulating. It is formulated to cure at r..
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F
Master Bond EP21LV Low Viscosity Two Component Epoxy Master Bond Polymer System EP21LV is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at ..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP30LV-1 Ultra Low Viscosity, Two Part Epoxy System Description: Master Bond Polymer System EP30LV-1 is an ultra low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at ..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP30QF Quartz Filled, Two Component Epoxy System Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting that is formulated to cure at room temperature or more rapidly at..
Cure Time	1440 - 2880 min @Temperature 25.0 °C	24.0 - 48.0 hour @Temperature 77.0 °F
Cytec (Conap) FR-1271 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Cure Time	1440 - 2880 min @Temperature 25.0 °C	24.0 - 48.0 hour @Temperature 77.0 °F
Cytec (Conap) FR-1274 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Cure Time	1440 - 2880 min @Temperature 25.0 °C	24.0 - 48.0 hour @Temperature 77.0 °F
Epoxyset Epoxiohm EO-30M-1 Electrically Conductive Epoxy Adhesive EO-30M-1 is a two part, semi-rigid, silver filled, epoxy adhesive. EO-30M-1 exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics.Information..
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F	Recommended Cure
Aremco Aremco-Bond™ 2200 High Performance Epoxide Glass Fiber- and Kevlar-Reinforced, Epoxy-Novolac; High Strength, Excellent Abrasion and Corrosion Resistance
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F	Alternate Cure
Aremco Aremco-Bond™ 568 High Performance Epoxide Aluminum-Filled, 1:1, Good Bond Strength and High Thermal Conductivity.
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F
Aremco Aremco-Bond™ 2318 High Performance Epoxide
Cure Time	1440 - 2880 min @Temperature 25.0 °C	24.0 - 48.0 hour @Temperature 77.0 °F
Resinlab® EP1240RC Flame Retardant Epoxy Casting Resin Resinlab™ EP1240RC is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034, Pro..